1-7 of 7
Ductility
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading

Yutaka Tsukada, Hideo Nishimura, Hiroki Yamamoto, Masao Sakane
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 407–414.
https://doi.org/10.1115/1.2070091
Published Online: December 24, 2004
View Article titled, A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading
Open the PDF for A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading in another window
Topics: Creep, Fatigue, Solders, Fatigue life, Damage, Shear (Mechanics), Waves, Ductility
Journal Articles

The Effects of Strain Rate and Thickness on the Response of Thin Layers of Solder Loaded in Pure Shear

A. Gilat, K. Krishna
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 81–84.
https://doi.org/10.1115/1.2792223
Published Online: June 1, 1997
View Article titled, The Effects of Strain Rate and Thickness on the Response of Thin Layers of Solder Loaded in Pure Shear
Open the PDF for The Effects of Strain Rate and Thickness on the Response of Thin Layers of Solder Loaded in Pure Shear in another window
Topics: Shear (Mechanics), Solders, Deformation, Stress, Ductility, Shear stress, Stress-strain curves, Testing, Tin
Journal Articles

Boundary Layer Fracture in Composite Solder Joints

Roger B. Clough, Alexander J. Shapiro, Andrew J. Bayba, George K. Lucey, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 270–274.
https://doi.org/10.1115/1.2792104
Published Online: December 1, 1995
View Article titled, Boundary Layer Fracture in Composite Solder Joints
Open the PDF for Boundary Layer Fracture in Composite Solder Joints in another window
Topics: Boundary layers, Composite materials, Fracture (Materials), Fracture (Process), Solder joints, Shear (Mechanics), Solders, Copper, Creep, Displacement
Journal Articles

Time-Dependent Ductility of Electro-Deposited Copper

Yoshiki Oshida, P. C. Chen, J. D. Reid, T. Nishihara
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 448–454.
https://doi.org/10.1115/1.2905479
Published Online: December 1, 1992
View Article titled, Time-Dependent Ductility of Electro-Deposited Copper
Open the PDF for Time-Dependent Ductility of Electro-Deposited Copper in another window
Topics: Copper, Ductility, Temperature, Annealing, Current density, Dislocation density, Electrodes, Electrons, Film thickness, Grain size
Journal Articles

Elasto-Plastic Large Deflection Analysis of a Copper Film

J. H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 221–225.
https://doi.org/10.1115/1.2906421
Published Online: June 1, 1992
View Article titled, Elasto-Plastic Large Deflection Analysis of a Copper Film
Open the PDF for Elasto-Plastic Large Deflection Analysis of a Copper Film in another window
Topics: Copper, Deflection, Ductility, Pressure, Stress, Finite element methods, Mechanical behavior
Journal Articles

Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder

H. D. Solomon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 102–108.
https://doi.org/10.1115/1.2905374
Published Online: June 1, 1991
View Article titled, Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder
Open the PDF for Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder in another window
Topics: Low cycle fatigue, Solders, Tin, Melting point, Silver, Temperature, Ductility, Fatigue, Fatigue life, Soldering
Journal Articles

Indentation Method to Measure Plating Ductility

P. A. Engel, D. L. Questad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 272–277.
https://doi.org/10.1115/1.2904378
Published Online: September 1, 1990
View Article titled, Indentation Method to Measure Plating Ductility
Open the PDF for Indentation Method to Measure Plating Ductility in another window
Topics: Ductility, Plating, Fracture (Materials), Displacement, Durability, Electron microscopy, X-rays