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Journal Articles

Development of LSTM Networks for Predicting Viscoplasticity With Effects of Deformation, Strain Rate, and Temperature History

Lahouari Benabou
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. July 2021, 88(7): 071008.
Paper No: JAM-21-1129
https://doi.org/10.1115/1.4051115
Published Online: May 26, 2021
View Article titled, Development of LSTM Networks for Predicting Viscoplasticity With Effects of Deformation, Strain Rate, and Temperature History
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Topics: Deformation, Stress, Temperature, Viscoplasticity, Artificial neural networks, Solders, Plasticity, Alloys
Journal Articles

Assessment of Need for Solder in Modeling Potted Electronics During Gun-Shot

L. E. Reinhardt, J. A. Cordes, A. S. Haynes, J. D. Metz
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Launch Dynamics
J. Appl. Mech. May 2013, 80(3): 031502.
Paper No: JAM-12-1360
https://doi.org/10.1115/1.4023336
Published Online: April 19, 2013
View Article titled, Assessment of Need for Solder in Modeling Potted Electronics During Gun-Shot
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Topics: Electronics, Modeling, Printed circuit boards, Solders, Stress, Dynamic analysis
Journal Articles

Strain Rate Effects and Rate-Dependent Constitutive Models of Lead-Based and Lead-Free Solders

Fei Qin, Tong An, Na Chen
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. January 2010, 77(1): 011008.
https://doi.org/10.1115/1.3168600
Published Online: September 30, 2009
View Article titled, Strain Rate Effects and Rate-Dependent Constitutive Models of Lead-Based and Lead-Free Solders
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Topics: Constitutive equations, Lead-free solders, Solder joints, Solders, Stress, Tensile strength, Stress-strain curves, Mechanical properties, Reliability, Ductility
Journal Articles

A Theory of Fatigue: A Physical Approach With Application to Lead-Rich Solder

S. Wen, Mem. ASME, L. M. Keer, Life Fellow ASME
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. January 2002, 69(1): 1–10.
https://doi.org/10.1115/1.1412453
Published Online: June 8, 2001
View Article titled, A Theory of Fatigue: A Physical Approach With Application to Lead-Rich Solder
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Topics: Fatigue, Solders, Microcracks
Journal Articles

Capillary Instability of a Cylindrical Jet With an Elastic Shroud: A Model for the Breakup of an Oxidized Metal Jet

H. Haj-Hariri, Professor,, D. Poulikakos, Professor, Fellow ASME,
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Brief Notes
J. Appl. Mech. September 2000, 67(3): 626–628.
https://doi.org/10.1115/1.1309544
Published Online: May 5, 2000
View Article titled, Capillary Instability of a Cylindrical Jet With an Elastic Shroud: A Model for the Breakup of an Oxidized Metal Jet
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Topics: Jets, Metals, Oxidation, Stiffness, Surface tension, Solders, Manufacturing, Oxygen
Journal Articles

An Infrared Interferometer for Elastoplastic Crack-Tip Field Investigation of Homogeneous and Bimaterial Beams: A Study of Three-Dimensional Effects and J -Dominance

J. K. Sinha, H. V. Tippur
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. December 1998, 65(4): 1032–1041.
https://doi.org/10.1115/1.2791897
Published Online: December 1, 1998
View Article titled, An Infrared Interferometer for Elastoplastic Crack-Tip Field Investigation of Homogeneous and Bimaterial Beams: A Study of Three-Dimensional Effects and J -Dominance
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Topics: Fracture (Materials), Interferometers, Deformation, Surface roughness, Aluminum, Bridges (Structures), Copper, Damage, Finite element analysis, Fracture mechanics
Journal Articles

Quantitative Characterization of a Flip-Chip Solder Joint

S. K. Patra, S. S. Sritharan, Y. C. Lee
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. June 1995, 62(2): 390–397.
https://doi.org/10.1115/1.2895943
Published Online: June 1, 1995
View Article titled, Quantitative Characterization of a Flip-Chip Solder Joint
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Topics: Flip-chip, Solder joints, Solders, Computer simulation, Design, Energy conservation, Numerical analysis, Shapes
Journal Articles

Axisymmetric Elastic Deformations of a Finite Circular Cylinder With Application to Low Temperature Strains and Stresses in Solder Joints

E. Suhir
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. June 1989, 56(2): 328–333.
https://doi.org/10.1115/1.3176087
Published Online: June 1, 1989
View Article titled, Axisymmetric Elastic Deformations of a Finite Circular Cylinder With Application to Low Temperature Strains and Stresses in Solder Joints
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Topics: Circular cylinders, Deformation, Low temperature, Solder joints, Stress, Solders, Alloys, Failure, Thermal expansion, Thermomechanics