For through-silicon optical probing of microprocessors, the heat generated by devices with power over 100W must be dissipated 1. To accommodate optical probing, a seemingly elaborate cooling system that controls the microprocessor temperature from 60 to 100°C for device power up to 150 W was designed 2. The system parameters to achieve the desired thermal debug environment were cooling air temperature and air flow. A mathematical model was developed to determine both device temperature and input power. The 3D heat equation that governs the temperature distribution was simplified to a case of a 1D rod with one end at the device center and the other at the cooling air intake. Thus the cooling system was reduced to an analytical expression. From experimental data, we computed all coefficients in the model, then ran extensive tests to verify—the accuracy was better than 10% over the entire temperature and power ranges.

Issue Section:
Research Paper
Keywords:
integrated circuit packaging, semiconductor device packaging, heat exchangers, heat transfer, temperature control, rods (structures), flow simulation, IC Cooling, Heat Spreader, Mathematical Thermal Model, 1D Non-Uniform Rod
Topics:
Air flow, Cooling systems, Flat heat pipes, Flow (Dynamics), Heat exchangers, Temperature, Cooling, Heat, Silicon
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 by ASME
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