Topics: Flat heat pipes , Flip-chip devices , Reliability , Solder joints , Delamination , Failure mechanisms , Fatigue life , Flip-chip packages , Mechanical properties , Shapes

Adhesion and Reliability of Polymer/Inorganic Interfaces

S.-Y. Kook, J. M. Snodgrass, A. Kirtikar, R. H. Dauskardt

J. Electron. Packag. December 1998, 120(4): 328–335. doi: https://doi.org/10.1115/1.2792642

Abstract

View articletitled, Adhesion and Reliability of Polymer/Inorganic Interfaces

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Topics: Adhesion , Polymers , Reliability , Fracture (Materials) , Fracture (Process) , Fatigue , Fracture toughness , Cycles , Deformation , Fracture mechanics

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan

J. Electron. Packag. December 1998, 120(4): 336–341. doi: https://doi.org/10.1115/1.2792643

Abstract

View articletitled, Potential Failure Sites in a Flip-Chip Package With and Without Underfill

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Topics: Failure , Flip-chip packages , Stress , Density , Finite element analysis

The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints

S. Rzepka, M. A. Korhonen, E. Meusel, C.-Y. Li

J. Electron. Packag. December 1998, 120(4): 342–348. doi: https://doi.org/10.1115/1.2792644

Abstract

View articletitled, The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints

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Topics: Delamination , Flip-chip , Solder joints , Thermal stresses , Solders , Stress , Adhesion , Damage , Failure , Finite element analysis

Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses

J. Jiao, C. K. Gurumurthy, E. J. Kramer, Y. Sha, C. Y. Hui, P. Borgesen

J. Electron. Packag. December 1998, 120(4): 349–353. doi: https://doi.org/10.1115/1.2792645

Abstract

View articletitled, Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses

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Topics: Cantilever beams , Epoxy adhesives , Epoxy resins , Fracture (Materials) , Fracture toughness , Stress , Thermal stresses

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

A.-F. Bastawros, K.-S. Kim

J. Electron. Packag. December 1998, 120(4): 354–359. doi: https://doi.org/10.1115/1.2792646

Abstract

View articletitled, Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

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Topics: Damage , Electric current , Fracture (Materials) , Thin films , Electrodes , Temperature , Aluminum , Melting , Brittle fracture , Coating processes

A New Approach to Calculate Atomic Flux Divergence by Electromigration

K. Sasagawa, N. Nakamura, M. Saka, H. Abe´

J. Electron. Packag. December 1998, 120(4): 360–366. doi: https://doi.org/10.1115/1.2792647

Abstract

View articletitled, A New Approach to Calculate Atomic Flux Divergence by Electromigration

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Topics: Electrodiffusion , Corners (Structural elements) , Current density , Temperature , Computational methods

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

S. Kamiya, H. Takahashi, M. Saka, H. Abe´

J. Electron. Packag. December 1998, 120(4): 367–371. doi: https://doi.org/10.1115/1.2792648

Abstract

View articletitled, Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

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Topics: Adhesives , Fracture (Materials) , Fracture (Process) , Particulate matter , Synthetic diamonds , Chemical vapor deposition , Diamond films , Nucleation (Physics) , Stress , Electronics

A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces

C. K. Gurumurthy, J. Jiao, L. G. Norris, C.-Y. Hui, E. J. Kramer

J. Electron. Packag. December 1998, 120(4): 372–378. doi: https://doi.org/10.1115/1.2792649

Abstract

View articletitled, A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces

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Topics: Fatigue testing , Polymers , Thermomechanics , Fracture (Materials) , Displacement , Cycles , Fatigue , Cantilever beams , Delamination , Failure

Technical Papers

A Thermodynamic Framework for Damage Mechanics of Solder Joints

C. Basaran, C.-Y. Yan

J. Electron. Packag. December 1998, 120(4): 379–384. doi: https://doi.org/10.1115/1.2792650

Abstract

View articletitled, A Thermodynamic Framework for Damage Mechanics of Solder Joints

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Topics: Damage mechanics , Solder joints , Damage , Fatigue life , Alloys , Entropy , Low cycle fatigue , Second law of thermodynamics , Solders , Statistical mechanics

Cooling Rate Effect on Post Cure Stresses in Molded Plastic IC Packages

S. Yi, K. Y. Sze

J. Electron. Packag. December 1998, 120(4): 385–390. doi: https://doi.org/10.1115/1.2792651

Abstract

View articletitled, Cooling Rate Effect on Post Cure Stresses in Molded Plastic IC Packages

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Topics: Cooling , Finite element analysis , Hardening (Curing) , Heat conduction , Manufacturing , Materials properties , Molded plastics , Molding , Residual stresses , Stress