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Proceedings Papers

Contact Angle Measurement Through Atomic Force Microscopy

Jiapeng Yu, Hao Wang

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 613-617, November 11–17, 2011

Paper No: IMECE2011-64357

DOI: https://doi.org/10.1115/IMECE2011-64357

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Topics: Atomic force microscopy, Thin films

Proceedings Papers

Superhydrophobic Surfaces Properties for Anti-Icing

Mohammad Amin Sarshar, Christopher Swarctz, Scott Hunter, John Simpson, Chang-Hwan Choi

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 499-502, November 11–17, 2011

Paper No: IMECE2011-63282

DOI: https://doi.org/10.1115/IMECE2011-63282

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Topics: Air flow, Aluminum, Coatings, Delays, Design, Drops, Flow (Dynamics), Ice, Low temperature, Particulate matter

Proceedings Papers

Transient Vapor Compression Refrigeration Cycle for Electronics Cooling: Part 1—Distributed Model Validation

TieJun Zhang, Juan Catano, John T. Wen, Michael K. Jensen

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 717-724, November 11–17, 2011

Paper No: IMECE2011-62455

DOI: https://doi.org/10.1115/IMECE2011-62455

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Topics: Compression, Computer cooling, Model validation, Refrigeration cycles, Transients (Dynamics), Vapors, Cooling, Cooling systems, Electronics, Energy efficient electronic systems

Proceedings Papers

Experimental Study on the Thermal Boundary Resistance Between an Individual Carbon Nanotube End and a Au Surface

Jun Hirotani, Tatsuya Ikuta, Takashi Nishiyama, Koji Takahashi

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 301-302, November 11–17, 2011

Paper No: IMECE2011-62844

DOI: https://doi.org/10.1115/IMECE2011-62844

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Topics: Carbon nanotubes, Interfacial thermal resistance, Molecular dynamics, Thermal conductivity

Proceedings Papers

Thermal Conductivity of Ordered Mesoporous Silicon Thin Films Made From Magnesium Reduction of Polymer Templated Silica

Jin Fang, Laurent Pilon, Chris B. Kang, Sarah H. Tolbert

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 1245-1247, November 11–17, 2011

Paper No: IMECE2011-64784

DOI: https://doi.org/10.1115/IMECE2011-64784

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Topics: Magnesium (Metal), Polymers, Silicon, Thermal conductivity, Thin films, Film thickness, Electromagnetic scattering, Evaporation, Imaging, Porosity

Proceedings Papers

Molecular Dynamics Modeling of Thermal Conductance at Atomically Clean and Disordered Silicon/Aluminum Interfaces

Woon Ih Choi, Kwiseon Kim, Sreekant Narumanchi

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 397-404, November 11–17, 2011

Paper No: IMECE2011-65409

DOI: https://doi.org/10.1115/IMECE2011-65409

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Topics: Aluminum, Modeling, Molecular dynamics, Silicon, Thermal conductivity, Phonons, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Electrical conductance

Proceedings Papers

A Numerical and Experimental Investigation of a Gas Propelled Liquid Droplet Impinging Onto a Heated Surface

Andres Diaz, Alfonso Ortega

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 187-196, November 11–17, 2011

Paper No: IMECE2011-62268

DOI: https://doi.org/10.1115/IMECE2011-62268

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Topics: Drops, Sprays, Cooling, Pressure, Deformation, Heat, Kinetic energy, Vapors, Air jets, Cooling systems

Proceedings Papers

Heat Pulse Propagation in Pure Sodium Fluoride at Low Temperatures From Ballistic to Diffusive Conduction

Yanbao Ma

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 1121-1127, November 11–17, 2011

Paper No: IMECE2011-64284

DOI: https://doi.org/10.1115/IMECE2011-64284

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Topics: Crystals, Heat, Heat conduction, Longitudinal waves, Low temperature, Phonons, Second sound, Sodium, Waves

Proceedings Papers

FINLESS Heat Sinks, High Performance and Low Cost for Low Profile Cooling Applications

Ed Walsh, Ronan Grimes, Patrick Walsh, Jason Stafford

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 1-9, November 11–17, 2011

Paper No: IMECE2011-62012

DOI: https://doi.org/10.1115/IMECE2011-62012

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Topics: Boundary layers, Cooling, Design, Electronics, Flow (Dynamics), Heat sinks, Heat transfer, Heat transfer coefficients, Imaging, Laminar flow

Proceedings Papers

Separate Parameters Identification of the Miso Time Delay Model Applied to the Heat Transfer Process

G. V. Simeunovic´, P. Zi´tek, T. Vyhli´dal, D. Lj. Debeljkovic´

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 851-856, November 11–17, 2011

Paper No: IMECE2011-63831

DOI: https://doi.org/10.1115/IMECE2011-63831

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Topics: Delays, Heat transfer, Algorithms, Heat exchangers, Parameter estimation, Time delay systems

Proceedings Papers

Investigation of Lightweight Space Radiator Design for Low and No Gravity Environments

Virginia Bieger, Jian Ma

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 1129-1138, November 11–17, 2011

Paper No: IMECE2011-64646

DOI: https://doi.org/10.1115/IMECE2011-64646

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Topics: Design, Gravity (Force), Fluids, Heat pipes, Building materials, Carbon composites, Construction, Fins, Heat transfer, Optimization

Proceedings Papers

Near-Wall Focusing of Phase Change Micro-Particles for Local Heat Transfer Enhancement

Andrej Lenert, Youngsuk Nam, Matthew W. Thoms, Bekir S. Yilbas, Evelyn N. Wang

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 619-626, November 11–17, 2011

Paper No: IMECE2011-64517

DOI: https://doi.org/10.1115/IMECE2011-64517

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Topics: Heat transfer, Microparticles, Particulate matter, Heat flux, Melting, Computer simulation, Fluids, Geometry, Heat capacity, Laminar flow

Proceedings Papers

Effects of UV-Visible Irradiation on Pool Boiling Behavior of Copper

Chad N. Hunter, Nicholas R. Glavin, Andrey A. Voevodin, David B. Turner, Michael H. Check, Shawn A. Putnam, Timothy S. Fisher

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 503-510, November 11–17, 2011

Paper No: IMECE2011-63460

DOI: https://doi.org/10.1115/IMECE2011-63460

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Topics: Copper, Irradiation (Radiation exposure), Pool boiling, Ultraviolet radiation, Critical heat flux, Light sources, Boiling, Heat flux, Nanoscale phenomena, Nucleate boiling

Proceedings Papers

Mechanism of Thermal Conductivity Reduction From Suspended to Supported Graphene: A Quantitative Spectral Analysis of Phonon Scattering

Bo Qiu, Xiulin Ruan

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 303-313, November 11–17, 2011

Paper No: IMECE2011-62963

DOI: https://doi.org/10.1115/IMECE2011-62963

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Topics: Electromagnetic scattering, Emission spectroscopy, Graphene, Phonons, Radiation scattering, Scattering (Physics), Spectroscopy, Thermal conductivity, Temperature, Acoustics

Proceedings Papers

Numerical Modelling of the Effective Thermal Conductivities of Composite Materials

Zhi Zhu He, Jing Liu

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 1249-1251, November 11–17, 2011

Paper No: IMECE2011-65746

DOI: https://doi.org/10.1115/IMECE2011-65746

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Topics: Biological tissues, Composite materials, Fluids, Heat conduction, Heat transfer, Modeling, Nanocomposites, Nanoparticles, Shapes, Temperature effects

Proceedings Papers

Transient Vapor Compression Refrigeration Cycle for Electronics Cooling: Part 2—Multi-Evaporator Dynamics and Control

TieJun Zhang, John T. Wen, Michael K. Jensen

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 725-734, November 11–17, 2011

Paper No: IMECE2011-62456

DOI: https://doi.org/10.1115/IMECE2011-62456

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Topics: Compression, Computer cooling, Dynamics (Mechanics), Refrigeration cycles, Transients (Dynamics), Vapors, Heat, Cooling, Electronic systems, Electronics

Proceedings Papers

Performance Analysis of a Countercurrent Flow Heat Exchanger Placed on the Truck Compartment Roof

Wamei Lin, Jinliang Yuan, Bengt Sunde´n

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 19-25, November 11–17, 2011

Paper No: IMECE2011-62520

DOI: https://doi.org/10.1115/IMECE2011-62520

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Topics: Flow (Dynamics), Heat exchangers, Roofs, Trucks, Vehicles, Computational fluid dynamics, Cross-flow, Computer software, Cooling, Fins

Proceedings Papers

Tip-Sample Heat Transfer in Non-Contact Mode Scanning Thermal Microscopy With Wollaston Microprobes

Yanliang Zhang, Liang Han, Theodorian Borca-Tasciuc

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 405-406, November 11–17, 2011

Paper No: IMECE2011-65540

DOI: https://doi.org/10.1115/IMECE2011-65540

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Topics: Heat transfer, Microscopy, Resolution (Optics), Temperature, Thermal characterization, Thermal properties, Uncertainty

Proceedings Papers

A Numerical Study to Predict the Effects of Structured Roughness Elements on Pressure Drop and Heat Transfer Enhancement in Minichannels and Microchannels

V. V. Dharaiya, S. G. Kandlikar

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 1007-1016, November 11–17, 2011

Paper No: IMECE2011-65262

DOI: https://doi.org/10.1115/IMECE2011-65262

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Topics: Heat transfer, Microchannels, Pressure drop, Surface roughness, Flow (Dynamics), Laminar flow, Computational fluid dynamics, Computer simulation, Design, Engineering simulation

Proceedings Papers

Development and Characterization of a Loop Heat Pipe With a Planar Evaporator and Condenser

H. Arthur Kariya, Daniel F. Hanks, Teresa B. Peters, John G. Brisson, Evelyn N. Wang

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 857-862, November 11–17, 2011

Paper No: IMECE2011-63898

DOI: https://doi.org/10.1115/IMECE2011-63898

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Topics: Condensers (steam plant), Heat pipes, Vapors, Clearances (Engineering), Condensation, Convection, Cooling, Geometry, Heat, Impellers

2 3 4 5

NARROW

Contact Angle Measurement Through Atomic Force Microscopy

Superhydrophobic Surfaces Properties for Anti-Icing

Transient Vapor Compression Refrigeration Cycle for Electronics Cooling: Part 1—Distributed Model Validation

Experimental Study on the Thermal Boundary Resistance Between an Individual Carbon Nanotube End and a Au Surface

Thermal Conductivity of Ordered Mesoporous Silicon Thin Films Made From Magnesium Reduction of Polymer Templated Silica

Molecular Dynamics Modeling of Thermal Conductance at Atomically Clean and Disordered Silicon/Aluminum Interfaces

A Numerical and Experimental Investigation of a Gas Propelled Liquid Droplet Impinging Onto a Heated Surface

Heat Pulse Propagation in Pure Sodium Fluoride at Low Temperatures From Ballistic to Diffusive Conduction

FINLESS Heat Sinks, High Performance and Low Cost for Low Profile Cooling Applications

Separate Parameters Identification of the Miso Time Delay Model Applied to the Heat Transfer Process

Investigation of Lightweight Space Radiator Design for Low and No Gravity Environments

Near-Wall Focusing of Phase Change Micro-Particles for Local Heat Transfer Enhancement

Effects of UV-Visible Irradiation on Pool Boiling Behavior of Copper

Mechanism of Thermal Conductivity Reduction From Suspended to Supported Graphene: A Quantitative Spectral Analysis of Phonon Scattering

Numerical Modelling of the Effective Thermal Conductivities of Composite Materials

Transient Vapor Compression Refrigeration Cycle for Electronics Cooling: Part 2—Multi-Evaporator Dynamics and Control

Performance Analysis of a Countercurrent Flow Heat Exchanger Placed on the Truck Compartment Roof

Tip-Sample Heat Transfer in Non-Contact Mode Scanning Thermal Microscopy With Wollaston Microprobes

A Numerical Study to Predict the Effects of Structured Roughness Elements on Pressure Drop and Heat Transfer Enhancement in Minichannels and Microchannels

Development and Characterization of a Loop Heat Pipe With a Planar Evaporator and Condenser

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