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Issues
September 2004
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Paper
The Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly Packaging
J. Electron. Packag. September 2004, 126(3): 273–281.
doi: https://doi.org/10.1115/1.1756592
Topics:
Solders
,
Metals
,
Manufacturing
,
Thin films
,
Deformation
Reducing Warpage of Printed Circuit Boards by Using Wavy Traces
J. Electron. Packag. September 2004, 126(3): 282–287.
doi: https://doi.org/10.1115/1.1756591
Topics:
Finite element analysis
,
Printed circuit boards
,
Thermoelasticity
,
Warping
,
Temperature
Two-Phase Flow and Heat Transfer in Rectangular Micro-Channels
Weilin Qu, Graduate Research Assistant, Student Mem. ASME, Seok-Mann Yoon, Postdoctoral Research Associate, Issam Mudawar, Professor and Director, Fellow ASME
J. Electron. Packag. September 2004, 126(3): 288–300.
doi: https://doi.org/10.1115/1.1756589
Topics:
Boiling
,
Flow (Dynamics)
,
Microchannels
,
Two-phase flow
,
Heat sinks
,
Heat transfer
,
Water
Interfacial Fracture Toughness Measurement of a Ti/Si Interface
J. Electron. Packag. September 2004, 126(3): 301–307.
doi: https://doi.org/10.1115/1.1772410
Topics:
Fracture toughness
,
Stress
,
Titanium
,
Silicon
,
Fracture (Materials)
,
Delamination
,
Metals
,
Adhesion
,
Strips
,
Adhesives
Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?
J. Electron. Packag. September 2004, 126(3): 308–316.
doi: https://doi.org/10.1115/1.1772411
Topics:
Copper
,
Heat sinks
,
Junctions
,
Melting
,
Phase change materials
,
Temperature
,
Thermal conductivity
,
Transients (Dynamics)
,
Thermal management
,
Energy storage
Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components
J. Electron. Packag. September 2004, 126(3): 317–324.
doi: https://doi.org/10.1115/1.1772412
Topics:
Boiling
,
Critical heat flux
,
Electronic components
,
Flow (Dynamics)
,
Heat transfer
,
Pool boiling
,
Ducts
,
Condensers (steam plant)
,
Heat flux
,
Cooling
The Thermoelastic Analysis of Chip-Substrate System
J. Electron. Packag. September 2004, 126(3): 325–332.
doi: https://doi.org/10.1115/1.1772413
Topics:
Fourier series
,
Heat conduction
,
Integrated circuits
,
Stress
,
Temperature
,
Thermal stresses
,
Thermoelasticity
,
Stress concentration
,
Reliability
,
Heat
Trade-off Design of Extruded Heat Sinks Using Mathematical Optimization
J. Electron. Packag. September 2004, 126(3): 333–341.
doi: https://doi.org/10.1115/1.1772414
Topics:
Design
,
Heat sinks
,
Optimization
,
Thermal resistance
,
Tradeoffs
Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks
J. Electron. Packag. September 2004, 126(3): 342–350.
doi: https://doi.org/10.1115/1.1772415
Topics:
Heat sinks
,
Modeling
,
Heat transfer
,
Pressure drop
,
Fluid dynamics
Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies
J. Electron. Packag. September 2004, 126(3): 351–358.
doi: https://doi.org/10.1115/1.1772416
Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints
J. Electron. Packag. September 2004, 126(3): 359–366.
doi: https://doi.org/10.1115/1.1773391
Topics:
Flip-chip
,
Nanoindentation
,
Shear (Mechanics)
,
Solders
,
Tin
,
Flip-chip devices
,
Intermetallic compounds
,
Testing
,
Reliability
,
Shear strength
Behavior of Lead-Free Solder Under Thermomechanical Loading
J. Electron. Packag. September 2004, 126(3): 367–373.
doi: https://doi.org/10.1115/1.1773197
Topics:
Constitutive equations
,
Damage
,
Deformation
,
Finite element analysis
,
Lead-free solders
,
Solders
,
Stress
,
Temperature
,
Thermomechanics
,
Alloys
On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules
Wen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student
J. Electron. Packag. September 2004, 126(3): 374–383.
doi: https://doi.org/10.1115/1.1773198
Topics:
Design
,
Finite element analysis
,
Finite element model
,
Heat
,
Heat conduction
,
Junctions
,
Manufacturing
,
Modeling
,
Multi-chip modules
,
Natural convection
Multi-Physics Simulation of a Microprocessor Package Under Water Cooling
J. Electron. Packag. September 2004, 126(3): 384–389.
doi: https://doi.org/10.1115/1.1774197
Topics:
Cooling
,
Flow (Dynamics)
,
Simulation
,
Thermal stresses
,
Water
,
Thermal resistance
,
Temperature
,
Physics
Environmental Aging and Deadhesion of Polyimide Dielectric Films
J. Electron. Packag. September 2004, 126(3): 390–397.
doi: https://doi.org/10.1115/1.1773853
Topics:
Adhesion
,
Damage
,
Fatigue
,
Stress
,
Temperature
,
Thin films
,
Polymers
,
Failure
,
Fracture (Materials)
,
Design
Strain Energy Density Criterion for Reliability Life Prediction of Solder Joints in Electronic Packaging
J. Electron. Packag. September 2004, 126(3): 398–405.
doi: https://doi.org/10.1115/1.1773855
Topics:
Cycles
,
Density
,
Fracture (Materials)
,
Reliability
,
Solder joints
,
Stress
,
Finite element analysis
,
Solders
,
Electronic packaging
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