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Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov

J. Electron. Packag. September 2023, 145(3): 031007.

Paper No: EP-22-1070

DOI: https://doi.org/10.1115/1.4056886

Published Online: March 7, 2023

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Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress

Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey

J. Electron. Packag. March 2023, 145(1): 010301.

Paper No: EP-22-1094

DOI: https://doi.org/10.1115/1.4056558

Published Online: January 11, 2023

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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices

Journal Articles

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Okafor Ekene Gabriel, David Ryan Huitink

J. Electron. Packag. June 2023, 145(2): 020801.

Paper No: EP-22-1045

DOI: https://doi.org/10.1115/1.4055774

Published Online: October 22, 2022

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Topics: Failure, Fatigue, Reliability, Stress, Temperature, Fatigue life, Electronics, Failure mechanisms, Corrosion, Modeling

Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hsien-Chie Cheng, Yan-Cheng Liu

J. Electron. Packag. June 2023, 145(2): 021005.

Paper No: EP-22-1012

DOI: https://doi.org/10.1115/1.4055591

Published Online: September 28, 2022

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Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems

Journal Articles

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Han-Ling Li, Yang Shen, Yu-Chao Hua, S. L. Sobolev, Bing-Yang Cao

J. Electron. Packag. March 2023, 145(1): 011203.

Paper No: EP-22-1007

DOI: https://doi.org/10.1115/1.4054698

Published Online: July 13, 2022

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Topics: Diffusion (Physics), Gallium nitride, Heat, Heating, Modeling, Phonons, Simulation, Temperature, Heat conduction, Junctions

Journal Articles

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

Mohammad I. Tradat, Yaman “Mohammad Ali” Manaserh, Ahmad Gharaibeh, Bahgat G. Sammakia, Dave Hall, Kourosh Nemati, Mark Seymour

J. Electron. Packag. September 2022, 144(3): 031015.

Paper No: EP-21-1151

DOI: https://doi.org/10.1115/1.4053890

Published Online: March 8, 2022

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Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Pressure, Temperature, Tiles, Modeling

Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar

J. Electron. Packag. June 2022, 144(2): 020301.

Paper No: EP-21-1158

DOI: https://doi.org/10.1115/1.4053122

Published Online: January 4, 2022

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Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling

Journal Articles

Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration

Geoffrey A. Garcia, Kody Wakumoto, Joseph J. Brown

J. Electron. Packag. December 2022, 144(4): 041004.

Paper No: EP-21-1018

DOI: https://doi.org/10.1115/1.4052325

Published Online: November 22, 2021

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Topics: Cantilevers, Design, Deflection, Microfabrication, Metamaterials, Modeling, Finite element analysis, Stress

Journal Articles

Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling

Filippo Cataldo, Yuri Carmelo Crea

J. Electron. Packag. December 2021, 143(4): 041110.

Paper No: EP-21-1094

DOI: https://doi.org/10.1115/1.4052670

Published Online: November 5, 2021

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Topics: Condensers (steam plant), Heat, Stress, Flow (Dynamics), Temperature, Fluids, Modeling

Journal Articles

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur

J. Electron. Packag. December 2021, 143(4): 041109.

Paper No: EP-21-1087

DOI: https://doi.org/10.1115/1.4052814

Published Online: November 5, 2021

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Topics: Algorithms, Artificial neural networks, Bridges (Structures), Cooling, Heat sinks, Junctions, Machine learning, Machinery, Simulation, Steady state

Includes: Supplementary data

Journal Articles

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Xiaoping Wang, Jun Yang, Xiaogang Liu, Panpan Zheng, Qinglin Song, Bin Song, Sheng Liu

J. Electron. Packag. March 2022, 144(1): 011005.

Paper No: EP-20-1097

DOI: https://doi.org/10.1115/1.4049813

Published Online: August 6, 2021

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Topics: Cycles, Microelectromechanical systems, Modeling, Pressure sensors, Signals, Stress, Temperature, Vibration, Solder joints, Soldering

Journal Articles

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Vishnu V. B. Reddy, Saurabh Gupta, Jaimal Williamson, Suresh K. Sitaraman

J. Electron. Packag. March 2022, 144(1): 011009.

Paper No: EP-20-1126

DOI: https://doi.org/10.1115/1.4050898

Published Online: August 6, 2021

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Topics: Cycles, Damage, Finite element analysis, Inspection, Lasers, Modeling, Natural language interfaces, Solders, Accelerated life testing, Density

Journal Articles

Numerical Modeling and Simulation of a Volumetric Resistance Blower Using Porous Rotor

Sanket Girhe, Ruander Cardenas, Mark MacDonald, Anandaroop Bhattacharya

J. Electron. Packag. June 2021, 143(2): 021004.

Paper No: EP-20-1046

DOI: https://doi.org/10.1115/1.4048036

Published Online: September 3, 2020

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Topics: Computer simulation, Flow (Dynamics), Pressure, Rotors, Porous materials, Simulation, Modeling

Journal Articles

Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu

J. Electron. Packag. December 2020, 142(4): 041113.

Paper No: EP-20-1037

DOI: https://doi.org/10.1115/1.4047579

Published Online: July 10, 2020

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Topics: Cycles, Failure, Flexible electronics, Modeling, Reliability, Electronics, Regression models, Failure analysis

Journal Articles

Additively Printed Multilayer Substrate Using Aerosol-Jet Technique

Pradeep Lall, Kartik Goyal, Nakul Kothari, Benjamin Leever, Scott Miller

J. Electron. Packag. December 2020, 142(4): 041110.

Paper No: EP-20-1002

DOI: https://doi.org/10.1115/1.4047473

Published Online: June 29, 2020

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Topics: Aerosols, Inks, Sintering, Design, Modeling

Journal Articles

A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

Zhiwen Chen, Zhao Zhang, Fang Dong, Sheng Liu, Li Liu

J. Electron. Packag. March 2021, 143(1): 011001.

Paper No: EP-19-1055

DOI: https://doi.org/10.1115/1.4047227

Published Online: June 4, 2020

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Topics: Artificial neural networks, Fatigue life, Finite element analysis, Modeling, Solder joints, Creep, Finite element model

Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer

J. Electron. Packag. September 2020, 142(3): 031106.

Paper No: EP-19-1098

DOI: https://doi.org/10.1115/1.4046848

Published Online: April 24, 2020

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Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles

Journal Articles

Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs

Robert Pearson, Bikramjit Chatterjee, Samuel Kim, Samuel Graham, Alexander Rattner, Sukwon Choi

J. Electron. Packag. June 2020, 142(2): 021012.

Paper No: EP-19-1087

DOI: https://doi.org/10.1115/1.4046620

Published Online: April 6, 2020

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Topics: Gallium nitride, Gates (Closures), Heat, Modeling, Temperature, Heat flux, Heating, Critical heat flux, Heart failure, Approximation

Journal Articles

Phenomenological Modeling of Carpeted Surface for Drop Simulation of Portable Electronics

Abhi Sirimamilla, Hua Ye, Yinan Wu

J. Electron. Packag. June 2019, 141(2): 021006.

Paper No: EP-17-1114

DOI: https://doi.org/10.1115/1.4042978

Published Online: April 10, 2019

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Topics: Damping, Electronics, Modeling, Simulation, Impact testing

Journal Articles

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

Aastha Uppal, Jerrod Peterson, Je-Young Chang, Xi Guo, Frank Liang, Weihua Tang

J. Electron. Packag. March 2019, 141(1): 010803.

Paper No: EP-18-1053

DOI: https://doi.org/10.1115/1.4042801

Published Online: March 4, 2019

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Topics: Design, Modeling, Thermomechanics, Stress, Heat pipes, Pressure

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Journal citation

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Supplemental Material

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Special Section on InterPACK2021

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

Special Issue on InterPACK2020

Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration

Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Numerical Modeling and Simulation of a Volumetric Resistance Blower Using Porous Rotor

Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

Additively Printed Multilayer Substrate Using Aerosol-Jet Technique

A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs

Phenomenological Modeling of Carpeted Surface for Drop Simulation of Portable Electronics

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

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