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Issues
June 1999
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Technical Papers
Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading
J. Electron. Packag. June 1999, 121(2): 61–68.
doi: https://doi.org/10.1115/1.2792669
Mechanical Deformation in Conductive Adhesives as Measured With Electron-Beam Moire´
J. Electron. Packag. June 1999, 121(2): 69–74.
doi: https://doi.org/10.1115/1.2792670
Natural Convection Cooling of Vertical Rectangular Channels in Air Considering Radiation and Wall Conduction
J. Electron. Packag. June 1999, 121(2): 75–84.
doi: https://doi.org/10.1115/1.2792671
Failure Estimation of Semiconductor Chip During Wire Bonding Process
J. Electron. Packag. June 1999, 121(2): 85–91.
doi: https://doi.org/10.1115/1.2792672
Topics:
Failure
,
Semiconductors (Materials)
,
Wire bonding
,
Gallium arsenide
,
Pressure
,
Wire
,
Cycles
,
Deformation
,
Electronic packaging
,
Metals
Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)
J. Electron. Packag. June 1999, 121(2): 92–98.
doi: https://doi.org/10.1115/1.2792673
Topics:
Alloys
,
Deformation
,
Modeling
,
Solders
,
Tin
,
Viscoplasticity
,
Accounting
,
Creep
,
Solder joints
,
Stress analysis (Engineering)
Deformation Behavior of Two Lead-Free Solders: Indalloy 227 and Castin Alloy
J. Electron. Packag. June 1999, 121(2): 99–107.
doi: https://doi.org/10.1115/1.2792674
Topics:
Alloys
,
Deformation
,
Lead-free solders
,
Thermomechanics
,
Solders
,
Temperature
,
Temperature effects
Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure
J. Electron. Packag. June 1999, 121(2): 108–115.
doi: https://doi.org/10.1115/1.2792664
Analytical Derivation of the Self-Alignment Motion of Flip Chip Soldered Components
J. Electron. Packag. June 1999, 121(2): 116–121.
doi: https://doi.org/10.1115/1.2792665
Topics:
Damping
,
Flip-chip
,
Flip-chip devices
,
Potential energy
,
Resonance
,
Solders
Technical Briefs
Effect of Edge and Internal Point Support of a Printed Circuit Board Under Vibration
J. Electron. Packag. June 1999, 121(2): 122–126.
doi: https://doi.org/10.1115/1.2792666
Topics:
Printed circuit boards
,
Vibration
,
Wedges
,
Boundary-value problems
,
Dynamic response
,
Springs
,
Vibration tests
Failure Analysis of Liquid Crystal Displays Due to Indium Tin Oxide Breakdown
J. Electron. Packag. June 1999, 121(2): 126–127.
doi: https://doi.org/10.1115/1.2792667
Topics:
Failure analysis
,
Liquid crystals
Unsteady Wire Sweep Due to Transfer Molding in a 160L QFP Package
J. Electron. Packag. June 1999, 121(2): 127–134.
doi: https://doi.org/10.1115/1.2792668
Topics:
Transfer molding
,
Wire
,
Flow (Dynamics)
,
Displacement
,
Electronic components
,
Steady state
,
Stress
,
Vehicles
Email alerts
RSS Feeds
Enhancing Image Segmentation Model in Computing Void Percentage with Mask RCNN
J. Electron. Packag
Optimization of Micropillars Electroplating Bonding Processes and Additives
J. Electron. Packag (June 2025)
Microbead Encapsulation for Protection of Electronic Components
J. Electron. Packag (June 2025)