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TECHNICAL PAPERS: Gas Turbines: Ceramics

Stress Relaxation Testing as a Basis for Creep Analysis and Design of Silicon Nitride

[+] Author and Article Information
David A. Woodford

Materials Performance analysis (MPa), Inc., 1707 Garden Street, Santa Barbara, CA 93101

Andrew A. Wereszczak

High Temperature Materials Laboratory, Oak Ridge National Laboratory, Oak Ridge, TN 37831-6069

Wate T. Bakker

Electric Power Research Institute, 3412 Hillview Avenue, Palo Alto, CA 94303-1395

J. Eng. Gas Turbines Power 122(2), 206-211 (Jan 03, 2000) (6 pages) doi:10.1115/1.483196 History: Received March 09, 1999; Revised January 03, 2000
Copyright © 2000 by ASME
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References

Carroll,  D. F., Wiederhorn,  S. M., and Roberts,  D. E., 1989, “Technique for Tensile Creep Testing of Ceramics,” J. Am. Ceram. Soc., 72, No. 9, pp. 1610–1614.
Dyson, B. F., Lohr, R. D., and Norrell, R., eds., 1989, Mechanical Testing of Engineering Ceramics at High Temperatures, Elsevier Applied Science, London and New York.
Ferber,  M. K., Jenkins,  M. G., and Nolan,  T. A., 1994, “Comparison of the Creep and Creep Rupture Performance of Two HIPed Silicon Nitride Ceramics,” J. Am. Ceram. Soc., 77, pp. 657–665.
Hecht, N. L., Orenstein, R. M., Rajiyah, H., Tressler, R. E., Wiederhorn, S. S., and Woodford, D. A., 1997, “Ceramics for Gas Turbines Program,” EPRI WO3979-01.
Hart,  E. W., 1970, “Constitutive Relations for the Nonelastic Deformation of Metals,” J. Eng. Mater. Technol., 93, pp. 599–607.
Hart,  E. W., and Solomon,  H. D., 1973, “Load Relaxation Studies of Polycrystalline High Purity Aluminum,” Acta Metall., 21, pp. 295–307.
Li, C. Y., 1981, Metallurgical Treatises, J. K. Tien and G. F. Elliot, eds., TMS-AIME, pp. 469–485.
Woodford,  D. A., 1975, “Measurement of the Mechanical State of A Low Alloy Steel at Elevated Temperatures,” Metall. Trans. A, 6, p. 1693–1697.
Woodford,  D. A., 1993, “Test Methods for Accelerated Development, Design, and Life Assessment of High-Temperature Materials,” Mater. Des., 14, No. 4, pp. 231–242.
Grwzwinski,  G. G., and Woodford,  D. A., 1995, “Creep Analysis of Thermoplastics Using Stress Relaxation Data,” Polym. Eng. Sci., 35, No. (24), pp. 1931–1937.
Woodford,  D. A., VanSteele,  D. R., and Hyder,  M. J., 1991, “Stress Relaxation of Alumina at High Temperature,” J. Am. Ceram. Soc., 74, No. 12, pp. 3142–3144.
Wereszczak,  A. A., Ferber,  M. F., Kirkland,  T. P., and Lara-Curzio,  E., 1995, “Stress Relaxation of Silicon Nitride at Elevated Temperature,” Ceram. Eng. Sci. Proc., 16, pp. 1–10.
Woodford,  D. A., 1998, “Stress Relaxation, Creep Recovery, and Newtonian Viscous Flow in Silicon Nitride,” J. Am. Ceram. Soc., 81, No. 9, pp. 2327–2332.
Woodford,  D. A., 1996, “Creep Design Analysis of Silicon Nitride Using Stress Relaxation Data,” Mater. Des., 17, No. 7, pp. 127–132.
Crawford, R. J., 1987, Plastics Engineering, Pergamon Press, New York.

Figures

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Stress-strain for specimen #1 1200°C
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Stress-strain for specimen #4 at 1350°C
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Stress relaxation in specimen #1 at 1200°C
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Stress versus creep rate at 1200°C for specimen #1
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Stress versus creep rate at 1350°C for specimen #4
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Specimens 5 and 1 relaxed from 300 MPa and 1200°C
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Specimens 6, 4, and 8 relaxed from 200 MPa and 1350°C
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Effect of test sequence in specimens 7 and 8
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Effect of thermal exposure on relaxation from 300 MPa and 350 MPa in specimens 1, 9, 10, and 11
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Comparison data at 1200°C from 300 MPa
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Comparison data at 1300°C from 200 MPa
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Comparison with creep data at 1300°C
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Anelastic contraction at 1300°C
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Pseudo stress strain curves for specimen #4 at 1350°C
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Secant modulus for #4 at 1350°C
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Secant modulus curves for all temperatures

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