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Proceedings Papers

Proceedings Volume Cover
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
October 26–28, 2021
Virtual, Online
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
978-0-7918-8550-5
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Front Matter

InterPACK 2021; V001T00A001doi:https://doi.org/10.1115/IPACK2021-FM1

Heterogeneous Integration of Electronic Packages

InterPACK 2021; V001T01A001doi:https://doi.org/10.1115/IPACK2021-69495
InterPACK 2021; V001T01A002doi:https://doi.org/10.1115/IPACK2021-73017
InterPACK 2021; V001T01A003doi:https://doi.org/10.1115/IPACK2021-73314

Data Centers, Servers of the Future, Edge and Cloud Computing

InterPACK 2021; V001T02A001doi:https://doi.org/10.1115/IPACK2021-66660
InterPACK 2021; V001T02A002doi:https://doi.org/10.1115/IPACK2021-67330
InterPACK 2021; V001T02A003doi:https://doi.org/10.1115/IPACK2021-68121
InterPACK 2021; V001T02A004doi:https://doi.org/10.1115/IPACK2021-69723
InterPACK 2021; V001T02A005doi:https://doi.org/10.1115/IPACK2021-72612
InterPACK 2021; V001T02A006doi:https://doi.org/10.1115/IPACK2021-72618
InterPACK 2021; V001T02A007doi:https://doi.org/10.1115/IPACK2021-72620
InterPACK 2021; V001T02A008doi:https://doi.org/10.1115/IPACK2021-72621
InterPACK 2021; V001T02A009doi:https://doi.org/10.1115/IPACK2021-72682
InterPACK 2021; V001T02A010doi:https://doi.org/10.1115/IPACK2021-73015
InterPACK 2021; V001T02A011doi:https://doi.org/10.1115/IPACK2021-73253
InterPACK 2021; V001T02A012doi:https://doi.org/10.1115/IPACK2021-73269
InterPACK 2021; V001T02A013doi:https://doi.org/10.1115/IPACK2021-73270
InterPACK 2021; V001T02A014doi:https://doi.org/10.1115/IPACK2021-73271
InterPACK 2021; V001T02A015doi:https://doi.org/10.1115/IPACK2021-73283
InterPACK 2021; V001T02A016doi:https://doi.org/10.1115/IPACK2021-73954
InterPACK 2021; V001T02A017doi:https://doi.org/10.1115/IPACK2021-74016
InterPACK 2021; V001T02A018doi:https://doi.org/10.1115/IPACK2021-74108

Flexible and Wearable Electronics

InterPACK 2021; V001T03A001doi:https://doi.org/10.1115/IPACK2021-68902
InterPACK 2021; V001T03A002doi:https://doi.org/10.1115/IPACK2021-74060
InterPACK 2021; V001T03A003doi:https://doi.org/10.1115/IPACK2021-74063
InterPACK 2021; V001T03A004doi:https://doi.org/10.1115/IPACK2021-74065
InterPACK 2021; V001T03A005doi:https://doi.org/10.1115/IPACK2021-74071
InterPACK 2021; V001T03A006doi:https://doi.org/10.1115/IPACK2021-74073
InterPACK 2021; V001T03A007doi:https://doi.org/10.1115/IPACK2021-74074
InterPACK 2021; V001T03A008doi:https://doi.org/10.1115/IPACK2021-74086
InterPACK 2021; V001T03A009doi:https://doi.org/10.1115/IPACK2021-74088
InterPACK 2021; V001T03A010doi:https://doi.org/10.1115/IPACK2021-74115
InterPACK 2021; V001T03A011doi:https://doi.org/10.1115/IPACK2021-74570

Power Electronics

InterPACK 2021; V001T04A001doi:https://doi.org/10.1115/IPACK2021-68870
InterPACK 2021; V001T04A002doi:https://doi.org/10.1115/IPACK2021-69270
InterPACK 2021; V001T04A003doi:https://doi.org/10.1115/IPACK2021-69321
InterPACK 2021; V001T04A004doi:https://doi.org/10.1115/IPACK2021-72726
InterPACK 2021; V001T04A005doi:https://doi.org/10.1115/IPACK2021-73252
InterPACK 2021; V001T04A006doi:https://doi.org/10.1115/IPACK2021-73313
InterPACK 2021; V001T04A007doi:https://doi.org/10.1115/IPACK2021-74015

Multiscale Heat Transfer in Optics and Energy Systems

InterPACK 2021; V001T05A001doi:https://doi.org/10.1115/IPACK2021-73309
InterPACK 2021; V001T05A002doi:https://doi.org/10.1115/IPACK2021-74010

Autonomous, Hybrid, and Electric Vehicles

InterPACK 2021; V001T06A001doi:https://doi.org/10.1115/IPACK2021-69751
InterPACK 2021; V001T06A002doi:https://doi.org/10.1115/IPACK2021-70410
InterPACK 2021; V001T06A003doi:https://doi.org/10.1115/IPACK2021-73100
InterPACK 2021; V001T06A004doi:https://doi.org/10.1115/IPACK2021-73319

Reliability of Electronic Packages and Systems

InterPACK 2021; V001T07A001doi:https://doi.org/10.1115/IPACK2021-69101
InterPACK 2021; V001T07A002doi:https://doi.org/10.1115/IPACK2021-69511
InterPACK 2021; V001T07A003doi:https://doi.org/10.1115/IPACK2021-69719
InterPACK 2021; V001T07A004doi:https://doi.org/10.1115/IPACK2021-69882
InterPACK 2021; V001T07A005doi:https://doi.org/10.1115/IPACK2021-72293
InterPACK 2021; V001T07A006doi:https://doi.org/10.1115/IPACK2021-72975
InterPACK 2021; V001T07A007doi:https://doi.org/10.1115/IPACK2021-72976
InterPACK 2021; V001T07A008doi:https://doi.org/10.1115/IPACK2021-73197
InterPACK 2021; V001T07A009doi:https://doi.org/10.1115/IPACK2021-73287
InterPACK 2021; V001T07A010doi:https://doi.org/10.1115/IPACK2021-73334
Topics: Copper
InterPACK 2021; V001T07A011doi:https://doi.org/10.1115/IPACK2021-73348
InterPACK 2021; V001T07A012doi:https://doi.org/10.1115/IPACK2021-73367
InterPACK 2021; V001T07A013doi:https://doi.org/10.1115/IPACK2021-73456
InterPACK 2021; V001T07A014doi:https://doi.org/10.1115/IPACK2021-73548
InterPACK 2021; V001T07A015doi:https://doi.org/10.1115/IPACK2021-73970
InterPACK 2021; V001T07A016doi:https://doi.org/10.1115/IPACK2021-74044
InterPACK 2021; V001T07A017doi:https://doi.org/10.1115/IPACK2021-74061
InterPACK 2021; V001T07A018doi:https://doi.org/10.1115/IPACK2021-74062
InterPACK 2021; V001T07A019doi:https://doi.org/10.1115/IPACK2021-74066
InterPACK 2021; V001T07A020doi:https://doi.org/10.1115/IPACK2021-74067
InterPACK 2021; V001T07A021doi:https://doi.org/10.1115/IPACK2021-74068
InterPACK 2021; V001T07A022doi:https://doi.org/10.1115/IPACK2021-74069
InterPACK 2021; V001T07A023doi:https://doi.org/10.1115/IPACK2021-74075
InterPACK 2021; V001T07A024doi:https://doi.org/10.1115/IPACK2021-74076
InterPACK 2021; V001T07A025doi:https://doi.org/10.1115/IPACK2021-74199
InterPACK 2021; V001T07A026doi:https://doi.org/10.1115/IPACK2021-75890

Nano-Scale Thermal Transport and Materials

InterPACK 2021; V001T08A001doi:https://doi.org/10.1115/IPACK2021-66842
InterPACK 2021; V001T08A002doi:https://doi.org/10.1115/IPACK2021-69254
InterPACK 2021; V001T08A003doi:https://doi.org/10.1115/IPACK2021-69317
InterPACK 2021; V001T08A004doi:https://doi.org/10.1115/IPACK2021-73648
InterPACK 2021; V001T08A005doi:https://doi.org/10.1115/IPACK2021-74116
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