1-20 of 380
Flow (Dynamics)
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Coupled Electrical-Thermal-Fluidic Multi-Physics Analysis Of TSV Pin Fin Microchannel In The 3D-Ic

Accepted Manuscript
Ping Sun, Bing-Huan Huang, Kui Li, Liang Gong, Chuan-Yong Zhu, Ying Zheng
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1080
DOI: https://doi.org/10.1115/1.4062531
Published Online: May 15, 2023
View Article titled, Coupled Electrical-Thermal-Fluidic Multi-Physics Analysis Of TSV Pin Fin Microchannel In The 3D-Ic
Click here to open pdf in another window PDF for Coupled Electrical-Thermal-Fluidic Multi-Physics Analysis Of TSV Pin Fin Microchannel In The 3D-Ic
Topics: Microchannels, Physics, Flow (Dynamics), Fins, Heat transfer, Circuits, Diamonds, Heat, Integrated circuits, Shapes
Journal Articles

Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks

Inderjot Kaur, Shiraz Mujahid, YubRaj Paudel, Hongjoo Rhee, Prashant Singh
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031002.
Paper No: EP-22-1051
DOI: https://doi.org/10.1115/1.4056305
Published Online: December 21, 2022
View Article titled, Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks
Click here to open pdf in another window PDF for Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks
Topics: Flow (Dynamics), Fluids, Heat transfer, Heat transfer coefficients, Topology, Temperature
Journal Articles

HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions

Ange Christian Iradukunda, David Huitink, Kevin Kayijuka, Tarek Gebrael, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011105.
Paper No: EP-22-1022
DOI: https://doi.org/10.1115/1.4056031
Published Online: November 11, 2022
View Article titled, HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
Click here to open pdf in another window PDF for HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
Topics: Coolants, Electrodes, Flow (Dynamics), Fluids, Temperature, Cooling
Journal Articles

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Tiwei Wei, Sougata Hazra, Yujui Lin, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021008.
Paper No: EP-22-1046
DOI: https://doi.org/10.1115/1.4055468
Published Online: September 28, 2022
View Article titled, Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers
Click here to open pdf in another window PDF for Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers
Topics: Flow (Dynamics), Manifolds, Microchannels, Silicon, Pressure, Temperature, Intake manifolds, Pressure drop
Journal Articles

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021001.
Paper No: EP-22-1003
DOI: https://doi.org/10.1115/1.4054972
Published Online: August 8, 2022
View Article titled, Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
Click here to open pdf in another window PDF for Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
Topics: Computers, Cooling, Copper, Corrosion, Nickel plating, Plates (structures), Pressure drop, Temperature, Thermal resistance, Flow (Dynamics)
Journal Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031017.
Paper No: EP-21-1164
DOI: https://doi.org/10.1115/1.4054461
Published Online: May 19, 2022
View Article titled, Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
Click here to open pdf in another window PDF for Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
Topics: Flow (Dynamics), Heat sinks, Manifolds, Pressure drop, Thermal resistance, Design, Computer simulation, Fluids, Temperature, Heat transfer
Journal Articles

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

Mohammad I. Tradat, Yaman “Mohammad Ali” Manaserh, Ahmad Gharaibeh, Bahgat G. Sammakia, Dave Hall, Kourosh Nemati, Mark Seymour
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031015.
Paper No: EP-21-1151
DOI: https://doi.org/10.1115/1.4053890
Published Online: March 8, 2022
View Article titled, Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology
Click here to open pdf in another window PDF for Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology
Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Pressure, Temperature, Tiles, Modeling
Journal Articles

A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification

Ghazal Mohsenian, Cong Hiep Hoang, Kourosh Nemati, Hussam Alissa, Mohammad Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041015.
Paper No: EP-21-1139
DOI: https://doi.org/10.1115/1.4053643
Published Online: February 23, 2022
View Article titled, A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification
Click here to open pdf in another window PDF for A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification
Topics: Air flow, Design, Stress, Flow (Dynamics), Control systems, Heat, Data centers, Inertia (Mechanics)
Journal Articles

Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator

Zhigang Gao, Tianhu Wang, Yuxin Yang, Xiaolong Shang, Junhua Bai, Peng Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041014.
Paper No: EP-21-1134
DOI: https://doi.org/10.1115/1.4053433
Published Online: February 7, 2022
View Article titled, Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator
Click here to open pdf in another window PDF for Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator
Topics: Flow (Dynamics), Heat sinks, Heat transfer, Methane, Microchannels, Pressure, Electromechanical actuators
Journal Articles

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Satyam Saini, Pardeep Shahi, Pratik Bansode, Jimil M. Shah, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. June 2022, 144(2): 024501.
Paper No: EP-21-1070
DOI: https://doi.org/10.1115/1.4053363
Published Online: January 28, 2022
View Article titled, Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics
Click here to open pdf in another window PDF for Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics
Topics: Computational fluid dynamics, Data centers, Heat sinks, Particulate matter, Simulation, Contamination, Flow (Dynamics), Particle flow
Journal Articles

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Fei Chong Ng, Mohamad Aizat Abas
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041009.
Paper No: EP-21-1137
DOI: https://doi.org/10.1115/1.4052920
Published Online: December 1, 2021
View Article titled, Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package
Click here to open pdf in another window PDF for Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package
Topics: Design, Flip-chip packages, Flow (Dynamics), Optimization, Fluids, Computer simulation
Journal Articles

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Pardeep Shahi, Apruv Pravin Deshmukh, Hardik Yashwant Hurnekar, Satyam Saini, Pratik Bansode, Rajesh Kasukurthy, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041008.
Paper No: EP-21-1115
DOI: https://doi.org/10.1115/1.4052324
Published Online: November 22, 2021
View Article titled, Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers
Click here to open pdf in another window PDF for Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers
Topics: Computational fluid dynamics, Cooling, Design, Flow (Dynamics), Flow control, Valves, Pressure drop
Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041003.
Paper No: EP-20-1094
DOI: https://doi.org/10.1115/1.4052275
Published Online: November 22, 2021
View Article titled, A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
Click here to open pdf in another window PDF for A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging
Journal Articles

Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel

D. Sathish Kumar, S. Jayavel
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041007.
Paper No: EP-21-1084
DOI: https://doi.org/10.1115/1.4052537
Published Online: November 22, 2021
View Article titled, Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel
Click here to open pdf in another window PDF for Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel
Topics: Bifurcation, Flow (Dynamics), Heat transfer, Microchannels, Fluids, Entropy, Pressure drop
Journal Articles

Influence of Laser Soldering Temperatures on Through-Hole Component

Saifulmajdy A. Zahiri, Aizat Abas, M. F. M. Sharif, Fakhrozi Che Ani
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041006.
Paper No: EP-21-1075
DOI: https://doi.org/10.1115/1.4052175
Published Online: November 22, 2021
View Article titled, Influence of Laser Soldering Temperatures on Through-Hole Component
Click here to open pdf in another window PDF for Influence of Laser Soldering Temperatures on Through-Hole Component
Topics: Flow (Dynamics), Lasers, Soldering, Solders, Temperature, Lead-free solders, Finite volume methods, Pressure
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
DOI: https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Article titled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
Click here to open pdf in another window PDF for Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Cheng-Hui Lin, Yoonjin Won
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041112.
Paper No: EP-21-1105
DOI: https://doi.org/10.1115/1.4052790
Published Online: November 9, 2021
View Article titled, Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces
Click here to open pdf in another window PDF for Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces
Topics: Boiling, Bubbles, Critical heat flux, Electrodeposition, Heat transfer, Copper, Dynamics (Mechanics), Microscale devices, Fins, Flow (Dynamics)
Includes: Supplementary data
Journal Articles

Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling

Filippo Cataldo, Yuri Carmelo Crea
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041110.
Paper No: EP-21-1094
DOI: https://doi.org/10.1115/1.4052670
Published Online: November 5, 2021
View Article titled, Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling
Click here to open pdf in another window PDF for Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling
Topics: Condensers (steam plant), Heat, Stress, Flow (Dynamics), Temperature, Fluids, Modeling
Journal Articles

The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling

Ankur Miglani, Anali Soto, Justin A. Weibel, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041107.
Paper No: EP-21-1114
DOI: https://doi.org/10.1115/1.4052532
Published Online: October 14, 2021
View Article titled, The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling
Click here to open pdf in another window PDF for The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling
Topics: Flow (Dynamics), Heating, Microchannels, Boiling
Journal Articles

Reduced Order Design Optimization of Liquid Cooled Heat Sinks

Aniket Ajay Lad, Kai A. James, William P. King, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041105.
Paper No: EP-21-1112
DOI: https://doi.org/10.1115/1.4052400
Published Online: October 6, 2021
View Article titled, Reduced Order Design Optimization of Liquid Cooled Heat Sinks
Click here to open pdf in another window PDF for Reduced Order Design Optimization of Liquid Cooled Heat Sinks
Topics: Design, Flow (Dynamics), Optimization, Pressure drop, Heat sinks