Stress-strain diagrams showing the influence of strain rate at five different high homologous temperatures for a Sn-Pb solder alloy are used to determine the material parameters in a minimal version of the viscoplasticity theory based on overstress (VBO), accounting for static recovery effects. VBO is a “unified” state variable theory that does not use a yield surface and has three state variables with appropriate growth laws. It is shown that the effects of strain rate can be modeled well by this theory that requires eight material parameters to describe the inelastic behavior. The behavior in tensile and cyclic strain-controlled loadings, ratcheting, and creep is predicted. The results compare very well with the experiments for tensile and cyclic loading. For the other tests no comparisons were made due to the lack of proper experimental data. The model is formulated in tensorial form and can be used for inelastic stress analyses of solder joints.
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June 1999
Technical Papers
Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)
L. Maciucescu,
L. Maciucescu
Mechanics of Materials Laboratory, Department of Mechanical Engineering, Aeronautical Engineering and Mechanics, Rensselaer Polytechnic Institute, Troy, NY 12180-3590
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T.-L. Sham,
T.-L. Sham
Mechanics of Materials Laboratory, Department of Mechanical Engineering, Aeronautical Engineering and Mechanics, Rensselaer Polytechnic Institute, Troy, NY 12180-3590
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E. Krempl
E. Krempl
Mechanics of Materials Laboratory, Department of Mechanical Engineering, Aeronautical Engineering and Mechanics, Rensselaer Polytechnic Institute, Troy, NY 12180-3590
Search for other works by this author on:
L. Maciucescu
Mechanics of Materials Laboratory, Department of Mechanical Engineering, Aeronautical Engineering and Mechanics, Rensselaer Polytechnic Institute, Troy, NY 12180-3590
T.-L. Sham
Mechanics of Materials Laboratory, Department of Mechanical Engineering, Aeronautical Engineering and Mechanics, Rensselaer Polytechnic Institute, Troy, NY 12180-3590
E. Krempl
Mechanics of Materials Laboratory, Department of Mechanical Engineering, Aeronautical Engineering and Mechanics, Rensselaer Polytechnic Institute, Troy, NY 12180-3590
J. Electron. Packag. Jun 1999, 121(2): 92-98 (7 pages)
Published Online: June 1, 1999
Article history
Received:
July 21, 1997
Revised:
January 11, 1999
Online:
November 5, 2007
Citation
Maciucescu, L., Sham, T., and Krempl, E. (June 1, 1999). "Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)." ASME. J. Electron. Packag. June 1999; 121(2): 92–98. https://doi.org/10.1115/1.2792673
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