In this paper, we present recent experimental results on forced convective heat transfer in novel finned metal foam heat sinks. Experiments were conducted on aluminum foams of 90 percent porosity and pore size corresponding to 5 PPI (200 PPM) and 20 PPI (800 PPM) with one, two, four and six fins, where PPI (PPM) stands for pores per inch (pores per meter) and is a measure of the pore density of the porous medium. All of these heat sinks were fabricated in-house. The forced convection results show that heat transfer is significantly enhanced when fins are incorporated in metal foam. The heat transfer coefficient increases with increase in the number of fins until adding more fins retards heat transfer due to interference of thermal boundary layers. For the 20 PPI samples, this maximum was reached for four fins. For the 5 PPI heat sinks, the trends were found to be similar to those for the 20 PPI heat sinks. However, due to larger pore sizes, the pressure drop encountered is much lower at a particular air velocity. As a result, for a given pressure drop, the heat transfer coefficient is higher compared to the 20 PPI heat sink. For example, at a of 105 Pa, the heat transfer coefficients were found to be and for the 5 PPI and 20 PPI 4-finned heat sinks, respectively. The finned metal foam heat sinks outperform the longitudinal finned and normal metal foam heat sinks by a factor between 1.5 and 2, respectively. Finally, an analytical expression is formulated based on flow through an open channel and incorporating the effects of thermal dispersion and interfacial heat transfer between the solid and fluid phases of the porous medium. The agreement of the proposed relation with the experimental results is promising.
Skip Nav Destination
e-mail: bhattach@colorado.edu
e-mail: mahajan@spot.colorado.edu
Article navigation
September 2002
Technical Papers
Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection
A. Bhattacharya, Research Assistant,
e-mail: bhattach@colorado.edu
A. Bhattacharya, Research Assistant
CAMPmode, Mechanical Engineering Department, University of Colorado, Campus Box 427, Boulder, CO 80309–0427
Search for other works by this author on:
R. L. Mahajan, Professor
e-mail: mahajan@spot.colorado.edu
R. L. Mahajan, Professor
CAMPmode, Mechanical Engineering Department, University of Colorado, Campus Box 427, Boulder, CO 80309–0427
Search for other works by this author on:
A. Bhattacharya, Research Assistant
CAMPmode, Mechanical Engineering Department, University of Colorado, Campus Box 427, Boulder, CO 80309–0427
e-mail: bhattach@colorado.edu
R. L. Mahajan, Professor
CAMPmode, Mechanical Engineering Department, University of Colorado, Campus Box 427, Boulder, CO 80309–0427
e-mail: mahajan@spot.colorado.edu
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD September 5, 2000. Associate Editor: A. Ortega.
J. Electron. Packag. Sep 2002, 124(3): 155-163 (9 pages)
Published Online: July 26, 2002
Article history
Received:
September 5, 2000
Online:
July 26, 2002
Citation
Bhattacharya, A., and Mahajan, R. L. (July 26, 2002). "Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection ." ASME. J. Electron. Packag. September 2002; 124(3): 155–163. https://doi.org/10.1115/1.1464877
Download citation file:
Get Email Alerts
Optimization of Micropillars Electroplating Bonding Processes and Additives
J. Electron. Packag (June 2025)
Microbead Encapsulation for Protection of Electronic Components
J. Electron. Packag (June 2025)
Related Articles
Modeling Forced
Convection in Finned Metal Foam Heat Sinks
J. Electron. Packag (June,2009)
The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks
J. Electron. Packag (December,2010)
Heat Transfer Performance of Aluminum Foams
J. Heat Transfer (June,2011)
Enhanced Heat Transfer Using Porous Carbon Foam in Cross Flow—Part I: Forced Convection
J. Heat Transfer (June,2007)
Related Proceedings Papers
Related Chapters
Cooling of a Chip Utilizing a Heat Sink with Rectangular Fins
Everyday Heat Transfer Problems: Sensitivities to Governing Variables
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment, Second Edition