Thermal considerations in printed wiring board (PWB) assemblies are becoming increasingly important as packaging constraints shrink and power use escalates. In this paper, we provide a study on the potential for a genetic algorithm-driven PWB layout design tool to improve the thermal performance of such assemblies. As a case study, the thermomechanical fatigue of surface mounted leadless chip carriers on an FR4 epoxy board is used. We have found that by utilizing appropriate formula-based engineering approximations, the efficiency of parallel implementations of genetic algorithms in finding near-optimal and results makes this approach effective as an explorative “scouting” approach to identify promising board configurations for more computationally expensive evaluations such as finite element method.
1.
Akay, H. U., Tong, Y., Paydar, N., 1992, “Thermal Fatigue Analysis of an SMT Solder Joint Using Nonlinear FEM Approach,” Proceedings, International Electronics Packaging Conference, Austin, TX, Vol. 2, IEPS, Wheaton, IL, pp. 980–998.
2.
Capillo, C., 1990, Surface Mount Technology Materials, Processes, and Equipment, McGraw Hill, New York.
3.
Chan
H.
Mazumder
P.
Shahookar
K.
1991
, “Macro-Cell and Module Placement by Genetic Adaptive Search With Bitmap-Represented Chromosome
,” Integration
, Vol. 12
, No. 1
, pp. 49
–77
.4.
Cohoon, J. P., Paris, W. D., 1987, “Genetic Placement,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, CAD-6, No. 6, pp. 980–998.
5.
Davis, L., ed., 1991, Handbook of Genetic Algorithms, Van Nostrand Reinhold, New York.
6.
De Jong, K. A., Spears, W. M., Schwefel, H.-P., Manner, R., 1991, “An Analysis of the Interacting Roles of Population Size and Crossover in Genetic Algorithms,” Parallel Problem Solving from Nature, 1st Workshop, PPSN 1, Dortmund, West Germany, Springer-Verlag Publishing Company, New York, NY, pp. 38–47.
7.
Engelmaier
W.
1983
, “Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling
,” IEEE Transactions on Components, Hybrids, and Manuf. Technol.
, Vol. CHMT-6
, No. 3
, pp. 232
–237
.8.
Engelmaier, W., 1989, “Thermal-Mechanical Effects,” in Electronics Material Handbook, Volume 1, Packaging, M. L., Minges, ed., ASM International, Materials Park, OH, pp. 740–753.
9.
Goldberg, D. E., 1989, Genetic Algorithms in Search, Optimization, and Machine Learning. Addison-Wesley Publishing Company, Inc., Reading, MA.
10.
Goodman, E. D., 1995, “An Introduction to GALOPPS,” technical report #95-06-01, Genetic Algorithms Research and Applications Group, Michigan State University, East Lansing, MI.
11.
Grefenstette
J. J.
1986
, “Optimization of Control Parameters For Genetic Algorithms
,” IEEE Transactions on Systems, Man and Cybernetics
, Vol. SMC-16
, No. 1
, pp. 122
–128
.12.
Holland, J. H., 1975, Adaptation in Natural and Artificial Systems, The University of Michigan Press, Ann Arbor, MI.
13.
Jin
L.-M.
Chan
S.-P.
1992
, “Analogue Placement by Formulation of Macro-Components and Genetic Partitioning
,” International Journal of Electronics
, Vol. 73
, No. 1
, pp. 157
–173
.14.
Kang
S. S.
1994
, “The Thermal Wake Function for Rectangular Electronic Modules
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 116
, pp. 55
–59
.15.
Lake View Software, 1991, The Circuit Board Thermometer, Version 1.0, Laurel, MD.
16.
Lin, S.-C., Punch, W. F., and Goodman, E. D., 1994, “Coarse Grain Genetic Algorithms, Categorization and New Approaches,” Proceedings, Sixth IEEE Parallel and Distributed Processing, IEEE, Piscataway, NJ, pp. 28–37.
17.
Manno, V., Kurita, N., and Azar, K., 1993, “Experimental Characterization of Board Conduction Effects,” Proceedings, Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, IEEE, Piscataway, NJ.
18.
Muhlenbein
H.
Schomisch
M.
Born
J.
1991
, “The Parallel Genetic Algorithms as Function Optimizer
,” Parallel Computing
, Vol. 17
, No. 6–7
, pp. 619
–632
.19.
Ozmat, B., 1990, “A Nonlinear Thermal Stress Analysis of Surface Mount Solder Joints,” Proceedings, 40th Elec. Components & Tech Conf., Vol. 2, IEEE, Piscataway, NJ, pp. 959–72.
20.
Peak, R. S., and Fulton, R. E., 1992, “Integrating Analysis and Design Information in Electronic Packaging Using Product Model-based Analytical Models,” Computer Aided Design in Electronic Packaging, Proceedings, ASME Winter Annual Meeting, EEP Vol. 3, ASME, New York, pp. 41–56.
21.
Rudolph
G.
1994
, “Convergence Analysis of Canonical Genetic Algorithms
,” IEEE Transactions on Neural Networks
, Vol. 5
, No. 1
, pp. 96
–101
.22.
Shahookar
K.
Mazumdar
P.
1990
, “Genetic Approach to Standard Cell Placement Using Meta-Genetic Parameter Optimization
,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
, Vol. 9
, No. 5
, pp. 500
–511
.23.
Shonkwiler
R.
Van Vleck
E.
1994
, “Parallel Speed-Up of Monte Carlo Methods for Global Optimization
,” Journal of Complexity
, Vol. 10
, No. 1
, pp. 64
–95
.
This content is only available via PDF.
Copyright © 1999
by The American Society of Mechanical Engineers
You do not currently have access to this content.
