This paper focuses on mechanical testing designed to determine the static failure envelope for a conductive adhesive. Samples were made by bonding copper pegs together with the conductive adhesive. The samples were then tested at various loading conditions including tension, tension shear, and compression shear. Results were analyzed in order to check for correlations between the data and the testing procedures. The statistical distribution of the data was also analyzed. Furthermore, a finite element model of the test sample was constructed and used to verify the assumptions made with respect to the interpretation of the data. The data from various loading conditions was then used to construct the static failure envelope of the material. A modified Coulomb–Mohr failure criterion was used to model the failure envelope of the conductive adhesive. This criterion contains four material constants to be determined experimentally. Once these parameters are determined, a failure envelope can be easily constructed. The envelope can then be used to predict failure at any combination of shear and normal stresses. The test results showed that the empirical data are well characterized by the modified Coulomb–Mohr failure envelope.
Skip Nav Destination
e-mail: jianmin.qu@me.gatech.edu
Article navigation
March 1999
Technical Papers
Characterizing the Failure Envelope of a Conductive Adhesive
D. Olliff,
D. Olliff
School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
Search for other works by this author on:
J. Qu,
J. Qu
School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
e-mail: jianmin.qu@me.gatech.edu
Search for other works by this author on:
M. Gaynes,
M. Gaynes
International Business Machines Corporation, Endicott, NY 13760
Search for other works by this author on:
R. Kodnani,
R. Kodnani
International Business Machines Corporation, Endicott, NY 13760
Search for other works by this author on:
A. Zubelewicz
A. Zubelewicz
International Business Machines Corporation, Endicott, NY 13760
Search for other works by this author on:
D. Olliff
School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
J. Qu
School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
e-mail: jianmin.qu@me.gatech.edu
M. Gaynes
International Business Machines Corporation, Endicott, NY 13760
R. Kodnani
International Business Machines Corporation, Endicott, NY 13760
A. Zubelewicz
International Business Machines Corporation, Endicott, NY 13760
J. Electron. Packag. Mar 1999, 121(1): 23-30 (8 pages)
Published Online: March 1, 1999
Article history
Received:
May 20, 1998
Revised:
November 16, 1998
Online:
November 5, 2007
Citation
Olliff, D., Qu, J., Gaynes, M., Kodnani, R., and Zubelewicz, A. (March 1, 1999). "Characterizing the Failure Envelope of a Conductive Adhesive." ASME. J. Electron. Packag. March 1999; 121(1): 23–30. https://doi.org/10.1115/1.2792657
Download citation file:
Get Email Alerts
Cited By
Optimization of Micropillars Electroplating Bonding Processes and Additives
J. Electron. Packag (June 2025)
Microbead Encapsulation for Protection of Electronic Components
J. Electron. Packag (June 2025)
Related Articles
Impact Resistance of SM Joints Formed With ICA
J. Electron. Packag (December,2002)
Impact Resistance of SM Joints Formed With ICA
J. Electron. Packag (March,2003)
An Evaluation of Gold and Copper Wire Bonds on Shear and Pull Testing
J. Electron. Packag (September,2006)
Poly(Propylene Fumarate)–Hydroxyapatite Nanocomposite Can Be a Suitable Candidate for Cervical Cages
J Biomech Eng (October,2018)
Related Chapters
Basic Features
Structural Shear Joints: Analyses, Properties and Design for Repeat Loading
Basic Concepts
Design & Analysis of ASME Boiler and Pressure Vessel Components in the Creep Range
Clamping, Interference, Microslip, and Self-Piercing Rivets
Structural Shear Joints: Analyses, Properties and Design for Repeat Loading