In this work, a simple assembled structure was designed and fabricated so that the calibration procedures on piezoresistive stress sensors for microelectronic packaging can be simpler, more accurate, and more efficient. After comparing with the previous work results, validity of the aforementioned new structure has been demonstrated through experimental data. Since many accessory experimental facilities employed in traditional calibrations become unnecessary, the new methodology takes great advantage on piezoresistive coefficient extractions, especially for calibration at temperature other than room temperature.

Issue Section:
Additional Technical Papers
Keywords:
piezoresistive devices, stress measurement, electric sensing devices, calibration, integrated circuit packaging, integrated circuit measurement
Topics:
Calibration, Sensors, Stress, Temperature
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 by ASME
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