This paper studies creep-fatigue life prediction under shear loading by making extensive torsion creep-fatigue experiments using four kinds of strain waves. The linear damage rule, strain range partitioning method, frequency modified fatigue life, and ductility exhaustion model were applied to the experimental data, but no methods accurately predicted the creep-fatigue life. A new method based on the strain rate ratio, which predicted the creep-fatigue life within a factor of 4 scatter band, was developed.
Issue Section:
Research Papers
1.
Frear
, D. R.
, Jones
, W. B.
, and Kinsman
, K. R.
, 1991, “Solder Mechanics–A State of the Art Assessment
,” TMS.2.
Solomon
, H. D.
, 1987, “Fatigue of 60∕40 Solder
,” IEEE Trans. Compon., Hybrids, Manuf. Technol.
0148-6411, 9
(4
), pp. 423
–432
.3.
Nose
, H.
, Furusawa
, H.
, Sakane
, M.
, Nishimura
, H.
, and Tsukada
, Y.
, 1997, “Effect of Temperature and Strain Rate on Inelastic Constitutive Relationship of Sn-Pb Solders
,” Proceedings of the 35th Symposium on Strength of Materials at High Temperatures
, JSMS, pp.104
–108
.4.
Shi
, X. Q.
, Zhou
, W.
, Pang
, H. L. J.
, and Wang
, A. P
, 1999, “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn∕37Pb Solder Alloy
,” ASME J. Electron. Packag.
1043-7398, 121
, pp. 179
–185
.5.
Shi
, X. Q.
, Zhou
, W.
, Pang
, H. L. J.
, and Wang
, A. P
, 1999, “A Modified Energy-Based Low Cycle Fatigue Model for Eutectic Solder Alloy
,” Scr. Mater.
1359-6462, 41
, pp. 289
–296
.6.
Nose
, H.
, Sakane
, M.
, Tsukada
, Y.
, and Nishimura
, H.
, 2003, “Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders
,” ASME J. Electron. Packag.
1043-7398, 25
, pp. 59
–66
.7.
Takada
, A.
, Sakane
, M.
, Tsukada
, Y.
, and Nishimura
, H.
, 1998, “Creep and Creep Rupture Property of 63Sn-37Pb and 5Sn-95Pb Solders
,” Proceedings of the 36th Symposium on Strength of Materials at High Temperatures
, JSMS, pp. 20
–24
.8.
Yamamoto
, T.
, Sakane
, M.
, Ohnami
, M.
, and Yamada
, T.
, 1995, “Multiaxial Low Cycle Fatigue of 63Sn-37Pb Solder
,” J. Soc. Mater. Sci. Jpn.
0514-5163, 44
(503
), pp. 1080
–1085
.9.
Yamamoto
, T.
, Sakane
, M.
, Ohnami
, M.
, Tsukada
, Y.
, and Nishimura
, H.
, 1997, “Multiaxial Creep-Fatigue of 63Sn-37Pb Solder at Elevated Temperature
,” J. Soc. Mater. Sci. Jpn.
0514-5163 46
(8
), pp. 969
–975
.10.
Yamamoto
, T.
, Sakane
, M.
, Ohnami
, M.
, Yamashita
, M.
, and Shiokawa
, K.
, 1997, “Multiaxial Low Cycle Fatigue of Five Kinds of Solder
,” J. Soc. Mater. Sci. Jpn.
0514-5163, 46
(12
), pp. 1381
–1388
.11.
Kanchanomal
, C.
, Miyashita
, Y.
, and Mutoh
, Y.
, 2002, “Low-Cycle Fatigue Behavior and Mechanisms of a Lead-Free Solder 96.5Sn-3.5Ag
,” J. Electron. Mater.
0361-5235, 31
, pp. 142
–151
.12.
Kanchanomal
, C.
, Miyashita
, Y.
, and Mutoh
, Y.
, 2002, “Low-Cycle Fatigue Behavior of Sn-Ag, Sn-Ag-Cu-Bi Lead-Free Solders
,” J. Electron. Mater.
0361-5235, 31
, pp. 456
–465
.13.
Shi
, X. Q.
, Zhou
, W.
, Pang
, H. L. J.
, and Wang
, A.
, 2000, “Low Cycle Fatigue Analysis of Temperature and Frequncy Effects in Eutectic Solder Alloy
,” Int. J. Fatigue
0142-1123, 22
, pp. 217
–228
.14.
Coffin
, L. F.
, Jr., 1973, “Fatigue at High Temperature
,” ASTM STP, No.520, pp. 5
–34
.15.
Manson
, S. S.
, 1973, “A Challenge to Unify Treatment of High Temperature Fatigue–A Partisan Proposal Based on Strain Range Partitioning in Fatigue at Elevated Temperatures
,” ASTM STP, No. 520, pp. 744
–775
.16.
Polhemus
, J. F.
, Spaeth
, C. E.
, and Vogel
, W. H.
, 1973, “Ductility Exhaustion Model for Prediction of Thermal Fatigue and Creep Interaction
,” ASTM STP, No.520, pp.625
-636
.17.
ISIJ, 1981, “
Low Cycle Fatigue Life Prediction by Strain Range Partitioning Method
,” Collaboration Report of the Creep-Fatigue Subcommittee of Iron and Steel Institute of Japan.18.
Shiratsuchi
, T.
, Sakane
, M.
, Tsukada
, Y.
, and Nishimura
, H.
, 1995 “Life Evaluation of 63Sn-37Pb Solder Under Push-Pull Creep-Fatigue,” Proc. 37th Symposium on Strength of Materials at High Temperatures, Japan Society of Materials Science
, pp. 116
–120
.Copyright © 2005
by American Society of Mechanical Engineers
You do not currently have access to this content.
