The estimation of the mechanical reliability of components on a vibrating circuit card continues to be an important part of the overall reliability assessment for electronic packages. To achieve a good vibration reliability estimate it is necessary to have an accurate representation of the dynamic response of the card. This can be realized by having the modal characteristics of the circuit card, i.e., its natural frequencies and mode shapes, accurately modeled. It is the primary objective of this paper to review some of the current modeling techniques for the dynamic characterization of circuit cards populated with components. Performance assessments include tangible factors such as accuracy of predicted frequencies and mode shapes, as well as less tangible factors such as ease of use. The circuit cards considered in this study are intended to be representative of small to medium sized logic, memory, and processor cards used in commercial electronics; the card is composed of laminated copper and FR-4 glass epoxy, typically without a bonded heat sink or intermediate stiffeners, and it may be populated with both SMT and PIH components.
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December 1992
Research Papers
Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards
J. M. Pitarresi,
J. M. Pitarresi
Mechanical and Industrial Engineering Department, State University of New York at Binghamton, Binghamton, NY 13901
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A. A. Primavera
A. A. Primavera
Surface Mount Technology Laboratory, Universal Instruments Corporation, Binghamton, NY 13902-0825
Search for other works by this author on:
J. M. Pitarresi
Mechanical and Industrial Engineering Department, State University of New York at Binghamton, Binghamton, NY 13901
A. A. Primavera
Surface Mount Technology Laboratory, Universal Instruments Corporation, Binghamton, NY 13902-0825
J. Electron. Packag. Dec 1992, 114(4): 378-383 (6 pages)
Published Online: December 1, 1992
Article history
Revised:
October 1, 1992
Online:
April 28, 2008
Citation
Pitarresi, J. M., and Primavera, A. A. (December 1, 1992). "Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards." ASME. J. Electron. Packag. December 1992; 114(4): 378–383. https://doi.org/10.1115/1.2905468
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