The presence of dissimilar material systems and thermal gradients introduce thermal stresses in multi-layered electronic assemblies and packages during fabrication and operation. The high stress gradients near the free edge of bonding interfaces of such structures may cause cracking and delamination leading to the failure or malfunction of electronic assemblies and packages. A simple but accurate engineering approach for the calculation of interlaminar thermal stresses due to thermal mismatch in multi-layered structures is needed so that designers can determine interlaminar thermal stresses easily without much computational efforts. A few approaches based on the generalized deformation theory have been published but most of them are only suitable for structures with symmetric layers. For electronic packages and assemblies, unsymmetric layers are often used. An improved approach, Classical Laminate Theory-Edge Stress Shape (CLT-ESS), for prediction of interlaminar thermal stresses that can be applied to multi-layered structures with unsymmetric layers is presented. Comparisons are made with finite element analysis results and are found to be favorable. The proposed approach provides an efficient way for the calculation of interlaminar thermal stresses. [S1043-7398(00)00901-4]
Skip Nav Destination
e-mail: suresh.sitaraman@me.gatech.edu
Article navigation
March 2000
Technical Papers
Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures
Weidong Xie,
Weidong Xie
Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
Search for other works by this author on:
Suresh K. Sitaraman
e-mail: suresh.sitaraman@me.gatech.edu
Suresh K. Sitaraman
Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
Search for other works by this author on:
Weidong Xie
Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
Suresh K. Sitaraman
Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
e-mail: suresh.sitaraman@me.gatech.edu
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EEPD November 8, 1999; revision received December 12, 1999. Associate Technical Editor: M. Shiratori.
J. Electron. Packag. Mar 2000, 122(1): 61-66 (6 pages)
Published Online: December 12, 1999
Article history
Received:
November 8, 1999
Revised:
December 12, 1999
Citation
Xie , W., and Sitaraman, S. K. (December 12, 1999). "Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures ." ASME. J. Electron. Packag. March 2000; 122(1): 61–66. https://doi.org/10.1115/1.483133
Download citation file:
Get Email Alerts
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
Related Articles
Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging
J. Electron. Packag (March,2003)
Energy Release Rates for an Edge Delamination of a Laminated Beam Subjected to Thermal Gradient
J. Appl. Mech (September,2005)
Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages
J. Electron. Packag (March,2000)
On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion
J. Electron. Packag (June,2008)
Related Proceedings Papers
Related Chapters
Flexibility Analysis
Process Piping: The Complete Guide to ASME B31.3, Third Edition
Analysis of Components in VIII-2
Guidebook for the Design of ASME Section VIII Pressure Vessels, Third Edition
Subsection NB—Class 1 Components
Companion Guide to the ASME Boiler & Pressure Vessel Codes, Volume 1 Sixth Edition