Interface delamination failure caused by thermomechanical loading and mismatch of thermal expansion coefficients and other material properties is one of the important failure modes occurring in electronic packages, thus a threat for package reliability. To solve this problem, both academic institutions and industry have been spending tremendous research effort in order to understand the inherent failure mechanisms and to develop advanced and reliable experimental and simulation methodologies, thus to be able to predict and to avoid interface delamination before physical prototyping. Various damage mechanisms can be involved and can result in interface delamination phenomena. These are not all sufficiently addressed and/or reported so far, probably because of the complexities caused by the occurrence of strong geometric and materials nonlinearities. One of the phenomena being insufficiently understood so far is the so-called buckling-driven delamination of thin metalic layers on ceramic substrates. This phenomenon will be discussed in the present paper.
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e-mail: C.J.Liu@wbmt.tudelft.nl
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December 2003
Technical Papers
Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate
C. J. Liu,
e-mail: C.J.Liu@wbmt.tudelft.nl
C. J. Liu
Delft University of Technology, Faculty DEP, Department of Mechanics and Control, Mekelweg 2, 2628CD Delft, The Netherlands
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L. J. Ernst,
L. J. Ernst
Delft University of Technology, Faculty DEP, Department of Mechanics and Control, Mekelweg 2, 2628CD Delft, The Netherlands
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G. Wisse,
G. Wisse
Delft University of Technology, Faculty DEP, Department of Mechanics and Control, Mekelweg 2, 2628CD Delft, The Netherlands
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G. Q. Zhang,
G. Q. Zhang
Philips CFT, P.O. Box 218/SAQ, 5600 MD, Eindhoven, The Netherlands
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M. Vervoort
M. Vervoort
Philips CFT, P.O. Box 218/SAQ, 5600 MD, Eindhoven, The Netherlands
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C. J. Liu
Delft University of Technology, Faculty DEP, Department of Mechanics and Control, Mekelweg 2, 2628CD Delft, The Netherlands
e-mail: C.J.Liu@wbmt.tudelft.nl
L. J. Ernst
Delft University of Technology, Faculty DEP, Department of Mechanics and Control, Mekelweg 2, 2628CD Delft, The Netherlands
G. Wisse
Delft University of Technology, Faculty DEP, Department of Mechanics and Control, Mekelweg 2, 2628CD Delft, The Netherlands
G. Q. Zhang
Philips CFT, P.O. Box 218/SAQ, 5600 MD, Eindhoven, The Netherlands
M. Vervoort
Philips CFT, P.O. Box 218/SAQ, 5600 MD, Eindhoven, The Netherlands
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received November 2002. Associate Editor: L. Ernst.
J. Electron. Packag. Dec 2003, 125(4): 512-519 (8 pages)
Published Online: December 15, 2003
Article history
Received:
November 1, 2002
Online:
December 15, 2003
Citation
Liu, C. J., Ernst , L. J., Wisse, G., Zhang , G. Q., and Vervoort, M. (December 15, 2003). "Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate ." ASME. J. Electron. Packag. December 2003; 125(4): 512–519. https://doi.org/10.1115/1.1604152
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