A thermomechanical fatigue life prediction model based on the theory of damage mechanics is presented. The damage evolution, corresponding to the material degradation under cyclic thermomechanical loading, is quantified thermodynamic framework. The damage, as an internal state variable, is coupled with unified viscoplastic constitutive model to characterize the response of solder alloys. The damage-coupled viscoplastic model with kinematic and isotropic hardening is implemented in ABAQUS finite element package to simulate the cyclic softening behavior of solder joints. Several computational simulations of uniaxial monotonic tensile and cyclic shear tests are conducted to validate the model with experimental results. The behavior of an actual ball grid array (BGA) package under thermal fatigue loading is also simulated and compared with experimental results.
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March 2003
Technical Papers
A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints
Hong Tang,
Hong Tang
NEC Electronics Corporation, Detroit, MI
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Cemal Basaran, Mem. ASME, Associate Professor and Director,
Cemal Basaran, Mem. ASME, Associate Professor and Director,
UB Electronic Packaging Laboratory, University at Buffalo, SUNY, Buffalo, NY 14260
Search for other works by this author on:
Hong Tang
NEC Electronics Corporation, Detroit, MI
Cemal Basaran, Mem. ASME, Associate Professor and Director,
UB Electronic Packaging Laboratory, University at Buffalo, SUNY, Buffalo, NY 14260
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division, December 10, 2001. Associate Editor: Y.-H. Pao.
J. Electron. Packag. Mar 2003, 125(1): 120-125 (6 pages)
Published Online: March 14, 2003
Article history
Received:
December 10, 2001
Online:
March 14, 2003
Citation
Tang, H., and Basaran, C. (March 14, 2003). "A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints ." ASME. J. Electron. Packag. March 2003; 125(1): 120–125. https://doi.org/10.1115/1.1536171
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