Stress-strain diagrams showing the influence of strain rate at five different high homologous temperatures for a Sn-Pb solder alloy are used to determine the material parameters in a minimal version of the viscoplasticity theory based on overstress (VBO), accounting for static recovery effects. VBO is a “unified” state variable theory that does not use a yield surface and has three state variables with appropriate growth laws. It is shown that the effects of strain rate can be modeled well by this theory that requires eight material parameters to describe the inelastic behavior. The behavior in tensile and cyclic strain-controlled loadings, ratcheting, and creep is predicted. The results compare very well with the experiments for tensile and cyclic loading. For the other tests no comparisons were made due to the lack of proper experimental data. The model is formulated in tensorial form and can be used for inelastic stress analyses of solder joints.

1.
Adams, P.J., 1986, “Thermal Fatigue of Solder Joints in Micro-Electronic Devices,” M.S. thesis, Department of Mechanical Engineering, Massachusetts Institute of technology, Cambridge, MA.
2.
Busso
E. P.
,
Kitano
M.
, and
Kumazawa
T.
,
1992
, “
A Visco-Plastic Constitutive Model for 60/40 Tin Lead Solder Used in IC Packages
,”
Journal of Engineering Materials and Technology
, Vol.
114
, pp.
331
337
.
3.
Freund, R.J., and Minton, P.D., 1979, Regression Methods, Marcel Dekker, Inc., New York.
4.
Hindmarsh, A.C., 1983, “ODEpack, a Systematized Collection of ODE Solvers,” Scientific Computing, R. S. Stepleman et al., eds., North Holland, Amsterdam, pp. 55–64.
5.
Ishikawa
H.
,
Sasaki
K.
, and
Ohguchi
K.
,
1996
, “
Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity
,”
Journal of Engineering Materials and Technology
, Vol.
118
, pp.
164
169
.
6.
Ju, S.H., Kuskowsky, S., Sandor, B.I., and Plesha, M.E., 1994, “Creep-Damage Analysis of Solder Joints,” ASTM STP 1153, S.A. Schroeder and M.R. Mitchell, eds., American Society for Testing and Materials, West Conshohocken, PA, pp. 1–21.
7.
Krempl, E., 1996, “A Small-Strain Viscoplasticity Theory Based on Overstress,” in Unified Constitutive Laws of Plastic Deformation, A. S. Krausz and K. Krausz, eds., Academic Press, San Diego, pp. 281–318.
8.
Kuo, C. G., Sastry, M. L., and Jerina, K. L., 1994, “Creep-Fatigue Interactions in Eutectic Tin-Lead Solder Alloys,” ASTM STP 1153, S. A. Schroeder and M. R. Mitchell, eds., American Society for Testing and Materials, West Conshohocken, PA, pp. 24–21.
9.
Lee
K. D.
, and
Krempl
E.
,
1991
, “
An Orthotropic Theory of Viscoplasticity Based on Overstress for Thermomechanical Deformation
,”
International Journal of Solids and Structures
, Vol.
27
, pp.
1445
1459
.
10.
Majors
P. S.
, and
Krempl
E.
,
1994
, “
The Isotropic Viscoplasticity Theory Based on Overstress Applied to the Modeling of Modified 9 wt% Cr-1 wt% Mo Steel at 538 C
,”
Materials Science and Engineering
, Vol.
A186
, pp.
23
34
.
11.
McDowell, D. L., Miller, M. P., and Brooks, D. C., 1994, “Unified Creep-Plasticity Theory for Solder Alloys,” ASTM STP 1153, S. A. Schroeder and M. R. Mitchell, eds., American Society for Testing and Materials, West Conshohocken, PA, pp. 42–59.
12.
Tachibana
Y.
, and
Krempl
E.
,
1995
, “
Modeling the High Homologous Temperature Deformation Behavior Using the Viscoplasticity Theory Based on Overstress (VBO): Part I. Creep and Tensile Behavior
,”
Journal of Engineering Materials and Technology
, Vol.
117
, pp.
456
461
.
13.
Tachibana
Y.
, and
Krempl
E.
,
1997
, “
Modeling the High Homologous Temperature Deformation Behavior Using the Viscoplasticity Theory Based on Overstress (VBO): Part II. Characteristics of the VBO Model
,”
Journal of Engineering Materials and Technology
, Vol.
119
, pp.
1
6
.
14.
Tachibana
Y.
, and
Krempl
E.
,
1998
, “
Modeling the High Homologous Temperature Deformation Behavior Using the Viscoplasticity Theory Based on Overstress (VBO): Part III. Simplified Model
,”
Journal of Engineering Materials and Technology
, Vol.
120
, pp.
193
196
.
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