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Journal Articles

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2015, 137(1): 010801.
Paper No: EP-14-1069
https://doi.org/10.1115/1.4028890
Published Online: November 14, 2014
View Article titled, Two-Phase Thermal Ground Planes: Technology Development and Parametric Results
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Topics: Cooling, Copper, Flat heat pipes, Fluids, Heat, Heat pipes, Silicon, Stress, Teams, Thermal conductivity
Journal Articles

Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics

Myung Ki Sung, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021013.
https://doi.org/10.1115/1.3111253
Published Online: April 21, 2009
View Article titled, Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics
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Topics: Cooling, Flow (Dynamics), Heat, Jets, Microchannels, Temperature, Coolants, Defense industry, Electronics, Thermal management
Journal Articles

Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading

R. Chandaroy, C. Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 61–68.
https://doi.org/10.1115/1.2792669
Published Online: June 1, 1999
View Article titled, Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading
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Topics: Damage mechanics, Dynamic testing (Materials), Solder joints, Surface mount technology, Fatigue life, Failure mechanisms, Reliability, Stress, Vibration, Constitutive equations
Journal Articles

Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory

C. Basaran, R. Chandaroy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 8–11.
https://doi.org/10.1115/1.2792663
Published Online: March 1, 1999
View Article titled, Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory
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Topics: Dynamic analysis, Surface mount packaging, Solder joints, Failure mechanisms, Constitutive equations, Cycles, Defense industry, Failure, Fatigue, Fatigue life
Journal Articles

A Review of Changes and Trends Affecting Military Electronics Manufacturing

A. J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 156–159.
https://doi.org/10.1115/1.2792608
Published Online: June 1, 1998
View Article titled, A Review of Changes and Trends Affecting Military Electronics Manufacturing
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Topics: Electronics, Manufacturing, Military systems, Defense industry, Aerospace industry, Coatings, Design, Proton exchange membranes