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Journal Articles

Predictive Analytical Thermal Stress Modeling in Electronics and Photonics

E. Suhir

Publisher: ASME

Appl. Mech. Rev. July 2009, 62(4): 040801.

https://doi.org/10.1115/1.3077136

Published Online: June 4, 2009

View Article titled, Predictive Analytical Thermal Stress Modeling in Electronics and Photonics

Topics: Finite element analysis, Manufacturing, Modeling, Stress, Thermal stresses, Design, Electronics, Photonics, Bonding, Temperature

Journal Articles

Thermal Analysis of Welds

N. Nguyen,, Author

Publisher: ASME

Appl. Mech. Rev. November 2004, 57(6): B34.

https://doi.org/10.1115/1.1849178

Published Online: February 16, 2005

View Article titled, Thermal Analysis of Welds

Topics: Thermal analysis, Welded joints, Welding, Differential equations, Heat conduction, Plates (structures), Thermal properties, Thermal stresses, Heat, Structural mechanics

Journal Articles

Thermal Stresses

N Noda,, Author, RB Hetnarski,, Author, Y Tanigawa,, Author, P Puri,, Reviewer

Publisher: ASME

Appl. Mech. Rev. July 2001, 54(4): B71–B72.

https://doi.org/10.1115/1.1383684

Published Online: July 1, 2001

View Article titled, Thermal Stresses

Topics: Thermal stresses, Thermoelasticity

Journal Articles

Special Issue on Thermal Stresses: Introduction

Richard B. Hetnarski

Publisher: ASME

Appl. Mech. Rev. September 1997, 50(9): 476.

https://doi.org/10.1115/1.3101737

Published Online: September 1, 1997

View Article titled, Special Issue on Thermal Stresses: Introduction

Topics: Thermal stresses

Journal Articles

Computational Approaches With Applications to Non-Classical and Classical Thermomechanical Problems

Kumar K. Tamma, Raju R. Namburu

Publisher: ASME

Appl. Mech. Rev. September 1997, 50(9): 514–551.

https://doi.org/10.1115/1.3101742

Published Online: September 1, 1997

View Article titled, Computational Approaches With Applications to Non-Classical and Classical Thermomechanical Problems

Topics: Thermomechanics, Thermoelasticity, Aerospace industry, Defense industry, Elasticity, Engineering systems and industry applications, Heat conduction, Manufacturing, Modeling, Solids

Journal Articles

Some Basic Thermoelastic Problems for Nonhomogeneous Structural Materials

Yoshinobu Tanigawa

Publisher: ASME

Appl. Mech. Rev. June 1995, 48(6): 287–300.

https://doi.org/10.1115/1.3005103

Published Online: June 1, 1995

View Article titled, Some Basic Thermoelastic Problems for Nonhomogeneous Structural Materials

Topics: Thermoelasticity, Temperature, Thermal stresses, Approximation, Boundary-value problems, Flamelet generated manifold, Fracture (Materials), Functionally graded materials, Heat conduction, Linearization techniques

Journal Articles

Computational Models for High-Temperature Multilayered Composite Plates and Shells

Ahmed K. Noor, W. Scott Burton

Publisher: ASME

Appl. Mech. Rev. October 1992, 45(10): 419–446.

https://doi.org/10.1115/1.3119742

Published Online: October 1, 1992

View Article titled, Computational Models for High-Temperature Multilayered Composite Plates and Shells

Topics: Composite materials, High temperature, Plates (structures), Shells, Buckling, Modeling, Bifurcation, Deflection, Hardening (Curing), Heat transfer

Journal Articles

Thermal Stresses in Materials with Temperature-Dependent Properties

Naotake Noda

Publisher: ASME

Appl. Mech. Rev. September 1991, 44(9): 383–397.

https://doi.org/10.1115/1.3119511

Published Online: September 1, 1991

View Article titled, Thermal Stresses in Materials with Temperature-Dependent Properties

Topics: Temperature, Thermal stresses, Materials properties, Differential equations, Finite element methods, Heat treating (Metalworking), High temperature, Mechanical properties, Metalworking, Stress

Journal Articles

Thermal Management of Electronic Equipment: A Review of Technology and Research Topics

Wataru Nakayama

Publisher: ASME

Appl. Mech. Rev. December 1986, 39(12): 1847–1868.

https://doi.org/10.1115/1.3149515

Published Online: December 1, 1986

View Article titled, Thermal Management of Electronic Equipment: A Review of Technology and Research Topics

Topics: Electronic equipment, Thermal management, Cooling, Design, Heat transfer, Bonding, Databases, Flip-chip, Forced convection, Heat sinks

Journal citation

NARROW

Predictive Analytical Thermal Stress Modeling in Electronics and Photonics

Thermal Analysis of Welds

Thermal Stresses

Special Issue on Thermal Stresses: Introduction

Computational Approaches With Applications to Non-Classical and Classical Thermomechanical Problems

Some Basic Thermoelastic Problems for Nonhomogeneous Structural Materials

Computational Models for High-Temperature Multilayered Composite Plates and Shells

Thermal Stresses in Materials with Temperature-Dependent Properties

Thermal Management of Electronic Equipment: A Review of Technology and Research Topics

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