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Journal Articles

Coupled Calculations of Data Center Cooling and Power Distribution Systems

Aaron P. Wemhoff, Faisal Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041002.
Paper No: EP-21-1044
https://doi.org/10.1115/1.4052101
Published Online: October 6, 2021
View Article titled, Coupled Calculations of Data Center Cooling and Power Distribution Systems
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Topics: Cooling, Cooling systems, Data centers, Power systems (Machinery), Stress, Energy efficiency, Electronic systems, Uncertainty
Journal Articles

Mechanical Design of Electronic Systems

John H. L. Pang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
https://doi.org/10.1115/1.4000755
Published Online: March 19, 2010
View Article titled, Mechanical Design of Electronic Systems
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Topics: Circuits, Design, Design engineering, Electronic systems, Reliability, Testing, Integrated circuits, Circuit design, Integrated circuit packaging, Life testing
Journal Articles

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2008, 130(4): 040201.
https://doi.org/10.1115/1.3039759
Published Online: November 17, 2008
View Article titled, Editorial
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Topics: Biomedical engineering, Computers, Cooling, Data centers, Electronic packaging, Electronic systems, Electronics, Engineering teachers, Experimental methods, Fuel cells
Journal Articles

Compact Thermal Models: A Global Approach

Mohamed-Nabil Sabry, Hossam Saleh Abdelmeguid
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041107.
https://doi.org/10.1115/1.2993132
Published Online: November 14, 2008
View Article titled, Compact Thermal Models: A Global Approach
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Topics: Boundary-value problems, Cooling, Heat, Reliability, Temperature, Thermal analysis, Heat flux, Modeling, Resistors, Heat transfer
Journal Articles

Air Flow and Heat Transfer in Fan Cooled Electronic Systems

Ronan Grimes, Mark Davies
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 124–134.
https://doi.org/10.1115/1.1649241
Published Online: April 30, 2004
View Article titled, Air Flow and Heat Transfer in Fan Cooled Electronic Systems
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Topics: Flow (Dynamics), Heat transfer, Temperature, Air flow, Electronic systems
Journal Articles

IGBT Package Design for High Power Aircraft Electronic Systems

Farhad Sarvar, David C. Whalley, Ming K. Low
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 338–343.
https://doi.org/10.1115/1.1390341
Published Online: September 3, 2001
View Article titled, IGBT Package Design for High Power Aircraft Electronic Systems
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Topics: Design, Electronic systems, Fins, Heat conduction, Heat transfer, Modeling, Steady state, Temperature, Transients (Dynamics), Aircraft
Journal Articles

Forced Convection Board Level Thermal Design Methodology for Electronic Systems

Reena Cole, Tara Dalton, Jeff Punch, Mark R. Davies, Ronan Grimes
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 120–126.
https://doi.org/10.1115/1.1339822
Published Online: July 21, 2000
View Article titled, Forced Convection Board Level Thermal Design Methodology for Electronic Systems
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Topics: Design, Design methodology, Electronic systems, Flow (Dynamics), Forced convection, Temperature, Thermal resistance, Junctions, Reynolds number, Reliability
Journal Articles

Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure

L. Tang, Y. K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 108–115.
https://doi.org/10.1115/1.2792664
Published Online: June 1, 1999
View Article titled, Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure
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Topics: Natural convection, Thermal analysis, Boundary-value problems, Computational fluid dynamics, Temperature, Ceramics, Electronic components, Electronic systems, Flux (Metallurgy), Heat
Journal Articles

A Global Multidimensional Sensitivity Analysis of Electronic Systems Subjected to Time-Dependent Excitations

H. A. Jensen, A. O. Cifuentes
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1998, 120(4): 391–394.
https://doi.org/10.1115/1.2792652
Published Online: December 1, 1998
View Article titled, A Global Multidimensional Sensitivity Analysis of Electronic Systems Subjected to Time-Dependent Excitations
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Topics: Electronic systems, Excitation, Sensitivity analysis, Design, Dynamic response, Electronic components, Uncertainty
Journal Articles

Calculation of Forced-Air Cooling of Electronic Modules With a Two-Fluid Model of Turbulence

O. J. Ilegbusi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 250–257.
https://doi.org/10.1115/1.2792160
Published Online: December 1, 1996
View Article titled, Calculation of Forced-Air Cooling of Electronic Modules With a Two-Fluid Model of Turbulence
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Topics: Cooling, Fluids, Turbulence, Flow (Dynamics), Density, Diffusion (Physics), Electronic systems, Energy dissipation, Heat, Heat transfer
Journal Articles

Review of Heat Transfer Technologies in Electronic Equipment

L. T. Yeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 333–339.
https://doi.org/10.1115/1.2792113
Published Online: December 1, 1995
View Article titled, Review of Heat Transfer Technologies in Electronic Equipment
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Topics: Electronic equipment, Heat transfer, Air Force, Design, Electronic systems, Electronics, Energy dissipation, Failure, Heat, Reliability
Journal Articles

Stress Analysis of the Vertical Interconnect for Three-Dimensional Packaging

K. Zouari, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 233–239.
https://doi.org/10.1115/1.2905400
Published Online: September 1, 1991
View Article titled, Stress Analysis of the Vertical Interconnect for Three-Dimensional Packaging
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Topics: Packaging, Stress analysis (Engineering), Pressure, Blocks (Building materials), Circuits, Design, Electronic systems, Manufacturing, Metals, Plates (structures)
Journal Articles

Maximizing Electronic System Reliability Through Optimized Distribution of System Coolant

S. M. Miner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 345–349.
https://doi.org/10.1115/1.2904388
Published Online: December 1, 1990
View Article titled, Maximizing Electronic System Reliability Through Optimized Distribution of System Coolant
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Topics: Coolants, Electronic systems, Reliability, Flow (Dynamics), Failure, Energy dissipation, Junctions, System failures, Temperature
Journal Articles

Analysis of Insertion Force in Elastic/Plastic Mating

S. E. Yamada, H. Ueno
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 192–197.
https://doi.org/10.1115/1.2904366
Published Online: September 1, 1990
View Article titled, Analysis of Insertion Force in Elastic/Plastic Mating
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Topics: Deformation, Electronic systems, Equilibrium (Physics), Friction, Simulation