The reliability of solder joints in electronic packaging is becoming more important as the ball grid array (BGA) develops rapidly into the most popular packaging technology. Thermal fatigue of solder joints has been a reliability concern in the electronic packaging industry since the introduction of surface mount technology (SMT). Microstructural coarsening (phase growth) is considered to be closely related to thermomechanical fatigue failure. Many researchers proposed coarsening models for bulk scale metals. But these models have never been verified for micron-scale actual BGA solder balls. In the present study, three different phase growth models are investigated experimentally on BGA solder balls in a real-life electronic package. Model simulations obtained from three models were compared against test data. The best performing model was chosen for finite element fatigue reliability studies based on continuum damage mechanics.
Skip Nav Destination
e-mail: cjb@eng.buffalo.edu
Article navigation
September 2003
Technical Papers
Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation
Cemal Basaran, Associate Professor,
Cemal Basaran, Associate Professor
Electronic Packaging Laboratory, 212 Ketter Hall, University at Buffalo, State University of New York, Buffalo, NY 14260, USA
Search for other works by this author on:
Yujun Wen, Ph.D. Candidate
e-mail: cjb@eng.buffalo.edu
Yujun Wen, Ph.D. Candidate
Electronic Packaging Laboratory, 212 Ketter Hall, University at Buffalo, State University of New York, Buffalo, NY 14260, USA
Search for other works by this author on:
Cemal Basaran, Associate Professor
Electronic Packaging Laboratory, 212 Ketter Hall, University at Buffalo, State University of New York, Buffalo, NY 14260, USA
Yujun Wen, Ph.D. Candidate
Electronic Packaging Laboratory, 212 Ketter Hall, University at Buffalo, State University of New York, Buffalo, NY 14260, USA
e-mail: cjb@eng.buffalo.edu
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received Aug. 2002. Associate Editor: B. Michel.
J. Electron. Packag. Sep 2003, 125(3): 426-430 (5 pages)
Published Online: September 17, 2003
Article history
Received:
August 1, 2002
Online:
September 17, 2003
Citation
Basaran, C., and Wen, Y. (September 17, 2003). "Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation ." ASME. J. Electron. Packag. September 2003; 125(3): 426–430. https://doi.org/10.1115/1.1602707
Download citation file:
Get Email Alerts
Cited By
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Related Articles
Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation
J. Electron. Packag (September,2007)
Reliability Prediction of Area Array Solder Joints
J. Electron. Packag (December,2003)
Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array
J. Electron. Packag (December,2004)
Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies
J. Electron. Packag (December,2006)
Related Proceedings Papers
Related Chapters
Industrially-Relevant Multiscale Modeling of Hydrogen Assisted Degradation
International Hydrogen Conference (IHC 2012): Hydrogen-Materials Interactions
Reliability of Electronic Packaging
Essentials of Electronic Packaging: A Multidisciplinary Approach
STRUCTURAL RELIABILITY ASSESSMENT OF PIPELINE GIRTH WELDS USING GAUSSIAN PROCESS REGRESSION
Pipeline Integrity Management Under Geohazard Conditions (PIMG)