Skip Nav Destination

Issues

Select Decade

Select Year

Issue

Volume 130, Issue 4

December 2008

Previous Issue
Next Issue

ISSN 1043-7398

EISSN 1528-9044

In this Issue

Editorial
Research Papers
Thermal Issues in Emerging Technologies Theory and Applications, THETA
Technical Briefs
Design Innovation

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry

J. Electron. Packag. December 2008, 130(4): 040201. doi: https://doi.org/10.1115/1.3039759

Extract

View articletitled, Editorial

Open the PDF for in another window

Topics: Biomedical engineering , Computers , Cooling , Data centers , Electronic packaging , Electronic systems , Electronics , Engineering teachers , Experimental methods , Fuel cells

Research Papers

Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing

Yi-Shao Lai, Ying-Ta Chiu

J. Electron. Packag. December 2008, 130(4): 041001. doi: https://doi.org/10.1115/1.2957325

Abstract

View articletitled, Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing

Open the PDF for in another window

Topics: Electrodiffusion , Flip-chip , Reliability , Solder joints , Tin , Weight (Mass)

Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces

Karl J. L. Geisler, Avram Bar-Cohen

J. Electron. Packag. December 2008, 130(4): 041002. doi: https://doi.org/10.1115/1.2993135

Abstract

View articletitled, Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces

Open the PDF for in another window

Topics: Aluminum , Boiling , Heat sinks , Heat , Fins , Thermal conductivity , Critical heat flux , Silicon , Energy dissipation , Heat transfer coefficients

Design for Reliability Applied to Packaging of a MOEMS Switch

Abiodun A. Fasoro, Manoj Mittal, Dan O. Popa, Dereje A. Agonafer, Harry E. Stephanou

J. Electron. Packag. December 2008, 130(4): 041003. doi: https://doi.org/10.1115/1.2993142

Abstract

View articletitled, Design for Reliability Applied to Packaging of a MOEMS Switch

Open the PDF for in another window

Topics: Design , Fibers , Microelectromechanical systems , Microoptoelectromechanical systems , Packaging , Reliability , Sealing (Process) , Switches , Shear (Mechanics) , Solders

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung

J. Electron. Packag. December 2008, 130(4): 041004. doi: https://doi.org/10.1115/1.2993146

Abstract

View articletitled, Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

Open the PDF for in another window

Topics: Ball-Grid-Array packages , Ceramics , Computational fluid dynamics , Deformation , Finite element analysis , Flip-chip devices , Interferometry , Manufacturing , Reliability , Solder joints

Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

Saketh Mahalingam, Ananth Prabhakumar, Sandeep Tonapi, Suresh K. Sitaraman

J. Electron. Packag. December 2008, 130(4): 041005. doi: https://doi.org/10.1115/1.3010378

Abstract

View articletitled, Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

Open the PDF for in another window

Topics: Delamination , Flip-chip assemblies , Flow (Dynamics) , Thermal shock , Fracture (Materials) , Thermomechanics , Fatigue

Thermal Issues in Emerging Technologies Theory and Applications, THETA

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri

J. Electron. Packag. December 2008, 130(4): 041101. doi: https://doi.org/10.1115/1.2993145

Abstract

View articletitled, Microscale and Nanoscale Thermal Characterization Techniques

Open the PDF for in another window

Topics: Imaging , Microscale devices , Nanoscale phenomena , Probes , Resolution (Optics) , Temperature , Thermal characterization , Thermoreflectance , Wavelength , Atomic force microscopy

Steady-State Behavior of a Three-Dimensional Pool-Boiling System

Michel Speetjens

J. Electron. Packag. December 2008, 130(4): 041102. doi: https://doi.org/10.1115/1.2993147

Abstract

View articletitled, Steady-State Behavior of a Three-Dimensional Pool-Boiling System

Open the PDF for in another window

Topics: Bifurcation , Boiling , Cooling , Fluids , Heat , Heat flux , Pool boiling , Steady state , Temperature , Heat transfer

An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

Victor Chiriac, Florea Chiriac

J. Electron. Packag. December 2008, 130(4): 041103. doi: https://doi.org/10.1115/1.2993148

Abstract

View articletitled, An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

Open the PDF for in another window

Topics: Compressors , Condensers (steam plant) , Cooling , Design , Microchannels , Refrigerants , Refrigeration , Vapors , Compression , Microelectronic devices

The Thermal Design of a Next Generation Data Center: A Conceptual Exposition

Emad Samadiani, Yogendra Joshi, Farrokh Mistree

J. Electron. Packag. December 2008, 130(4): 041104. doi: https://doi.org/10.1115/1.2993151

Abstract

View articletitled, The Thermal Design of a Next Generation Data Center: A Conceptual Exposition

Open the PDF for in another window

Topics: Data centers , Design , Cooling , Cooling systems

Managing Thermal Emergencies in Disk-Based Storage Systems

Youngjae Kim, Jeonghwan Choi, Sudhanva Gurumurthi, Anand Sivasubramaniam

J. Electron. Packag. December 2008, 130(4): 041105. doi: https://doi.org/10.1115/1.2993152

Abstract

View articletitled, Managing Thermal Emergencies in Disk-Based Storage Systems

Open the PDF for in another window

Topics: Disks , Temperature , Emergencies

Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach

Wataru Nakayama

J. Electron. Packag. December 2008, 130(4): 041106. doi: https://doi.org/10.1115/1.2993126

Abstract

View articletitled, Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach

Open the PDF for in another window

Topics: Copper , Flow (Dynamics) , Heat , Heat conduction , Insulation , Laminates , Modeling , Printed circuit boards , Resins , Temperature

Compact Thermal Models: A Global Approach

Mohamed-Nabil Sabry, Hossam Saleh Abdelmeguid

J. Electron. Packag. December 2008, 130(4): 041107. doi: https://doi.org/10.1115/1.2993132

Abstract

View articletitled, Compact Thermal Models: A Global Approach

Open the PDF for in another window

Topics: Boundary-value problems , Cooling , Heat , Reliability , Temperature , Thermal analysis , Heat flux , Modeling , Resistors , Heat transfer

Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink

Wataru Nakayama

J. Electron. Packag. December 2008, 130(4): 041108. doi: https://doi.org/10.1115/1.2993137

Abstract

View articletitled, Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink

Open the PDF for in another window

Topics: Design , Heat , Heat conduction , Heat sinks , Temperature , Tiles , Genetic algorithms

Technical Briefs

Flip-Chip Interconnect for Coplanar Strip Lines

Young K. Song, Chin C. Lee

J. Electron. Packag. December 2008, 130(4): 044501. doi: https://doi.org/10.1115/1.2993140

Abstract

View articletitled, Flip-Chip Interconnect for Coplanar Strip Lines

Open the PDF for in another window

Topics: Flip-chip , Strips , Circuits , Solders , Signals , Waveguides

Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

S. B. Park, Chirag Shah, Jae B. Kwak, Changsoo Jang, Soonwan Chung, James M. Pitarresi

J. Electron. Packag. December 2008, 130(4): 044502. doi: https://doi.org/10.1115/1.3000097

Abstract

View articletitled, Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

Open the PDF for in another window

Topics: Accelerometers , Deformation , Dynamic response , Printed circuit boards , Strain gages , Transients (Dynamics) , Lumber , Displacement

Design Innovation

Direct Silver to Copper Bonding Process

Pin J. Wang, Jong S. Kim, Chin C. Lee

J. Electron. Packag. December 2008, 130(4): 045001. doi: https://doi.org/10.1115/1.2993144

Abstract

View articletitled, Direct Silver to Copper Bonding Process

Open the PDF for in another window

Topics: Bonding , Copper , Silver , Electronic packaging , Thermal expansion , Stress , Scanning electron microscopy

All Issues

Email alerts

Accepted Manuscript Alert

New Issue Alert

RSS Feeds

Open Issues RSS Feed

Latest
Most Read
Most Cited

Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

J. Electron. Packag (December 2024)

Special Issue on InterPACK2023

J. Electron. Packag

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

J. Electron. Packag (December 2024)

Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films

J. Electron. Packag (March 2025)

Application of the Nonlinear Fracture Mechanics Parameter

Δ

T* to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures

J. Electron. Packag (March 2025)

Editorial

Editorial

Research Papers

Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing

Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces

Design for Reliability Applied to Packaging of a MOEMS Switch

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

Thermal Issues in Emerging Technologies Theory and Applications, THETA

Microscale and Nanoscale Thermal Characterization Techniques

Steady-State Behavior of a Three-Dimensional Pool-Boiling System

An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

The Thermal Design of a Next Generation Data Center: A Conceptual Exposition

Managing Thermal Emergencies in Disk-Based Storage Systems

Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach

Compact Thermal Models: A Global Approach

Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink

Technical Briefs

Flip-Chip Interconnect for Coplanar Strip Lines

Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

Design Innovation

Direct Silver to Copper Bonding Process

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Issues

Editorial

Research Papers

Thermal Issues in Emerging Technologies Theory and Applications, THETA

Technical Briefs

Design Innovation

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only