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Journal Articles

Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

Kaifeng Chang, Yun-Ze Li, Weishu Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031011.
Paper No: EP-22-1097
https://doi.org/10.1115/1.4062108
Published Online: March 30, 2023
View Article titled, Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope
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Topics: Fibers, Heat, Satellites, Temperature, Temperature control, Thermoelectric coolers, Temperature controls
Journal Articles

Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets in Cold Climates

E. B. Zimmerman, H. Hegab, G. T. Colwell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 50–54.
https://doi.org/10.1115/1.2792661
Published Online: March 1, 1999
View Article titled, Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets in Cold Climates
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Topics: Axial flow, Cold climates, Computer simulation, Containers, Convection, Cooling, Cooling systems, Electronics, Fans, Flow (Dynamics)
Journal Articles

Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading

Yi-Hsin Pao, Ellen Eisele
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 164–172.
https://doi.org/10.1115/1.2905382
Published Online: June 1, 1991
View Article titled, Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading
Open the PDF for Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading in another window
Topics: Shear (Mechanics), Stress, Solder joints, Deflection, Differential equations, Dimensions, Materials properties, Shear stress, Temperature, Temperature controls
Journal Articles

Realistic Modeling of Edge Effect Stresses in Bimaterial Elements

J. W. Eischen, C. Chung, J. H. Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 16–23.
https://doi.org/10.1115/1.2904333
Published Online: March 1, 1990
View Article titled, Realistic Modeling of Edge Effect Stresses in Bimaterial Elements
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Topics: Modeling, Stress, Aluminum, Elasticity, Strength (Materials), Design, Eigenfunctions, Electronics, Finite element analysis, Shear (Mechanics)
Journal Articles

Deformation in Multilayer Stacked Assemblies

Tsung-Yu Pan, Yi-Hsin Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 30–34.
https://doi.org/10.1115/1.2904337
Published Online: March 1, 1990
View Article titled, Deformation in Multilayer Stacked Assemblies
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Topics: Deformation, Finite element analysis, Geometry, Manufacturing, Polynomials, Silicon, Solders, Stress, Temperature controls, Transistors