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Keywords: electronic cooling
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Proceedings Papers

Publisher: American Society of Mechanical Engineers
Proc. ASME. HT2023, ASME 2023 Heat Transfer Summer Conference, V001T07A001, July 10–12, 2023
Paper No: HT2023-105745
... critical carbon dioxide is a good candidate for heat removal in components generating high heat fluxes especially electronic components. Keywords: Thermal management, Boiling heat transfer, Two-phase flow, Micro flow, Joule-Thomson effect, Active cooling, Electronic cooling NOMENCLATURE P Pressure (psi...
Proceedings Papers

Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T12A001, July 11–13, 2022
Paper No: HT2022-80024
... bodies. heat sink pin fin electronic cooling convection heat transfer slotted fin perforated fin Proceedings of the ASME 2022 Heat Transfer Summer Conference HT2022 July 11-13, 2022, Philadelphia, Pennsylvania HT2022-80024 THERMAL FLUID ASSESMENT OF BLUFF VERSUS STREAMLINED BODIES...
Proceedings Papers

Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 513-522, July 8–12, 2012
Paper No: HT2012-58474
... temperatures and pressures and the individual heat input to each evaporator determines the evaporator temperatures. Setting up the evaporators in parallel allows for more cooling than series. boiling multi evaporators capillary pumping mechanical pumping electronic cooling 1 EXPERIMENTAL ANALYSIS...
Proceedings Papers

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 671-679, July 8–12, 2007
Paper No: HT2007-32754
... 07 04 2009 The decreasing physical size of microchips accompanied by the increasing heat flux to be dissipated has led to the study of possible new innovative electronic cooling methods. Jet cooling has been successfully implemented in a variety of industrial applications and its...
Proceedings Papers

Proc. ASME. HT2005, Heat Transfer: Volume 2, 53-62, July 17–22, 2005
Paper No: HT2005-72204
... temperatures, which is necessary for electronics cooling applications, often limiting the maximum temperature to 85°C for silicon devices. Past studies have also shown that using boiling enhancement structures improve heat transfer by lowering the incipience overshoot, increasing heat flux and reducing...
Proceedings Papers

Proc. ASME. HT2005, Heat Transfer: Volume 1, 617-626, July 17–22, 2005
Paper No: HT2005-72526
... the cavity and a vortex structure is adjacent to the unheated vertical plate. At higher Reynolds number the vortex structure has a larger extension at same L/D value. Mixed Convection Open Cavity Electronic Cooling Experimental Investigation Proceedings of HT2005 2005 ASME Summer Heat Transfer...
Proceedings Papers

Proc. ASME. HT-FED2004, Volume 1, 133-141, July 11–15, 2004
Paper No: HT-FED2004-56133
... Martin d'Heres Cedex, France Keywords: Constructal theory, Electronic cooling, natural convection, forced convection, maximal heat transfer density, Proceedings of HT-FED04 E Heat Transfer/Fluids Engineering Summer Conference July 11-15, 2004, Charlotte, North Carolina USA HT-FED04-56133 R Residual...
Proceedings Papers

Proc. ASME. HT2003, Heat Transfer: Volume 3, 397-410, July 21–23, 2003
Paper No: HT2003-47050
... and gas flows, smooth liquid-gas interface, and strong entrainment and deposition effects are incorporated into the model. The model shows good agreement with experimental data for water-cooled heat sinks. micro-channel heat sink adiabatic two-phase flow flow boiling electronic cooling...