A mechanistic model is presented for predicting the effective dielectric constant and loss tangent of woven-fabric reinforced composites with low-loss constituents. A two-scale asymptotic homogenization scheme is used to predict the orthotropic effective properties. A three-dimensional unit-cell enclosing the characteristic periodic repeat pattern in the fabric weave is isolated and modeled mathematically. Electrostatic boundary value problems (BVP’s) are formulated in the unit-cell and are solved analytically to predict effective dielectric constant of the composite, using three-dimensional series-parallel reactance nets. Results are also verified numerically, using finite element methods. The effective dielectric constant and the effective loss tangent are then obtained, analogous to mechanical viscoelastic problems for low-loss materials. The predicted dielectric constant and loss tangent are compared with experimental results for E-glass/epoxy laminates. Frequency dependence of the effective dielectric constant and loss tangent is obtained from the corresponding behavior of the constituent materials. Trade-off studies are conducted to investigate the effect of the constituent material properties on orthotropic effective dielectric permittivity.
Skip Nav Destination
Article navigation
June 1993
Research Papers
Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design
R. K. Agarwal,
R. K. Agarwal
CALCE Electronics Packaging Research Center, University of Maryland, College Park, MD 20742
Search for other works by this author on:
A. Dasgupta
A. Dasgupta
CALCE Electronics Packaging Research Center, University of Maryland, College Park, MD 20742
Search for other works by this author on:
R. K. Agarwal
CALCE Electronics Packaging Research Center, University of Maryland, College Park, MD 20742
A. Dasgupta
CALCE Electronics Packaging Research Center, University of Maryland, College Park, MD 20742
J. Electron. Packag. Jun 1993, 115(2): 219-224 (6 pages)
Published Online: June 1, 1993
Article history
Received:
April 12, 1993
Online:
April 28, 2008
Citation
Agarwal, R. K., and Dasgupta, A. (June 1, 1993). "Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design." ASME. J. Electron. Packag. June 1993; 115(2): 219–224. https://doi.org/10.1115/1.2909321
Download citation file:
Get Email Alerts
Cited By
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
Related Articles
Effective Thermomechanical Behavior of Plain-Weave Fabric-Reinforced Composites Using Homogenization Theory
J. Eng. Mater. Technol (January,1994)
Analytical and Experimental Studies of Short-Beam Interlaminar Shear Strength of G-10CR Glass-Cloth/Epoxy Laminates at Cryogenic Temperatures
J. Eng. Mater. Technol (January,2001)
Influence of Selected Design Variables on Thermo-Mechanical Stress Distributions in Plated-Through-Hole Structures
J. Electron. Packag (March,1992)
Tensile Strength of Stitching Joint in Woven Glass Fabrics
J. Eng. Mater. Technol (April,1990)
Related Proceedings Papers
Related Chapters
Control and Testing of Epoxy Resins Used for Printed Circuit Boards
Composite Materials: Testing and Design (Fifth Conference)
Insulating Properties of W-Doped Ga2O3 Films Grown on Si Substrate for Low-K Applications
International Conference on Advanced Computer Theory and Engineering, 4th (ICACTE 2011)
Introductory Survey
Introduction to Plastics Engineering