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Journal Articles

Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

Pradeep Lall, Sabina Bimali, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041116.
Paper No: EP-24-1029
https://doi.org/10.1115/1.4066041
Published Online: August 17, 2024
View Article titled, Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink
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Topics: Circuits, Design, Inks, Printing, Shear (Mechanics), Silver, Sintering, Aerosols, Stress, Water
Journal Articles

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Pradeep Lall, Kartik Goyal, Curtis Hill
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021011.
Paper No: EP-22-1029
https://doi.org/10.1115/1.4055986
Published Online: November 23, 2022
View Article titled, Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization
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Topics: Copper, Sintering, Surface mount devices, Electrical resistivity, Printing, Drops, Electronics
Journal Articles

Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology

Jerzy Szałapak, Konrad Kiełbasiński, Łucja Dybowska-Sarapuk, Jakub Krzeminski, Marian Teodorczyk, Tomasz Kowaluk, Małgorzata Jakubowska
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2021, 143(3): 034501.
Paper No: EP-20-1091
https://doi.org/10.1115/1.4049240
Published Online: January 19, 2021
View Article titled, Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology
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Topics: Carbon, Carbon nanotubes, Electrical resistivity, Graphene, Nanoparticles, Silver, Thermal conductivity, Temperature, Joining, High temperature
Journal Articles

Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks

Yaser Hadad, Vahideh Radmard, Srikanth Rangarajan, Mahdi Farahikia, Gamal Refai-Ahmed, Paul R. Chiarot, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021007.
Paper No: EP-19-1111
https://doi.org/10.1115/1.4048590
Published Online: October 30, 2020
View Article titled, Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks
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Topics: Design, Electrical resistivity, Flow (Dynamics), Pumps, Temperature, Optimization, Microchannels, Coolants, Pareto optimization, Heat flux
Journal Articles

Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Benjamin Leever, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041003.
Paper No: EP-20-1001
https://doi.org/10.1115/1.4048535
Published Online: October 12, 2020
View Article titled, Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours
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Topics: Aerosols, Electrical resistivity, Failure, Inks, Shear (Mechanics), Sintering, Stress, Temperature, Elastic moduli, Printing
Journal Articles

Nanothermal Interface Materials: Technology Review and Recent Results

Avram Bar-Cohen, Kaiser Matin, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2015, 137(4): 040803.
Paper No: EP-15-1063
https://doi.org/10.1115/1.4031602
Published Online: October 9, 2015
View Article titled, Nanothermal Interface Materials: Technology Review and Recent Results
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Topics: Copper, Cycles, Electrical resistivity, Solders, Teams, Temperature, Testing, Thermal resistance, Bonding, Accelerated life testing
Journal Articles

Development of Glass-Free Metal Electrically Conductive Thick Films

Zongrong Liu, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 64–69.
https://doi.org/10.1115/1.1329131
Published Online: July 13, 2000
View Article titled, Development of Glass-Free Metal Electrically Conductive Thick Films
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Topics: Electrical resistivity, Glass, Metals, Thick films, Adhesion, Alloys
Journal Articles

Z -Axis Anisotropic Electrically Conducting Polymer-Matrix Composite Film

L. Li, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 255–259.
https://doi.org/10.1115/1.2792246
Published Online: December 1, 1997
View Article titled, Z -Axis Anisotropic Electrically Conducting Polymer-Matrix Composite Film
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Topics: Anisotropy, Composite materials, Polymers, Electrical resistivity, Particulate matter, Pressure, Copper, Relaxation (Physics), Stress
Journal Articles

0.4 μm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding

Xiaoping Shui, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 236–238.
https://doi.org/10.1115/1.2792242
Published Online: December 1, 1997
View Article titled, 0.4 μm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding
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Topics: Composite materials, Electromagnetic interference, Nickel, Silicones, Cables, Electrical resistivity, Gaskets
Journal Articles

Nickel Fiber Silicone-Matrix Composites as Resilient Electrical Conductors

Mingguang Zhu, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 417–420.
https://doi.org/10.1115/1.2905429
Published Online: December 1, 1991
View Article titled, Nickel Fiber Silicone-Matrix Composites as Resilient Electrical Conductors
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Topics: Composite materials, Fibers, Nickel, Silicones, Electrical resistivity, Compression, Copper, Electromagnetic interference, Gaskets, Heating