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Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag. March 2023, 145(1): 011204.

Paper No: EP-21-1110

DOI: https://doi.org/10.1115/1.4054784

Published Online: August 3, 2022

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Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure

Journal Articles

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

J. Electron. Packag. June 2022, 144(2): 021116.

Paper No: EP-21-1062

DOI: https://doi.org/10.1115/1.4053764

Published Online: March 11, 2022

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Topics: Solders, Stress-strain curves, Temperature, Alloys, Operating temperature, Tensile strength, Materials properties

Journal Articles

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee, Wei Xu

J. Electron. Packag. December 2018, 140(4): 041005.

Paper No: EP-17-1072

DOI: https://doi.org/10.1115/1.4041064

Published Online: September 10, 2018

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Topics: Ball-Grid-Array packaging, Electromagnetic scattering, Materials properties, Radiation scattering, Scattering (Physics), Temperature, Thermal expansion, Warping, Simulation, Laminates

Journal Articles

Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design

Bryce P. DeFigueiredo, Trent K. Zimmerman, Brian D. Russell, Larry L. Howell

J. Electron. Packag. December 2018, 140(4): 041001.

Paper No: EP-17-1120

DOI: https://doi.org/10.1115/1.4040552

Published Online: July 3, 2018

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Topics: Design, Hinges, Printed circuit boards, Stiffness, Stress, Deflection, Finite element analysis, Engineering prototypes, Materials properties

Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker

J. Electron. Packag. March 2015, 137(1): 011010.

Paper No: EP-14-1001

DOI: https://doi.org/10.1115/1.4028641

Published Online: March 1, 2015

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Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)

Journal Articles

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

Dapeng Liu, Seungbae Park

J. Electron. Packag. September 2014, 136(3): 034501.

Paper No: EP-13-1094

DOI: https://doi.org/10.1115/1.4026661

Published Online: May 5, 2014

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Topics: Diffusion (Physics), Simulation, Temperature, Transients (Dynamics), Materials properties

Journal Articles

Experimental and Modeling Studies of Looping Process for Wire Bonding

Fuliang Wang, Yun Chen

J. Electron. Packag. December 2013, 135(4): 041009.

Paper No: EP-13-1070

DOI: https://doi.org/10.1115/1.4025667

Published Online: November 18, 2013

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Topics: Wire, Materials properties, Finite element model

Journal Articles

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

Guofeng Xia, Fei Qin, Cha Gao, Tong An, Wenhui Zhu

J. Electron. Packag. December 2013, 135(4): 041007.

Paper No: EP-13-1018

DOI: https://doi.org/10.1115/1.4025597

Published Online: November 5, 2013

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Topics: Cycles, Design, Fatigue, Fatigue life, Reliability, Solder joints, Temperature, Materials properties, Stress, Taguchi methods

Journal Articles

Hygromechanical Analysis of Liquid Crystal Display Panels

Toru Ikeda, Tomonori Mizutani, Kiyoshi Miyake, Noriyuki Miyazaki

J. Electron. Packag. December 2013, 135(4): 041005.

Paper No: EP-10-1084

DOI: https://doi.org/10.1115/1.4025527

Published Online: November 5, 2013

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Topics: Diffusion (Physics), Liquid crystals, Polarizers (Light), Temperature, Thermomechanics, Warping, Gas laws (Thermodynamics), Materials properties

Journal Articles

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

A. F. M. Arif, Syed M. Zubair, S. Pashah

J. Electron. Packag. December 2012, 134(4): 041005.

DOI: https://doi.org/10.1115/1.4007258

Published Online: October 30, 2012

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Topics: Composite materials, Computer cooling, Flow (Dynamics), Geometry, Heat, Heat sinks, Stress, Temperature, Thermal analysis, Epoxy adhesives

Journal Articles

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Rui Zhang, Marc Hodes, David A. Brooks, Vincent P. Manno

J. Electron. Packag. June 2012, 134(2): 021007.

DOI: https://doi.org/10.1115/1.4005905

Published Online: June 11, 2012

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Topics: Algorithms, Circuits, Heat, Temperature, Temperature control, Thermal resistance, Thermoelectric cooling, Energy consumption, Photonics, Heat sinks

Journal Articles

Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta

J. Electron. Packag. December 2011, 133(4): 041012.

DOI: https://doi.org/10.1115/1.4005091

Published Online: December 9, 2011

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Topics: Damping, Finite element analysis, Modeling, Printed circuit boards, Shock (Mechanics), Manufacturing, Simulation, Simulation results, Cycles, Materials properties

Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue

J. Electron. Packag. June 2008, 130(2): 021009.

DOI: https://doi.org/10.1115/1.2912209

Published Online: May 9, 2008

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Topics: Damage, Epoxy resins, Failure mechanisms, Flip-chip, Flip-chip devices, Reliability, Solder joints, Solders, Viscoelasticity, Waves

Journal Articles

Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

Kun-Nan Chen

J. Electron. Packag. December 2006, 128(4): 449–455.

DOI: https://doi.org/10.1115/1.2353281

Published Online: February 15, 2006

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Topics: Computer cooling, Cooling, Design, Finite element analysis, Finite element model, Optimization, Printed circuit boards, Screws, Testing, Materials properties

Journal Articles

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Caroline Chen, Zonghe Lai, Zhaonian Cheng, Johan Liu

J. Electron. Packag. September 2006, 128(3): 177–183.

DOI: https://doi.org/10.1115/1.2227057

Published Online: August 7, 2005

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Topics: Adhesives, Contact resistance, Finite element methods, Flip-chip devices, Reliability, Simulation, Stress, Temperature, Warping, Flip-chip

Journal Articles

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Tong Hong Wang, Yi-Shao Lai, Jenq-Dah Wu

J. Electron. Packag. December 2004, 126(4): 560–564.

DOI: https://doi.org/10.1115/1.1827271

Published Online: January 24, 2005

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Topics: Ball-Grid-Array packaging, Creep, Fatigue, Flip-chip, Materials properties, Reliability, Solders, Thermomechanics, Shear (Mechanics), Finite element analysis

Journal Articles

Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing

Ben Ting, Vincent P. Manno

J. Electron. Packag. September 2005, 127(3): 299–305.

DOI: https://doi.org/10.1115/1.1938206

Published Online: November 1, 2004

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Topics: Fibers, Lasers, Simulation, Transients (Dynamics), Temperature, Manufacturing, Thermomechanics, Geometry, Displacement, Materials properties

Journal Articles

Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

C. J. Liu, L. J. Ernst, G. Wisse, G. Q. Zhang, M. Vervoort

J. Electron. Packag. December 2003, 125(4): 512–519.

DOI: https://doi.org/10.1115/1.1604152

Published Online: December 15, 2003

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Topics: Buckling, Ceramics, Copper, Delamination, Finite element methods, Finite element model, Simulation, Stress, Temperature, Deformation

Journal Articles

Micro to Macro Thermo-Mechanical Simulation of Wafer Level Packaging

Chang-An Yuan, Research Assistant, Kou-Ning Chiang, Professor

J. Electron. Packag. December 2003, 125(4): 576–581.

DOI: https://doi.org/10.1115/1.1604159

Published Online: December 15, 2003

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Topics: Packaging, Semiconductor wafers, Simulation, Solder joints, Shear (Mechanics), Finite element analysis, Thermomechanics, Materials properties, Fatigue life, Finite element model

Journal Articles

3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components

John H. Lau, Stephen H. Pan

J. Electron. Packag. December 2003, 125(4): 621–624.

DOI: https://doi.org/10.1115/1.1604805

Published Online: December 15, 2003

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Topics: Boundary-value problems, Compressive stress, Copper, Finite element analysis, Stress, Stress analysis (Engineering), Tin, Chemical reactions, Displacement, Materials properties

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Journal citation

NARROW

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design

Stress–Strain Behavior of SAC305 at High Strain Rates

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

Experimental and Modeling Studies of Looping Process for Wire Bonding

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

Hygromechanical Analysis of Liquid Crystal Display Panels

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing

Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

Micro to Macro Thermo-Mechanical Simulation of Wafer Level Packaging

3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components

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