A component aligned through the use of liquid solder bumps behaves like a mechanical oscillator system. The force constants for liquid solder bumps are derived analytically for simple model systems as well the damping factor and the resonance spectrum. It appears that for practical bump sizes the force constant in the vertical direction is an order of magnitude larger than the horizontal one. The damping factor is small and the system can easily be brought into resonance. From the derivation of the force constants combined with the dissociation energy a Morse potential can be constructed depicting the asymmetry in the potential energy curve.

Issue Section:
Technical Papers
Topics:
Damping, Flip-chip, Flip-chip devices, Potential energy, Resonance, Solders
1.
Basavanhally, N., 1993, “Application of Soldering Technologies for Opto-Electronic Component Assembly,” presented at the ASME International Electronic Packaging Conference, Binghamton, NY, Sept., 1993.
2.
Bingzhi, S., Gershovich, M., and Lee, Y. C., 1997, “Gas Flow Effects on Precision Solder Self-Alignment,” Proceedings, ECTC 1997, p. 797.
3.
Bird
R. B.
,
Armstrong
R. C.
, and
Nassager
O.
,
1977
,
Dynamics of Polymeric Liquids
, Vol.
1
, John Wiley, New York, pp.
19
–
21
.
4.
Dijksman, F., 1997, private communication.
5.
Goldmann, L. S., 1993, “A Heuristic Force-Height Equation for Molten Axi-Symmetric Solder Joints,” Proceedings, ECTC 43, p. 1120.
6.
Landry, M., Patra, S. K., and Lee, Y. C., 1991, Manufacturing Processes and Materials Challenges in Microelectronics Packaging, AMD-Vol. 131/EEP-Vol. 1, ASME, New York.
7.
Lin, W., Patra, S. K., and Lee, Y. C., 1995, “Design of Solder Joints for Self-Aligned Opto-Electronic Assembly,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, Vol. 18, No. 3.
8.
Morse, P. M., 1929, “Diatomic Molecules According to the Wave Mechanics: II—Vibrational Levels,” Phys. Rev. 34, p. 57.
9.
Veen, N. J. A., 1995, Proceedings, ITAP ’95, San Jose, Vol. 5, p. 146.
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