Topics: Forced convection , Heat , Reynolds number , Computer simulation , Convection , Electronic components , Flow (Dynamics) , Fluid dynamics , Heat transfer , Porosity

Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory

C. Basaran, R. Chandaroy

J. Electron. Packag. March 1999, 121(1): 8–11. doi: https://doi.org/10.1115/1.2792663

Abstract

View articletitled, Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory

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Topics: Dynamic analysis , Surface mount packaging , Solder joints , Failure mechanisms , Constitutive equations , Cycles , Defense industry , Failure , Fatigue , Fatigue life

Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part II—Applications

C. Basaran, R. Chandaroy

J. Electron. Packag. March 1999, 121(1): 12–17. doi: https://doi.org/10.1115/1.2792654

Abstract

View articletitled, Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part II—Applications

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Topics: Dynamic analysis , Surface mount packaging , Solder joints , Constitutive equations , Cycles , Fatigue , Fatigue life , Finite element analysis , High cycle fatigue , Noise (Sound)

OMPAC Package C5 Reliability—Parametric Study

B. Nagaraj

J. Electron. Packag. March 1999, 121(1): 18–22. doi: https://doi.org/10.1115/1.2792655

Abstract

View articletitled, OMPAC Package C5 Reliability—Parametric Study

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Topics: Reliability , Cycles , Design , Solders , Failure , Temperature , Ball-Grid-Array packaging , Simulation , Computers , Creep

Characterizing the Failure Envelope of a Conductive Adhesive

D. Olliff, J. Qu, M. Gaynes, R. Kodnani, A. Zubelewicz

J. Electron. Packag. March 1999, 121(1): 23–30. doi: https://doi.org/10.1115/1.2792657

Abstract

View articletitled, Characterizing the Failure Envelope of a Conductive Adhesive

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Topics: Adhesives , Failure , Shear (Mechanics) , Coulombs , Tension , Bonding , Compression , Copper , Finite element model , Mechanical testing

An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life

A. J. Scholand, R. E. Fulton, B. Bras

J. Electron. Packag. March 1999, 121(1): 31–36. doi: https://doi.org/10.1115/1.2792658

Abstract

View articletitled, An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life

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Topics: Fatigue life , Genetic algorithms , Printed circuit boards , Algorithms , Approximation , Design , Energy consumption , Epoxy adhesives , Epoxy resins , Fatigue

Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications

N. R. Sottos, J. M. Ockers, M. Swindeman

J. Electron. Packag. March 1999, 121(1): 37–43. doi: https://doi.org/10.1115/1.2792659

Abstract

View articletitled, Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications

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Topics: Composite materials , Printed circuit boards , Thermoelasticity , Textiles , Geometry , Lumber , Elastic moduli , Epoxy adhesives , Epoxy resins , Fibers