Search Results | J. Electron. Packag. | ASME Digital Collection

1-20 of 296

2 3 4 5

Sort by

Sort Order Select

Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke

J. Electron. Packag. September 2023, 145(3): 031008.

Paper No: EP-22-1082

DOI: https://doi.org/10.1115/1.4056992

Published Online: March 8, 2023

View Article

Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure

Journal Articles

Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

Behnam Garakani, Udara S. Somarathna, Ashraf Umar, Gurvinder Singh Khinda, Mohamed Youssef M. Abdelatty, El Mehdi Abbara, Sari Al Zerey, Mike Hopkins, Sai Srinivas, Chuck Kinzel, Christopher Halseth, Mark Ronay, Mark D. Poliks

J. Electron. Packag. September 2023, 145(3): 031006.

Paper No: EP-22-1008

DOI: https://doi.org/10.1115/1.4056640

Published Online: February 1, 2023

View Article

Topics: Fatigue, Liquid metals, Tension, Transmission lines, Cycles, Fatigue testing, Reliability, Wearable devices, Metals, Simulation

Journal Articles

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller

J. Electron. Packag. March 2023, 145(1): 011109.

Paper No: EP-22-1035

DOI: https://doi.org/10.1115/1.4056477

Published Online: January 11, 2023

View Article

Topics: Adhesives, Electronics, Reliability, Surface preparation, Temperature, Stress, Inks, Silver

Journal Articles

Mandrel Bend Test of Screen-Printed Silver Conductors

Rui Chen, Justin Chow, Yi Zhou, Suresh K. Sitaraman

J. Electron. Packag. September 2023, 145(3): 031004.

Paper No: EP-22-1072

DOI: https://doi.org/10.1115/1.4056530

Published Online: January 11, 2023

View Article

Topics: Cycles, Flexible electronics, Silver, Reliability, Inks, Damage, Imaging

Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey

J. Electron. Packag. March 2023, 145(1): 010301.

Paper No: EP-22-1094

DOI: https://doi.org/10.1115/1.4056558

Published Online: January 11, 2023

View Article

Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices

Journal Articles

Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging

Pradeep Lall, Hyesoo Jang

J. Electron. Packag. March 2023, 145(1): 011108.

Paper No: EP-22-1030

DOI: https://doi.org/10.1115/1.4056412

Published Online: December 23, 2022

View Article

Topics: Batteries, Cycles, Lithium-ion batteries, Machine learning, Regression models, Reliability, Stress

Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler

J. Electron. Packag. March 2023, 145(1): 011107.

Paper No: EP-22-1020

DOI: https://doi.org/10.1115/1.4056445

Published Online: December 23, 2022

View Article

Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles

Journal Articles

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Paul Paret, Donal Finegan, Sreekant Narumanchi

J. Electron. Packag. September 2023, 145(3): 034501.

Paper No: EP-22-1053

DOI: https://doi.org/10.1115/1.4056306

Published Online: December 9, 2022

View Article

Topics: Artificial intelligence, Design, Electric vehicles, Electronics, Thermal management, Semiconductor devices, Reliability, Manufacturing, Semiconductors (Materials)

Journal Articles

Module-Level Thermal Interface Material Degradation in HALT

Joshua Tompkins, Alicia Medina Garcia, David Huitink, Haitao Liao

J. Electron. Packag. March 2023, 145(1): 011106.

Paper No: EP-22-1021

DOI: https://doi.org/10.1115/1.4056030

Published Online: November 23, 2022

View Article

Topics: Cycles, Life testing, Stress, Temperature, Testing, Thermal resistance, Vibration, Electronics, Reliability, Heating

Includes: Supplementary data

Journal Articles

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer

J. C. C. Lo, Q. Jiang, X. Qiu, N. Tu

J. Electron. Packag. March 2023, 145(1): 011103.

Paper No: EP-22-1013

DOI: https://doi.org/10.1115/1.4055840

Published Online: October 22, 2022

View Article

Topics: High temperature, Inks, Reliability, Shear (Mechanics), Sintering, Storage, Solders, Additive manufacturing, Solder joints

Journal Articles

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Okafor Ekene Gabriel, David Ryan Huitink

J. Electron. Packag. June 2023, 145(2): 020801.

Paper No: EP-22-1045

DOI: https://doi.org/10.1115/1.4055774

Published Online: October 22, 2022

View Article

Topics: Failure, Fatigue, Reliability, Stress, Temperature, Fatigue life, Electronics, Failure mechanisms, Corrosion, Modeling

Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag. March 2023, 145(1): 011204.

Paper No: EP-21-1110

DOI: https://doi.org/10.1115/1.4054784

Published Online: August 3, 2022

View Article

Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure

Journal Articles

Electrothermal Analysis of System in Package for Aerospace Application

Hao-hang Su, Shuai Fu, Su-yuan Li, Jiang Bian

J. Electron. Packag. March 2023, 145(1): 011202.

Paper No: EP-22-1014

DOI: https://doi.org/10.1115/1.4054462

Published Online: July 7, 2022

View Article

Topics: Aerospace industry, Design, Heat, Joules, Reliability, Simulation, System-in-package, Temperature, Vacuum, Errors

Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim

J. Electron. Packag. December 2022, 144(4): 041017.

Paper No: EP-21-1014

DOI: https://doi.org/10.1115/1.4054183

Published Online: April 22, 2022

View Article

Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress

Includes: Supplementary data

Journal Articles

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Ved Prakash Sharma, Naresh Varma Datla

J. Electron. Packag. December 2022, 144(4): 041016.

Paper No: EP-21-1159

DOI: https://doi.org/10.1115/1.4054096

Published Online: March 31, 2022

View Article

Topics: Fracture (Materials), Fracture (Process), Intermetallic compounds, Solder joints, Solders, Tin, Reliability, Fractography, Lead-free solders, Failure

Journal Articles

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Junjie Dai, Yuexin Zhang, Zhankun Li, Mingming Chen, Yuhua Guo, Zhekun Fan, Junhui Li

J. Electron. Packag. September 2022, 144(3): 031014.

Paper No: EP-21-1121

DOI: https://doi.org/10.1115/1.4053889

Published Online: March 8, 2022

View Article

Topics: Columns (Structural), Copper, Current density, Flip-chip devices, Solder joints, Solders, Temperature, Tin, Joules, Reliability

Journal Articles

High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

Alexis Krone, Josh Kasitz, David Huitink, Hannah Alpert, Debbie G. Senesky, Satish Shetty, Gregory Salamo

J. Electron. Packag. June 2022, 144(2): 021115.

Paper No: EP-21-1064

DOI: https://doi.org/10.1115/1.4053765

Published Online: March 7, 2022

View Article

Topics: Gallium, Gallium nitride, Hall effect, High temperature, Sensors, Temperature, Alloys, Reliability

Journal Articles

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Xinyue Wang, Zejun Zeng, Guoqi Zhang, Jing Zhang, Pan Liu

J. Electron. Packag. December 2022, 144(4): 041013.

Paper No: EP-21-1109

DOI: https://doi.org/10.1115/1.4053432

Published Online: February 1, 2022

View Article

Topics: Epoxy resins, Pressure, Silver, Sintering, Temperature, Reliability, Shear strength, Epoxy adhesives, Shear (Mechanics)

Journal Articles

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

J. Electron. Packag. December 2022, 144(4): 041012.

Paper No: EP-21-1136

DOI: https://doi.org/10.1115/1.4053365

Published Online: January 28, 2022

View Article

Topics: Damage, Density, Electric current, Inks, Nanoparticles, Reliability, Lasers, Diffusion (Physics), Atoms, Grain boundaries

Journal Articles

Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures

Pradeep Lall, Ved Soni, Scott Miller

J. Electron. Packag. June 2022, 144(2): 021112.

Paper No: EP-21-1058

DOI: https://doi.org/10.1115/1.4052750

Published Online: January 4, 2022

View Article

Topics: Batteries, Cycles, Lithium-ion batteries, Temperature, Regression models, Operating temperature, Reliability

2 3 4 5

Journal citation

NARROW

Supplemental Material

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Mandrel Bend Test of Screen-Printed Silver Conductors

Special Section on InterPACK2021

Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Module-Level Thermal Interface Material Degradation in HALT

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Electrothermal Analysis of System in Package for Aerospace Application

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only