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Proceedings Papers

Diffusion Bonded Compact Heat Exchanger in Inconel 740H for High Temperature and High-Pressure Applications

Zhijun Jia, Thomas Parlow, Dane Kuhr, Mark Anderson, Brian Baker
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T10A004, July 11–13, 2022
Paper No: HT2022-81837
DOI: https://doi.org/10.1115/HT2022-81837
View Paper titled, Diffusion Bonded Compact Heat Exchanger in Inconel 740H for High Temperature and High-Pressure Applications
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Topics: Diffusion (Physics), Heat exchangers, High pressure (Physics), High temperature, Bonding, Alloys, Design, Diffusion bonding (Metals), Etching, Fluids
Proceedings Papers

Molecular Dynamics Simulation on Diffusion Welding Between Cu and Al Under Different Pressures and Roughnesses

Xiong-hui Li, Wen-xiao Chu, Ting Ma, Qiu-wang Wang
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T13A004, July 10–14, 2016
Paper No: HT2016-7380
DOI: https://doi.org/10.1115/HT2016-7380
View Paper titled, Molecular Dynamics Simulation on Diffusion Welding Between Cu and Al Under Different Pressures and Roughnesses
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Topics: Diffusion bonding (Metals), Molecular dynamics simulation, Diffusion (Physics), Welding, Diffusion processes, Metals, Pressure, Surface roughness, Aerospace industry, Ceramics
Proceedings Papers

Cryogenic Single-Phase Heat Transfer in a Microscale Pin Fin Heat Sink

Eric D. Truong, Erfan Rasouli, Vinod Narayanan
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A019, July 14–19, 2013
Paper No: HT2013-17660
DOI: https://doi.org/10.1115/HT2013-17660
View Paper titled, Cryogenic Single-Phase Heat Transfer in a Microscale Pin Fin Heat Sink
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Topics: Heat sinks, Heat transfer, Microscale devices, Flow (Dynamics), Computational fluid dynamics, Engineering simulation, Heat transfer coefficients, Pressure drop, Simulation, Chemical etching
Proceedings Papers

Flow Boiling Enhancement in Microchannels With Diffusion Bonded Wire Mesh

Hailei Wang, Richard Peterson
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 97-106, July 8–12, 2007
Paper No: HT2007-32119
DOI: https://doi.org/10.1115/HT2007-32119
View Paper titled, Flow Boiling Enhancement in Microchannels With Diffusion Bonded Wire Mesh
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Topics: Boiling, Diffusion (Physics), Flow (Dynamics), Microchannels, Wire mesh, Vapors, Critical heat flux, Nucleate boiling, Computer cooling, Diffusion bonding (Metals)