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Journal Articles

Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

Pradeep Lall, Sabina Bimali, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041116.
Paper No: EP-24-1029
https://doi.org/10.1115/1.4066041
Published Online: August 17, 2024
View Article titled, Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink
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Topics: Circuits, Design, Inks, Printing, Shear (Mechanics), Silver, Sintering, Aerosols, Stress, Water
Journal Articles

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Pardeep Shahi, Apruv Pravin Deshmukh, Hardik Yashwant Hurnekar, Satyam Saini, Pratik Bansode, Rajesh Kasukurthy, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041008.
Paper No: EP-21-1115
https://doi.org/10.1115/1.4052324
Published Online: November 22, 2021
View Article titled, Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers
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Topics: Computational fluid dynamics, Cooling, Design, Flow (Dynamics), Flow control, Valves, Pressure drop
Journal Articles

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Rajesh Kasukurthy, Amruthavalli Rachakonda, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031001.
Paper No: EP-20-1016
https://doi.org/10.1115/1.4049018
Published Online: January 19, 2021
View Article titled, Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling
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Topics: Computational fluid dynamics, Coolants, Cooling, Flow (Dynamics), Flow control, Matlab, Optimization, Plates (structures), Temperature, Testing
Journal Articles

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010904.
Paper No: EP-17-1093
https://doi.org/10.1115/1.4039020
Published Online: March 2, 2018
View Article titled, Thermal Metamaterials for Heat Flow Control in Electronics
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Topics: Composite materials, Design, Electronics, Flow control, Heat, Heat flux, Metamaterials, Printed circuit boards, Temperature, Anisotropy