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Journal Articles

Special Issue on InterPACK2022

Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2022, 144(2): 020301.
Paper No: EP-21-1158
https://doi.org/10.1115/1.4053122
Published Online: January 4, 2022
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Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling
Journal Articles

Special Issue Dedicated to Professor Avram Bar-Cohen

Ronald J. Warzoha, Darin J. Sharar, Raffaele Luca Amalfi, Andrew Tay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2021, 143(4): 040301.
Paper No: EP-21-1127
https://doi.org/10.1115/1.4052174
Published Online: September 13, 2021
View Article titled, Special Issue Dedicated to Professor Avram Bar-Cohen
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Topics: Engineering teachers
Journal Articles

Special Issue on InterPACK 2019 – Part 1

Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. September 2020, 142(3): 030301.
Paper No: EP-20-1092
https://doi.org/10.1115/1.4048039
Published Online: August 14, 2020
View Article titled, Special Issue on InterPACK 2019 – Part 1
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Topics: Cloud computing, Electric vehicles, Electronic packaging, Electronics, Energy conversion, Engineering teachers, Feedback, Internet of things, Manufacturing, Mechanical engineers
Journal Articles

Special Issue on InterPACK 2018

Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. September 2019, 141(3): 030301.
Paper No: EP-19-1036
https://doi.org/10.1115/1.4043484
Published Online: May 8, 2019
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Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers
Journal Articles

Special Section of Review Articles From Intel Corporation

Jin Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2019, 141(1): 010301.
Paper No: EP-18-1120
https://doi.org/10.1115/1.4042803
Published Online: March 6, 2019
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Topics: Data centers, Electronic packaging, Cooling, Design, Engineering teachers, Microelectronic packaging, Packaging, Semiconductor industry
Journal Articles

Letter From the Editors

Bahgat G. Sammakia, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. September 2014, 136(3): 030201.
Paper No: EP-14-1067
https://doi.org/10.1115/1.4028063
Published Online: July 24, 2014
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Topics: Actuators, Biomedicine, Computers, Data centers, Design, Electronic packaging, Electronics, Energy / power systems, Engineering teachers, Feedback
Journal Articles

Special Issue Dedicated to Professor Avi Bar-Cohen in Celebration of His 65th Birthday

Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. June 2012, 134(2): 020201.
https://doi.org/10.1115/1.4006849
Published Online: June 11, 2012
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Topics: Engineering teachers
Journal Articles

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2008, 130(4): 040201.
https://doi.org/10.1115/1.3039759
Published Online: November 17, 2008
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Topics: Biomedical engineering, Computers, Cooling, Data centers, Electronic packaging, Electronic systems, Electronics, Engineering teachers, Experimental methods, Fuel cells
Journal Articles

In Honor of Dr. M. M. Yovanovich

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 2003, 125(2): 165–168.
https://doi.org/10.1115/1.1568123
Published Online: June 10, 2003
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Topics: Contact resistance, Convection, Engineering teachers, Graduate students, Heat conduction, Heat transfer, Packaging, Students, Thermal resistance, Modeling
Journal Articles

Editor’s Note

Ephraim Suhir, Chi Shih Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2000, 122(1): 1–2.
https://doi.org/10.1115/1.483135
Published Online: March 1, 2000
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Topics: Electronic packaging, Engineering teachers, Industrial research, Packaging, Teams, Materials research, Polymers, Reliability, Solder joints, Testing