1-8 of 8
Laser beams
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Packaging for Laser-Based White Lighting: Status and Perspectives

Yupu Ma, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2020, 142(1): 010801.
Paper No: EP-18-1105
https://doi.org/10.1115/1.4044359
Published Online: September 19, 2019
View Article titled, Packaging for Laser-Based White Lighting: Status and Perspectives
Open the PDF for Packaging for Laser-Based White Lighting: Status and Perspectives in another window
Topics: Lasers, Packaging, Phosphors, Quenching (Metalworking), Temperature, Laser beams, Brightness (Photometry)
Journal Articles

A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System

Satish Radhakrishnan, Ganesh Subbarayan, Luu Nguyen, William P. Mazotti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 391–396.
https://doi.org/10.1115/1.2056573
Published Online: December 14, 2004
View Article titled, A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System
Open the PDF for A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System in another window
Topics: Algorithms, Laser beams, Optical fiber, Simulated annealing, Uncertainty, Temperature, Lasers
Journal Articles

Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method

T. Elperin, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 142–147.
https://doi.org/10.1115/1.1649245
Published Online: April 30, 2004
View Article titled, Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method
Open the PDF for Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method in another window
Topics: Fracture (Materials), Laser beams, Lasers, Microcracks, Semiconductor wafers, Thermal shock, Thermal stresses, Temperature
Journal Articles

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

Yong Du, Jie-Hua Zhao, Paul Ho
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 196–199.
https://doi.org/10.1115/1.1347987
Published Online: March 21, 2000
View Article titled, An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling
Open the PDF for An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling in another window
Topics: Electronic packages, Finite element analysis, Laser beams, Temperature, Flip-chip packages, Warping, Thermal expansion, Deformation, Lasers, Packaging
Journal Articles

Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips

T. Elperin, A. Kornilov, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 317–322.
https://doi.org/10.1115/1.1289635
Published Online: August 9, 1999
View Article titled, Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips
Open the PDF for Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips in another window
Topics: Microcracks, Semiconductor wafers, Separation (Technology), Temperature, Laser beams, Sprays, Elasticity, Stress, Temperature distribution, Relaxation (Physics)
Journal Articles

Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach

T. Elperin, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 82–88.
https://doi.org/10.1115/1.2792290
Published Online: March 1, 1998
View Article titled, Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach
Open the PDF for Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach in another window
Topics: Accelerated life testing, Coating processes, Coatings, Manufacturing, Deflection, Pumps, Laser beams, Probes, Temperature, Thermal stresses
Journal Articles

Theoretical and Experimental Investigation of Laser Drilling in a Partially Transparent Medium

T. Nowak, R. J. Pryputniewicz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 71–80.
https://doi.org/10.1115/1.2905444
Published Online: March 1, 1992
View Article titled, Theoretical and Experimental Investigation of Laser Drilling in a Partially Transparent Medium
Open the PDF for Theoretical and Experimental Investigation of Laser Drilling in a Partially Transparent Medium in another window
Topics: Drilling, Lasers, Transparency, Laser beams, Shapes, Computer simulation, Errors, Experimental analysis, Geometry, Temperature
Journal Articles

A Study of Forces and Motion Generated During Pulsed Laser Welding of Optical Packages

S. Rangwala
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 343–349.
https://doi.org/10.1115/1.2905418
Published Online: December 1, 1991
View Article titled, A Study of Forces and Motion Generated During Pulsed Laser Welding of Optical Packages
Open the PDF for A Study of Forces and Motion Generated During Pulsed Laser Welding of Optical Packages in another window
Topics: Laser welding, Lasers, Cooling, Dynamics (Mechanics), Laser beams, Manufacturing, Shrinkage (Materials), Thermal stresses, Waves, Welding