In this work, a novel compact modeling method based on the volume-averaging technique is presented. Its application to the analysis of fluid flow and heat transfer in pin fin heat sinks are further analyzed. The pin fin heat sink is modeled as a porous medium. The volume-averaged momentum and energy equations for fluid flow and heat transfer in pin fin heat sinks are obtained by using the local volume-averaging method. The permeability, the Ergun constant, and the interstitial heat transfer coefficient required to solve these equations are determined experimentally and correlations for them are presented. To validate the compact model proposed in this paper, 20 aluminum pin fin heat sinks having a 101.43 mm×101.43 mm base size are tested with an inlet velocity ranging from 1 m/s to 5 m/s. In the experimental investigation, the heat sink is heated uniformly at the bottom. Pressure drop and heat transfer characteristics of pin fin heat sinks obtained from the porous medium approach are compared with experimental results. Upon comparison, the porous medium approach is shown to predict accurately the pressure drop and heat transfer characteristics of pin fin heat sinks. Finally, for minimal thermal resistance, the optimum surface porosities of the pin fin heat sink are obtained under constraints on pumping power and heat sink size. The optimized pin fin heat sinks are shown to be superior to the optimized straight fin heat sinks in thermal performance by about 50% under the same constraints on pumping power and heat sink size.
Skip Nav Destination
Article navigation
September 2004
Research Papers
Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks
Duckjong Kim,
Duckjong Kim
Thermo-Fluid System Department, Korea Institute of Machinery and Materials, Daejeon, 305-660, Korea
Search for other works by this author on:
Sung Jin Kim,
Sung Jin Kim
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 305-701, Korea
Search for other works by this author on:
Alfonso Ortega
Alfonso Ortega
Department of Aerospace and Mechanical Engineering, The Center for Electronics Packaging Research, University of Arizona, Tucson, AZ 85721
Search for other works by this author on:
Duckjong Kim
Thermo-Fluid System Department, Korea Institute of Machinery and Materials, Daejeon, 305-660, Korea
Sung Jin Kim
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 305-701, Korea
Alfonso Ortega
Department of Aerospace and Mechanical Engineering, The Center for Electronics Packaging Research, University of Arizona, Tucson, AZ 85721
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received Oct. 2003; final revision, Feb. 2004. Associate Editor: M. Saka.
J. Electron. Packag. Sep 2004, 126(3): 342-350 (9 pages)
Published Online: October 6, 2004
Article history
Received:
October 1, 2003
Revised:
February 1, 2004
Online:
October 6, 2004
Citation
Kim, D., Kim, S. J., and Ortega, A. (October 6, 2004). "Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks ." ASME. J. Electron. Packag. September 2004; 126(3): 342–350. https://doi.org/10.1115/1.1772415
Download citation file:
Get Email Alerts
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
J. Electron. Packag (June 2025)
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag (June 2025)
Related Articles
Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks
J. Electron. Packag (June,2004)
Numerical Analysis of Convective Heat Transfer From an Elliptic Pin Fin Heat Sink With and Without Metal Foam Insert
J. Heat Transfer (July,2010)
The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks
J. Electron. Packag (December,2010)
Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection
J. Electron. Packag (September,2006)
Related Proceedings Papers
Related Chapters
When Is a Heat Sink Not a Heat Sink?
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Too Much of a Good Thing
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment, Second Edition