High-Temperature Thermocouple and Heat Flux Gauge Using a Unique Thin Film-Hardware Hot Junction

[+] Author and Article Information
C. H. Liebert, R. Holanda, S. A. Hippensteele, C. A. Andracchio

National Aeronautics and Space Administration, Lewis Research Center, Cleveland, Ohio 44135

J. Eng. Gas Turbines Power 107(4), 938-944 (Oct 01, 1985) (7 pages) doi:10.1115/1.3239839 History: Received December 17, 1984; Online October 15, 2009


A special thin film-hardware material thermocouple (TC) and heat flux gauge concept for a reasonably high-temperature and high heat flux, flat-plate heat transfer experiment was fabricated and tested to gauge temperatures of 911 K. This unique concept was developed for minimal disturbance of boundary layer temperature and flow over the plates and minimal disturbance of heat flux through the plates. Comparison of special heat flux gauge Stanton number output at steady-state conditions with benchmark literature data was good and agreement was within a calculated uncertainty of the measurement system. Also, good agreement of special TC and standard TC outputs was obtained and the results are encouraging. Oxidation of thin film thermoelements was a primary failure mode after about 5 hr of operation.

Copyright © 1985 by ASME
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In