Nonconductive film (NCF) is a challenging potential material to substitute the application of anisotropic conductive film in the ultrafine pitch chip-on-glass (COG) packaging. The NCF interconnection requires a high bonding temperature and pressure to form joints, and this causes new reliability concerns. This study investigated effects of the thermocompression bonding parameters on the microstructure and geometric size in the joints to a COG module packaged with NCF. The results revealed that the high temperature and pressure compressed the joints to become wider and shorter. A dual layer of intermetallic compounds consisting of ( phase) and ( phase) was found in each joint. They were the two kinds of interphases with different melting points ( and ) during the interfacial reaction between Au and Sn. At the low temperature (below the melting point), the high pressure induced the residual inner stress to generate the cracks in the joints, and this also increased the contact resistance of the joints. The contact resistance increased with the pressure elevating at the same temperature and with the temperature degrading at the same pressure. In the COG packaging with NCF, a proper elevating of the bonding temperature could produce a stable direct connection with the low contact resistance.
Skip Nav Destination
e-mail: yanglianqiao@shu.edu.cn
Article navigation
December 2010
Technical Briefs
Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film
Jianhua Zhang,
Jianhua Zhang
Key Laboratory of Advanced Display and System Applications of Ministry of Education,
Shanghai University
, No. 149 Yanchang Road, Shanghai, P.R. China; School of Mechatronics Engineering and Automation, Shanghai University
, No. 149 Yanchang Road, Shanghai, P.R. China
Search for other works by this author on:
Jinsong Zhang,
Jinsong Zhang
School of Mechatronics Engineering and Automation,
Shanghai University
, No. 149 Yanchang Road, Shanghai, P.R. China
Search for other works by this author on:
Lianqiao Yang
Lianqiao Yang
Key Laboratory of Advanced Display and System Applications of Ministry of Education,
e-mail: yanglianqiao@shu.edu.cn
Shanghai University
, No. 149 Yanchang Road, Shanghai, P.R. China
Search for other works by this author on:
Jianhua Zhang
Key Laboratory of Advanced Display and System Applications of Ministry of Education,
Shanghai University
, No. 149 Yanchang Road, Shanghai, P.R. China; School of Mechatronics Engineering and Automation, Shanghai University
, No. 149 Yanchang Road, Shanghai, P.R. China
Jinsong Zhang
School of Mechatronics Engineering and Automation,
Shanghai University
, No. 149 Yanchang Road, Shanghai, P.R. China
Lianqiao Yang
Key Laboratory of Advanced Display and System Applications of Ministry of Education,
Shanghai University
, No. 149 Yanchang Road, Shanghai, P.R. Chinae-mail: yanglianqiao@shu.edu.cn
J. Electron. Packag. Dec 2010, 132(4): 044501 (6 pages)
Published Online: December 3, 2010
Article history
Received:
February 24, 2010
Revised:
September 24, 2010
Online:
December 3, 2010
Published:
December 3, 2010
Citation
Zhang, J., Zhang, J., and Yang, L. (December 3, 2010). "Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film." ASME. J. Electron. Packag. December 2010; 132(4): 044501. https://doi.org/10.1115/1.4002898
Download citation file:
Get Email Alerts
Cited By
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
J. Electron. Packag (June 2025)
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag (June 2025)
Related Articles
Photo-Acoustic Measurement of Thermal Conductivity of Thin Films and Bulk Materials
J. Heat Transfer (February,2001)
Effect of Nonuniform Stack Compression on Proton Exchange Membrane Fuel Cell Temperature Distributions
J. Heat Transfer (December,2008)
Advances in Bonding Technology for Electronic Packaging
J. Electron. Packag (June,1993)
Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials
J. Electron. Packag (September,2010)
Related Proceedings Papers
Related Chapters
Further Applications of Spreading Resistance
Thermal Spreading and Contact Resistance: Fundamentals and Applications
Package-to-Board Interconnection
Essentials of Electronic Packaging: A Multidisciplinary Approach
A Study of Irradiation-Induced Growth of Modified and Advanced Zr-Nb System Alloys after Irradiation in the VVER-1000 Reactor Core at Temelin NPP
Zirconium in the Nuclear Industry: 20th International Symposium