Two forms (paste and film) of isotropically conductive adhesives (CAs) were mechanically loaded in shear mode. The specimens were instrumented with crossed-line gratings so that normal and shear displacements could be measured. The CA paste specimen failed outside the observed region at a stress 28 percent below the manufacturer’s predicted value. In the observed region there were no normal strains, only shear strains restricted to the CA. In the film specimen the conducting particles began breaking away from the matrix epoxy at very low loads. However, the specimen continued carrying the additional loading increments until the load was transferred to the adjacent material.
Issue Section:
Technical Papers
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Berger
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4.
Drexler, E. S., and Berger, J. R., 1997, “Electron-Beam Moire´ Study of Local Deformation in Conductive Adhesives,” Proceedings, Fall 1996 Meeting of the Materials Research Society, Electronic Packaging Materials Science IX, Vol. 445, S. K. Groothuis, P. S. Ho, K. Ishida, and T. Wu, eds., Materials Research Society, Pittsburgh, PA, pp. 75–80.
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Hogerton, P. B., Carlson, K. E., Hall, J. B., Krause, L. J., and Tingerthal, J. M., 1990, “An Evaluation of a Heat-bondable, anisotropically conductive Adhesive as an Interconnection Medium for Flexible Printed Circuitry,” Proceedings, IEPS Technical Conference, pp. 1026–1033.
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Honore´, J. P., Rubin, H. D., and Zierold, M. K., 1992, “Reliability Testing of Conductive Adhesives,” Proceedings, NEPCON West Technical Program, Vol. 3, pp. 1372–1380.
8.
Keusseyan, R. L., and Dilday, J. L., 1993, “Electric Contact Phenomena in Conductive Adhesive Connections,” Proceedings, Surface Mount International Conference and Exposition, Surface Mount International, Edina, MN, pp. 567–571.
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Kreutter, N. P., Grove, B. K., Hogerton, P. B., and Jensen, C. R., 1992, “Effective Polymer Adhesives for Interconnect,” Proceedings, 7th Electronic Materials and Processing Congress, pp. 249–256.
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,” IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part B
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, pp. 313
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Williams
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,” IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part B
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Stam
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