Volume 127 Issue 4 | J. Electron. Packag.

Research Papers

Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder Alloy

M. N. Islam, Y. C. Chan, M. O. Alam, A. Sharif

J. Electron. Packag. December 2005, 127(4): 365–369. doi: https://doi.org/10.1115/1.2056567

View articletitled, Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder Alloy

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Topics: Solder joints , Solders , Stress , Tin , Alloys , Shear (Mechanics) , Diffusion (Physics) , Lead-free solders

Time-Dependent Rheological Behavior of Fluids For Electronics Packaging

X. B. Chen

J. Electron. Packag. December 2005, 127(4): 370–374. doi: https://doi.org/10.1115/1.2056568

Abstract

View articletitled, Time-Dependent Rheological Behavior of Fluids For Electronics Packaging

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Topics: Die cutting , Electronic packaging , Fluids , Rheology , Shearing (Deformation) , Viscosity , Shear rate , Flow (Dynamics) , Adhesives

Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock

Rashed Adnan Islam, Y. C. Chan

J. Electron. Packag. December 2005, 127(4): 375–380. doi: https://doi.org/10.1115/1.2056570

Abstract

View articletitled, Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock

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Topics: Anisotropy , Contact resistance , Shock (Mechanics) , Particulate matter , Abrasion

A Systematic Methodology for Optimal Design of Two-Phase Micro-Channel Heat Sinks

Weilin Qu, Issam Mudawar

J. Electron. Packag. December 2005, 127(4): 381–390. doi: https://doi.org/10.1115/1.2056571

Abstract

View articletitled, A Systematic Methodology for Optimal Design of Two-Phase Micro-Channel Heat Sinks

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Topics: Design , Flow (Dynamics) , Heat sinks , Microchannels , Pressure drop , Heat flux , Dimensions , Coolants , Temperature

A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System

Satish Radhakrishnan, Ganesh Subbarayan, Luu Nguyen, William P. Mazotti

J. Electron. Packag. December 2005, 127(4): 391–396. doi: https://doi.org/10.1115/1.2056573

Abstract

View articletitled, A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System

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Topics: Algorithms , Laser beams , Optical fiber , Simulated annealing , Uncertainty , Temperature , Lasers

Design Optimization for Pin-Fin Heat Sinks

Han-Ting Chen, Po-Li Chen, Jenn-Tsong Horng, Ying-Huei Hung

J. Electron. Packag. December 2005, 127(4): 397–406. doi: https://doi.org/10.1115/1.2056572

Abstract

View articletitled, Design Optimization for Pin-Fin Heat Sinks

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Topics: Design , Heat sinks , Optimization , Thermal resistance , Pressure drop , Response surface methodology , Heat

A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading

Yutaka Tsukada, Hideo Nishimura, Hiroki Yamamoto, Masao Sakane

J. Electron. Packag. December 2005, 127(4): 407–414. doi: https://doi.org/10.1115/1.2070091

Abstract

View articletitled, A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading

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Topics: Creep , Fatigue , Solders , Fatigue life , Damage , Shear (Mechanics) , Waves , Ductility

Systematic Study on Thermo-Mechanical Durability of Pb-Free Assemblies: Experiments and FE Analysis

Qian Zhang, Abhijit Dasgupta, Dave Nelson, Hector Pallavicini

J. Electron. Packag. December 2005, 127(4): 415–429. doi: https://doi.org/10.1115/1.2098812

Abstract

View articletitled, Systematic Study on Thermo-Mechanical Durability of Pb-Free Assemblies: Experiments and FE Analysis

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Topics: Durability , Finite element analysis , Solder joints , Solders , Thermomechanics , Stress , Damage , Cycles , Vehicles , Lead-free solders

Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40 °C , 23 °C , and 125 °C

Ahmad Abu Obaid, Jay G. Sloan, Mark A. Lamontia, Antonio Paesano, Subhotosh Khan, John J. Gillespie, Jr.

J. Electron. Packag. December 2005, 127(4): 430–439. doi: https://doi.org/10.1115/1.2070049

Abstract

View articletitled, Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40 °C , 23 °C , and 125 °C

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Topics: Creep , Relaxation (Physics) , Solders , Stress , Temperature , Shear (Mechanics) , Modeling , Solder joints

Effect of Reversing Heat Flux Direction During Reflow on Void Formation in High-Lead Solder Bumps

Daijiao Wang, Ronald L. Panton

J. Electron. Packag. December 2005, 127(4): 440–445. doi: https://doi.org/10.1115/1.2070047

Abstract

View articletitled, Effect of Reversing Heat Flux Direction During Reflow on Void Formation in High-Lead Solder Bumps

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Topics: Cooling , Heat flux , Heating , Solders , Solidification , Melting , Flow (Dynamics)

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

Ming-Hwa R. Jen, Lee-Cheng Liu, Jenq-Dah Wu

J. Electron. Packag. December 2005, 127(4): 446–451. doi: https://doi.org/10.1115/1.2070090

Abstract

View articletitled, Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

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Topics: Ball-Grid-Array packaging , Flip-chip , High temperature , Lead-free solders , Reliability , Shear (Mechanics) , Failure mechanisms , Solders , Shear strength , Adhesion

Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet

Jeffrey Rambo, Yogendra Joshi

J. Electron. Packag. December 2005, 127(4): 452–459. doi: https://doi.org/10.1115/1.2056575

Abstract

View articletitled, Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet

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Topics: Air flow , Blades , Computational fluid dynamics , Cooling , Energy dissipation , Entropy , Flow (Dynamics) , Temperature , Thermal management , Heat

Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

B. L. Chen, X. Q. Shi, G. Y. Li, K. H. Ang, Jason P. Pickering

J. Electron. Packag. December 2005, 127(4): 466–473. doi: https://doi.org/10.1115/1.2056574

Abstract

View articletitled, Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

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Topics: Rapid tooling , Reliability , Temperature , Failure , Ball-Grid-Array packaging , Solder joints , Manufacturing , Solders , Testing

Thermal Performance Investigation for Confined Heat Sinks By Using a Modified Transient Liquid Crystal Technique

Ming-Chang Wu, Tiao-Yuan Wu, Sheng-Tzung Kuo, Meng-Ping Wang, Ying-Huei Hung

J. Electron. Packag. December 2005, 127(4): 474–482. doi: https://doi.org/10.1115/1.2065787

Abstract

View articletitled, Thermal Performance Investigation for Confined Heat Sinks By Using a Modified Transient Liquid Crystal Technique

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Topics: Flow (Dynamics) , Heat sinks , Heat transfer , Heat transfer coefficients , Liquid crystals , Temperature , Transients (Dynamics)

Test Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn–36%Pb–2%Ag Solder Ball Arrays in Commercial Area Array Packages at −40 °C , 23 °C, and 125 °C

Ahmad Abu Obaid, Jay G. Sloan, Mark A. Lamontia, Antonio Paesano, Subhotosh Khan, John W. Gillespie, Jr.

J. Electron. Packag. December 2005, 127(4): 483–495. doi: https://doi.org/10.1115/1.2070048

Abstract

View articletitled, Test Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn–36%Pb–2%Ag Solder Ball Arrays in Commercial Area Array Packages at −40 °C , 23 °C, and 125 °C

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Topics: Printed circuit boards , Shear (Mechanics) , Solders , Stress

Board Level Drop Impact—Fundamental and Parametric Analysis

E. H. Wong, Y-W Mai, S. K. W. Seah

J. Electron. Packag. December 2005, 127(4): 496–502. doi: https://doi.org/10.1115/1.2065747

Abstract

View articletitled, Board Level Drop Impact—Fundamental and Parametric Analysis

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Topics: Stress , Dynamics (Mechanics) , Springs , Manufacturing

Meso Scale Pulsating Jets for Electronics Cooling

Jivtesh Garg, Mehmet Arik, Stanton Weaver, Todd Wetzel, Seyed Saddoughi

J. Electron. Packag. December 2005, 127(4): 503–511. doi: https://doi.org/10.1115/1.2065727

Abstract

View articletitled, Meso Scale Pulsating Jets for Electronics Cooling

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Topics: Heat , Heat flux , Heat transfer , Heat transfer coefficients , Jets , Natural convection , Temperature , Temperature measurement , Thermal management , Cooling

Isothermal Mechanical Durability of Three Selected PB-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu

Qian Zhang, Abhijit Dasgupta, Peter Haswell

J. Electron. Packag. December 2005, 127(4): 512–522. doi: https://doi.org/10.1115/1.2056569

Abstract

View articletitled, Isothermal Mechanical Durability of Three Selected PB-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu

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Topics: Damage , Durability , Lead-free solders , Solders , Stress , Temperature , Tin , Solder joints

A Numerical Study of the Enhancement of Chip Cooling via a Flow-Disturbing Obstruction Block

S. Kong Wang, Tzu-Chen Hung, Bau-Shi Pei, An-Fong Chen, Ja-Lin Du

J. Electron. Packag. December 2005, 127(4): 523–529. doi: https://doi.org/10.1115/1.2070089

Abstract

View articletitled, A Numerical Study of the Enhancement of Chip Cooling via a Flow-Disturbing Obstruction Block

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Topics: Cooling , Flow (Dynamics) , Fluids , Locks (Waterways) , Pressure , Temperature , Vibration , Heat , Heat transfer , Convection

Research Papers

Moisture Absorption and Diffusion Characterization of Molding Compound

Xu Chen, Shufeng Zhao, Linda Zhai

J. Electron. Packag. December 2005, 127(4): 460–465. doi: https://doi.org/10.1115/1.2065707

Abstract

View articletitled, Moisture Absorption and Diffusion Characterization of Molding Compound

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Topics: Absorption , Diffusion (Physics) , Molding

Technology Review

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

K. M. B. Jansen, V. Gonda, L. J. Ernst, H. J. L. Bressers, G. Q. Zhang

J. Electron. Packag. December 2005, 127(4): 530–536. doi: https://doi.org/10.1115/1.2070092

Abstract

View articletitled, State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

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Topics: Deflection , Electromagnetic scattering , Film thickness , Nanoindentation , Polymer films , Polymers , Radiation scattering , Scattering (Physics) , Stress , Thermomechanics

Book Reviews

Environment-Friendly Electronics: Lead-Free Technology

ANTHONY J. RAFANELLI

J. Electron. Packag. December 2005, 127(4): 537–538. doi: https://doi.org/10.1115/1.2070093

Extract

View articletitled, Environment-Friendly Electronics: Lead-Free Technology

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Topics: Alloys , Electronics , Lead-free solders , Solders , Electronic packaging , Soldering , Tin , Low cycle fatigue

Practical Guide to the Packaging of Electronics

ANTHONY J. RAFANELLI

J. Electron. Packag. December 2005, 127(4): 539. doi: https://doi.org/10.1115/1.2070094

Extract

View articletitled, Practical Guide to the Packaging of Electronics

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Topics: Electronic packaging , Design

Research Papers

Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder Alloy

Time-Dependent Rheological Behavior of Fluids For Electronics Packaging

Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock

A Systematic Methodology for Optimal Design of Two-Phase Micro-Channel Heat Sinks

A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System

Design Optimization for Pin-Fin Heat Sinks

A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading

Systematic Study on Thermo-Mechanical Durability of Pb-Free Assemblies: Experiments and FE Analysis

Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40 °C , 23 °C , and 125 °C

Effect of Reversing Heat Flux Direction During Reflow on Void Formation in High-Lead Solder Bumps

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet

Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

Thermal Performance Investigation for Confined Heat Sinks By Using a Modified Transient Liquid Crystal Technique

Test Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn–36%Pb–2%Ag Solder Ball Arrays in Commercial Area Array Packages at −40 °C , 23 °C, and 125 °C

Board Level Drop Impact—Fundamental and Parametric Analysis

Meso Scale Pulsating Jets for Electronics Cooling

Isothermal Mechanical Durability of Three Selected PB-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu

A Numerical Study of the Enhancement of Chip Cooling via a Flow-Disturbing Obstruction Block

Research Papers

Moisture Absorption and Diffusion Characterization of Molding Compound

Technology Review

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

Book Reviews

Environment-Friendly Electronics: Lead-Free Technology

Practical Guide to the Packaging of Electronics

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