Boiling heat transfer is one of the most effective methods to meet the challenge of heat dissipation of high heat flux devices. Wetting hybrid surface has been demonstrated to have better performance than hydrophilic or hydrophobic surface. But this kind of wetting hybrid modification is always carried out on plain or flat surface. In this paper, we coated PTFE powders on superhydrophilic micro copper dendrite fin surface to build wetting hybrid surface. The pool boiling experimental results showed that after coating, the wall superheat dramatically decreased to 8 K, which is 9K lower than that on original surface at 250 W·cm−2. Besides, it also has much better performance than Silicon pin fin based wetting hybrid surface.
Volume Subject Area:Nano/Microscale Boiling and Condensation Heat Transfer
Keywords:pool boiling, wetting hybrid, PTFE, pin fin
Topics:Boiling, Pool boiling, Wetting, Coating processes, Coatings, Copper, Energy dissipation, Heat, Heat flux, Heat transfer, Silicon
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