Computational Fluid Dynamics (CFD) codes have proved their high potential as a tool of thermal design of electronic equipment. However, as the product development cycle is shortened, the CFD-based thermal design needs a new format that allows the packaging designer fast and versatile searches for better design options. The most serious factor that slows the CFD-based design is geometric complexity created by packing various components in a tight space of the system box. In a proposed methodology coined “Build-up Approach (BUA),” CFD simulations are conducted on a set of hardware models to gain insight into the effects of component placement on the junction temperature. Two algorithms are introduced before and after CFD simulations: one defines the geometric parameters through singular value decomposition (SVD) of components placement patterns and the other identifies important geometric parameters by means of the Taguchi method. A case study was conducted on a simple hardware model (benchmark model) that embodies essential features of portable electronic equipment. The results proved the effectiveness of these algorithms in measuring the relative importance of geometric parameters and weeding out unimportant geometric details.

Issue Section:
Research Paper
Keywords:
computational fluid dynamics, electronics packaging, product development, thermal analysis, singular value decomposition, Taguchi methods, flow simulation, product design, computational geometry
Topics:
Computational fluid dynamics, Design, Electronic equipment, Simulation, Thermal analysis, Taguchi methods, Temperature, Thermal resistance
1.
Nakayama
,
W.
,
1996
, “
Thermal Management of Electronic Equipment: Research Needs in the Mid-1990s and Beyond
,”
Appl. Mech. Rev.
,
49
(10), Pt. 2, pp.
S167–S174
S167–S174
.
2.
Nakayama, W., 2001, “An Approach to Fast Thermal Design of Compact Electronic Systems: A JSME Project,” Proc. InterPACK, July, Kauai, HI, ASME Paper No. IPACK2001-15532.
3.
Nakayama, W., 2001, “Emerging New Roles of CFD Simulation in Competitive Market Environment,” Proc. 7th THERMINIC Workshop, September 24–27, 2001, Paris, France, pp. 223–229.
4.
Nakayama, W., 2003, “The Build-up Approach to Combat Complexity and Uncertainties in Thermal Analysis of Compact Electronic Equipment: A JSME Project,” 6th ASME-JSME Thermal Engineering Joint Conference, March 16–20, 2003, Hawaii, Paper TED-AJ03-566.
5.
Vinke
,
H.
, and
Lasance
,
C. J. M.
,
1997
, “
Compact Models for Accurate Thermal Characterization of Electronic Parts
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part A
,
20
, pp.
411
–
419
.
6.
Nakayama
,
W.
,
2000
, “
Thermal Issues in Microsystems Packaging
,”
IEEE Trans. Adv. Packag.
,
23
(
4
), pp.
602
–
607
.
7.
Nakayama
,
W.
,
2003
, “
A Methodology to Cope With Geometrically Complex Heat Transfer Systems; The Cases of Heat Conduction Through Composite Slabs
,”
Int. J. Heat Mass Transfer
,
46
, pp.
3397
–
3409
.
8.
Taguchi, G., 1987, Systems of Experimental Design: Engineering Methods to Optimize Quality and Minimize Cost, UNIPUB/Kraus International, White Plains, New York (The original Japanese 3rd version was published from Maruzen, Tokyo, 1976).
9.
Kraycir, J. R., Cleverley, D. S., Levine, R. F., and Lorenzen, J. A., 1997, “Package Manufacture,” Chapter 6 of Microelectronics Packaging Handbook, Technology Drivers, Part I, R. R. Tummala, E. J. Rymaszewski, and A. G. Klopfenstein (eds.), Chapman & Hall, New York, pp. I-556–619.
10.
May, G. S., 2002, “Fundamentals of Package Manufacturing,” Chapter 20 of Fundamentals of Microsystems Packaging, R. R. Tummala (ed.), McGraw-Hill, New York, pp. 780–844.
11.
Yu, Q., Kashiwamura, T., Shiratori, M., and Yamada, T., 1999, “Optimal and Robust Design of Nonlinear Structures Under Uncertain Loads Using Statistical Optimization Method,” Computer Aided Optimum Design of Structures VI, S. Hernandez, A. J. Kassab, and C. A. Brebbia (eds.), WIT Press, Southampton, Boston, pp. 97–105.
12.
Design Director Plus, Statistical Design Support System, User Manual, NHK Co., Tokyo, Japan, 2001.
13.
Kirby, M., 2001, Geometric Data Analysis, Wiley, New York, pp. 51–61.
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