1-10 of 10
Etching
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Diffusion Bonded Compact Heat Exchanger in Inconel 740H for High Temperature and High-Pressure Applications

Zhijun Jia, Thomas Parlow, Dane Kuhr, Mark Anderson, Brian Baker
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T10A004, July 11–13, 2022
Paper No: HT2022-81837
DOI: https://doi.org/10.1115/HT2022-81837
View Paper titled, Diffusion Bonded Compact Heat Exchanger in Inconel 740H for High Temperature and High-Pressure Applications
Click here to open pdf in another window PDF for Diffusion Bonded Compact Heat Exchanger in Inconel 740H for High Temperature and High-Pressure Applications
Topics: Diffusion (Physics), Heat exchangers, High pressure (Physics), High temperature, Bonding, Alloys, Design, Diffusion bonding (Metals), Etching, Fluids
Proceedings Papers

An Investigation of Scale Variation in Multi-Layer Mini- and Micro-Channel Heat Sinks in Single Phase Flow Using a Two Equation Porous Media Model

Bryan Hassell, Alfonso Ortega
Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 873-881, July 19–23, 2009
Paper No: HT2009-88423
DOI: https://doi.org/10.1115/HT2009-88423
View Paper titled, An Investigation of Scale Variation in Multi-Layer Mini- and Micro-Channel Heat Sinks in Single Phase Flow Using a Two Equation Porous Media Model
Click here to open pdf in another window PDF for An Investigation of Scale Variation in Multi-Layer Mini- and Micro-Channel Heat Sinks in Single Phase Flow Using a Two Equation Porous Media Model
Topics: Flow (Dynamics), Heat sinks, Microchannels, Porous materials, Cutting, Etching, Flux (Metallurgy), Heat, Modeling, Pressure drop
Proceedings Papers

Cryogenic Heat Exchanger With Photo-Etched Mini-Perforated Plates Allowing Flow-Bypass

Jeheon Jung, Sangkwon Jeong
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 503-508, July 8–12, 2007
Paper No: HT2007-32607
DOI: https://doi.org/10.1115/HT2007-32607
View Paper titled, Cryogenic Heat Exchanger With Photo-Etched Mini-Perforated Plates Allowing Flow-Bypass
Click here to open pdf in another window PDF for Cryogenic Heat Exchanger With Photo-Etched Mini-Perforated Plates Allowing Flow-Bypass
Topics: Flow (Dynamics), Heat exchangers, Plates (structures), Heat conduction, Heat transfer, Stainless steel, Temperature, Channels (Hydraulic engineering), Convection, Copper
Proceedings Papers

Electron and Focused Ion Beams in Thermal Science and Engineering

Tae-Youl Choi, Dimos Poulikakos
Proc. ASME. HT2008, Heat Transfer: Volume 1, 665-669, August 10–14, 2008
Paper No: HT2008-56097
DOI: https://doi.org/10.1115/HT2008-56097
View Paper titled, Electron and Focused Ion Beams in Thermal Science and Engineering
Click here to open pdf in another window PDF for Electron and Focused Ion Beams in Thermal Science and Engineering
Topics: Electrons, Focused ion beams, Cathode ray oscilloscopes, Electron beams, Etching, Boiling, Carbon nanotubes, Ions, Nanolithography, Nanoscale phenomena
Proceedings Papers

Computational Study of Reactive Flow in Halide Chemical Vapor Deposition of Silicon Carbide Epitaxial Film

Rong Wang, Ronghui Ma
Proc. ASME. HT2008, Heat Transfer: Volume 3, 207-213, August 10–14, 2008
Paper No: HT2008-56313
DOI: https://doi.org/10.1115/HT2008-56313
View Paper titled, Computational Study of Reactive Flow in Halide Chemical Vapor Deposition of Silicon Carbide Epitaxial Film
Click here to open pdf in another window PDF for Computational Study of Reactive Flow in Halide Chemical Vapor Deposition of Silicon Carbide Epitaxial Film
Topics: Chemical vapor deposition, Chemically reactive flow, Silicon, Temperature, Chemical reactions, Computer simulation, Design, Electromagnetic induction, Engineering simulation, Etching
Proceedings Papers

High Performance Thin Film Transistors (TFTs) of Polycrystalline Silicon Crystallized by the Double Laser Crystallization (DLC) Technique

Li Xu, Costas P. Grigoropoulos
Proc. ASME. HT2005, Heat Transfer: Volume 3, 271-276, July 17–22, 2005
Paper No: HT2005-72223
DOI: https://doi.org/10.1115/HT2005-72223
View Paper titled, High Performance Thin Film Transistors (TFTs) of Polycrystalline Silicon Crystallized by the Double Laser Crystallization (DLC) Technique
Click here to open pdf in another window PDF for High Performance Thin Film Transistors (TFTs) of Polycrystalline Silicon Crystallized by the Double Laser Crystallization (DLC) Technique
Topics: Crystallization, Lasers, Polysilicon, Thin film transistors, Crystal growth, Etching, Grain size, Mechanical admittance, Melting, Scanning electron microscopes
Proceedings Papers

Feature Evolution During Sub 100NM Gap-Fill and Etch

Hemant Mungekar, Young S. Lee, Shankar Venkataraman
Proc. ASME. HT2005, Heat Transfer: Volume 3, 221-224, July 17–22, 2005
Paper No: HT2005-72326
DOI: https://doi.org/10.1115/HT2005-72326
View Paper titled, Feature Evolution During Sub 100NM Gap-Fill and Etch
Click here to open pdf in another window PDF for Feature Evolution During Sub 100NM Gap-Fill and Etch
Topics: Etching, Pressure, Plasmas (Ionized gases), Design, Electric fields, Electronics, Integrated circuit fabrication, Ions, Plasma density, Process design
Proceedings Papers

Modeling and Simulation of Physical Vapor Deposition/Etching Plasmas

Umesh Kelkar, Arvind Sundarrajan, Tza-Jing Gung, Ned Hammond, Ajay Bhatnagar, Xinyu Fu, Mark Perrin, John Forster, Prabu Gopalraja, Jianming Fu
Proc. ASME. HT2005, Heat Transfer: Volume 3, 225-227, July 17–22, 2005
Paper No: HT2005-72338
DOI: https://doi.org/10.1115/HT2005-72338
View Paper titled, Modeling and Simulation of Physical Vapor Deposition/Etching Plasmas
Click here to open pdf in another window PDF for Modeling and Simulation of Physical Vapor Deposition/Etching Plasmas
Topics: Etching, Modeling, Plasmas (Ionized gases), Simulation, Vapor deposition, Flux (Metallurgy), Magnetic fields, Particulate matter, Semiconductor wafers, Simulation results
Proceedings Papers

Fluid Flow and Heat Transfer in a Composite Trapezoidal Microchannel

Muhammad M. Rahman, Shantanu S. Shevade
Proc. ASME. HT2005, Heat Transfer: Volume 1, 411-417, July 17–22, 2005
Paper No: HT2005-72407
DOI: https://doi.org/10.1115/HT2005-72407
View Paper titled, Fluid Flow and Heat Transfer in a Composite Trapezoidal Microchannel
Click here to open pdf in another window PDF for Fluid Flow and Heat Transfer in a Composite Trapezoidal Microchannel
Topics: Composite materials, Fluid dynamics, Heat transfer, Microchannels, Gadolinium, Fluids, Heat, Heat exchangers, Heat transfer coefficients, Magnetic fields
Proceedings Papers

Experimental Determination of the Relationship Between Thermal Boundary Resistance and Non-Abrupt Interfaces and Electron-Phonon Coupling

Robert J. Stevens, Pamela M. Norris, Arthur W. Lichtenberger
Proc. ASME. HT-FED2004, Volume 4, 503-504, July 11–15, 2004
Paper No: HT-FED2004-56556
DOI: https://doi.org/10.1115/HT-FED2004-56556
View Paper titled, Experimental Determination of the Relationship Between Thermal Boundary Resistance and Non-Abrupt Interfaces and Electron-Phonon Coupling
Click here to open pdf in another window PDF for Experimental Determination of the Relationship Between Thermal Boundary Resistance and Non-Abrupt Interfaces and Electron-Phonon Coupling
Topics: Electrons, Interfacial thermal resistance, Phonons, Temperature, Electron scattering, Acoustics, Diamonds, Electrical conductance, Electromagnetic scattering, Metals