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Proceedings Papers

Direct Observations of the Chip-Tool Interface in Machining

V. Madhavan, S. Chandrasekar, T. N. Farris

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 45-52, November 16–21, 1997

Paper No: IMECE1997-1134

DOI: https://doi.org/10.1115/IMECE1997-1134

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Topics: Aluminum, Carbide cutting tools, Copper, Cutting, Glass, Machining, Metal cutting, Metals, Optical microscopy, Sapphire

Proceedings Papers

Dynamic Indentation Hardness of Metals and its Implications to High Speed Machining

Ghatu Subhash, Brian J. Koeppel, Abhijit Chandra, Yonggang Y. Huang

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 69-74, November 16–21, 1997

Paper No: IMECE1997-1137

DOI: https://doi.org/10.1115/IMECE1997-1137

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Topics: High speed machining, Metals, Crystal structure, Hardness testers

Proceedings Papers

Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters

A. Shirani, K. M. Liechti, F. J. Boerio

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 131-133, November 16–21, 1997

Paper No: IMECE1997-1238

DOI: https://doi.org/10.1115/IMECE1997-1238

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Topics: Fracture (Materials), Fracture (Process), Metals, Adhesives, Aluminum, Modeling

Proceedings Papers

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 1 — Study of Contact Area

Chang J. Park, Deborah A. Kaminski

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 89-97, November 16–21, 1997

Paper No: IMECE1997-1218

DOI: https://doi.org/10.1115/IMECE1997-1218

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Topics: Bolted joints, Contact resistance, Plates (structures), Separation (Technology), Calibration, Equations, Finishes, Finite element methods, Materials properties, Metals

Proceedings Papers

Gel Compression Considerations for Chromatography Scale-Up for Protein C Purification

Weiwei He, Duane F. Bruley, William N. Drohan

Proc. ASME. IMECE97, Advances in Bioengineering, 71-72, November 16–21, 1997

Paper No: IMECE1997-0233

DOI: https://doi.org/10.1115/IMECE1997-0233

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Topics: Compression, Proteins, Collapse, Liver, Materials properties, Metals, Risk, Separation (Technology), Thrombosis

Proceedings Papers

Degradation of Poly(L-Lactic Acid) Monofilaments for Experimental Intravascular Stent Designs

Kevin D. Nelson, Anagha R. Phansalkar, Andres A. Romero, Yun-Wei Ye, Robert C. Eberhart, Charles Landau, Robert S. Meidell

Proc. ASME. IMECE97, Advances in Bioengineering, 333-334, November 16–21, 1997

Paper No: IMECE1997-0364

DOI: https://doi.org/10.1115/IMECE1997-0364

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Topics: Stents, Metals, Stress, Biological tissues, Coronary arteries, Corrosion, Damage, Metal fatigue

Proceedings Papers

Carbon Based Prosthetic Devices

D. Devlin, D. Carroll, R. Barbero, J. Klawitter, P. Strzepa, W. Ogilive

Proc. ASME. IMECE97, Advances in Bioengineering, 265, November 16–21, 1997

Paper No: IMECE1997-0330

DOI: https://doi.org/10.1115/IMECE1997-0330

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Topics: Carbon, Prostheses, Bone, Service life (Equipment), Arthroplasty, Artificial joints, Biomaterials, Biomedicine, Carbon composites, Cements (Adhesives)

Proceedings Papers

Friction Properties at Polyethylene-Metal Interface in Total Joint Arthroplasty

A. Hashemi, M. Dammak, A. Shirazi-Adl, D. J. Zukor

Proc. ASME. IMECE97, Advances in Bioengineering, 315-316, November 16–21, 1997

Paper No: IMECE1997-0355

DOI: https://doi.org/10.1115/IMECE1997-0355

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Topics: Arthroplasty, Friction, Metals, Wear, Artificial joints, Bearings, Bone, Damage, Fracture toughness, Molecular weight

Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997

Paper No: IMECE1997-0503

DOI: https://doi.org/10.1115/IMECE1997-0503

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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry

Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997

Paper No: IMECE1997-0508

DOI: https://doi.org/10.1115/IMECE1997-0508

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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination

Proceedings Papers

A New Approach to Calculate Atomic Flux Divergence by Electromigration

Kazuhiko Sasagawa, Naoaki Nakamura, Masumi Saka, Hiroyuki Abé

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 145-152, November 16–21, 1997

Paper No: IMECE1997-0510

DOI: https://doi.org/10.1115/IMECE1997-0510

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Topics: Electrodiffusion, Current density, Temperature, Corners (Structural elements), Metals, Modeling

Proceedings Papers

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

J. M. Snodgrass, S.-Y. Kook, A. Kirtikar, R. H. Dauskardt

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 33-39, November 16–21, 1997

Paper No: IMECE1997-0497

DOI: https://doi.org/10.1115/IMECE1997-0497

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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics

Proceedings Papers

Behavior of Tensile Preloaded Composites Subjected to Low-Velocity Impact Loads

Ajit D. Kelkar, J. Sankar, C. Grace, Roger J. Aschenbrenner, Gregory Schoeppner

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 39-46, November 16–21, 1997

Paper No: IMECE1997-0521

DOI: https://doi.org/10.1115/IMECE1997-0521

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Topics: Composite materials, Stress, Laminates, Damage, Aircraft, Fiber reinforced composites, Graphite, Weight (Mass), Damage mechanics, Deformation

Proceedings Papers

Failure Mechanism of Metallization Layer of a Multichip Module Substrate

Mansur Rastani

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 469-475, November 16–21, 1997

Paper No: IMECE1997-0703

DOI: https://doi.org/10.1115/IMECE1997-0703

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Topics: Failure mechanisms, Multi-chip modules, Silicon, Temperature, Aluminum, Failure, Fatigue, Fatigue life, Finite element analysis, Metals

Proceedings Papers

Numerical Simulation of Heat Transfer During Thermoforming

C. H. Wang, H. F. Nied

Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 67-82, November 16–21, 1997

Paper No: IMECE1997-0620

DOI: https://doi.org/10.1115/IMECE1997-0620

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Topics: Computer simulation, Heat transfer, Polymers, Cooling, Temperature, Glass transition, Heat, Heating, Metal surfaces, Metals

Proceedings Papers

A Damage Mechanics Based Approach to Durability Assessment of Composite Materials

Ramesh Talreja

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 151-156, November 16–21, 1997

Paper No: IMECE1997-0659

DOI: https://doi.org/10.1115/IMECE1997-0659

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Topics: Composite materials, Damage mechanics, Durability, Creep, Damage, Fatigue life, Geometry, Metals, Testing

Proceedings Papers

Test Methods and Accelerated Testing for Life Prediction of Composite Systems

Kenneth L. Reifsnider

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 213-221, November 16–21, 1997

Paper No: IMECE1997-0667

DOI: https://doi.org/10.1115/IMECE1997-0667

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Topics: Composite materials, Testing, Constants (Physics), Damage, Durability, Stress, Creep, Fatigue, Fracture (Materials), Fracture (Process)

Proceedings Papers

Design Criteria for Sandwich Panels for Building Construction

J. Michael Davies

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 273-284, November 16–21, 1997

Paper No: IMECE1997-0729

DOI: https://doi.org/10.1115/IMECE1997-0729

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Topics: Construction, Design, Cladding systems (Building), Durability, Fire, Metals, Roofs, Structural design

Proceedings Papers

Industrial Applications of Spray Technology

Norman Chigier

Proc. ASME. IMECE97, Fluids Engineering, 227-234, November 16–21, 1997

Paper No: IMECE1997-0776

DOI: https://doi.org/10.1115/IMECE1997-0776

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Topics: Sprays, Lung, Aircraft, Coatings, Particle size, Porosity, Agglomeration (Materials), Automobiles, Automotive engines, Biomedicine

Proceedings Papers

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

M. Uschitsky, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 33-54, November 16–21, 1997

Paper No: IMECE1997-0813

DOI: https://doi.org/10.1115/IMECE1997-0813

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Topics: Epoxy adhesives, Epoxy resins, Glass fibers, Stress, Fibers, Buckling, Delamination, Design, Metals, Optical fiber

2 3 4 5

NARROW

Direct Observations of the Chip-Tool Interface in Machining

Dynamic Indentation Hardness of Metals and its Implications to High Speed Machining

Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 1 — Study of Contact Area

Gel Compression Considerations for Chromatography Scale-Up for Protein C Purification

Degradation of Poly(L-Lactic Acid) Monofilaments for Experimental Intravascular Stent Designs

Carbon Based Prosthetic Devices

Friction Properties at Polyethylene-Metal Interface in Total Joint Arthroplasty

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

A New Approach to Calculate Atomic Flux Divergence by Electromigration

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

Behavior of Tensile Preloaded Composites Subjected to Low-Velocity Impact Loads

Failure Mechanism of Metallization Layer of a Multichip Module Substrate

Numerical Simulation of Heat Transfer During Thermoforming

A Damage Mechanics Based Approach to Durability Assessment of Composite Materials

Test Methods and Accelerated Testing for Life Prediction of Composite Systems

Design Criteria for Sandwich Panels for Building Construction

Industrial Applications of Spray Technology

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

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