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Journal Articles

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Abel Misrak, Tushar Chauhan, Pavan Rajmane, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag. March 2020, 142(1): 011011.

Paper No: EP-19-1064

DOI: https://doi.org/10.1115/1.4045157

Published Online: November 8, 2019

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Topics: Fillers (Materials), Fourier transform infrared spectroscopy, Infrared spectroscopy, Mechanical properties, Stress, Temperature, Testing, Thermomechanics, High temperature, Reliability

Journal Articles

Mechanical Characterization of Thermal Interface Materials and Its Challenges

Vijay Subramanian, Jorge Sanchez, Joseph Bautista, Yi He, Jinlin Wang, Abhishek Das, Jesus Gerardo Reyes Schuldes, Kyle Yazzie, Hemanth K. Dhavaleswarapu, Pramod Malatkar

J. Electron. Packag. March 2019, 141(1): 010804.

Paper No: EP-18-1086

DOI: https://doi.org/10.1115/1.4042805

Published Online: March 13, 2019

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Topics: Adhesion, Compression, Shear (Mechanics), Temperature, Thermal expansion, Stress, Thermomechanics, Silicon

Journal Articles

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee, Wei Xu

J. Electron. Packag. December 2018, 140(4): 041005.

Paper No: EP-17-1072

DOI: https://doi.org/10.1115/1.4041064

Published Online: September 10, 2018

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Topics: Ball-Grid-Array packaging, Electromagnetic scattering, Materials properties, Radiation scattering, Scattering (Physics), Temperature, Thermal expansion, Warping, Simulation, Laminates

Journal Articles

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar

J. Electron. Packag. March 2015, 137(1): 010801.

Paper No: EP-14-1069

DOI: https://doi.org/10.1115/1.4028890

Published Online: November 14, 2014

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Topics: Cooling, Copper, Flat heat pipes, Fluids, Heat, Heat pipes, Silicon, Stress, Teams, Thermal conductivity

Journal Articles

Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics

Pradeep Lall, Aniket Shirgaokar, Dinesh Arunachalam

J. Electron. Packag. September 2012, 134(3): 031008.

DOI: https://doi.org/10.1115/1.4006863

Published Online: July 19, 2012

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Topics: Cycles, Eigenvalues, Electronics, Failure, Model development, Reliability, Solders, Temperature, Thermal expansion, Thermomechanics

Journal Articles

40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

Chu-Hsuan Sha, Chin C. Lee

J. Electron. Packag. September 2011, 133(3): 031012.

DOI: https://doi.org/10.1115/1.4004660

Published Online: September 30, 2011

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Topics: Bonding, Flip-chip, Silicon chips, Silver, Soldering, Thermal expansion, Pressure, Copper

Journal Articles

Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

Chu-Hsuan Sha, Chin C. Lee

J. Electron. Packag. June 2011, 133(2): 021003.

DOI: https://doi.org/10.1115/1.4003868

Published Online: June 22, 2011

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Topics: Bonding, Silicon chips, Pressure, Shear (Mechanics), Silicon, Thermal expansion, Low temperature, Temperature

Journal Articles

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

Z. Kornain, A. Jalar, R. Rasid, S. Abdullah

J. Electron. Packag. December 2010, 132(4): 041012.

DOI: https://doi.org/10.1115/1.4002741

Published Online: December 8, 2010

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Topics: Absorption, Adhesion, Flip-chip, Flip-chip devices, Fracture toughness, Packaging, Reliability, Shear (Mechanics), Temperature, Young's modulus

Journal Articles

Interactions Between Flip Chip Underfill and Solder Alloy

D. Blass, P. Borgesen

J. Electron. Packag. September 2010, 132(3): 031008.

DOI: https://doi.org/10.1115/1.4002010

Published Online: September 9, 2010

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Topics: Alloys, Flip-chip, Flip-chip devices, Solders, Thermal shock, Thermal expansion, Testing, Adhesion, Reliability, Cycles

Journal Articles

Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices

H. A. Mustain, William D. Brown, Simon S. Ang

J. Electron. Packag. September 2009, 131(3): 034502.

DOI: https://doi.org/10.1115/1.3153582

Published Online: July 14, 2009

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Topics: Copper, Diffusion (Physics), Silicon, Silicon nitride ceramics, Tungsten, Annealing, High temperature, Metals, Temperature, Electron spectroscopy

Journal Articles

Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis

Guojun Hu, Jing-En Luan, Spencer Chew

J. Electron. Packag. March 2009, 131(1): 011010.

DOI: https://doi.org/10.1115/1.3068321

Published Online: February 13, 2009

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Topics: Epoxy resins, Finite element analysis, Molding, Shrinkage (Materials), Warping, Thermal expansion, Temperature, Fillers (Materials)

Journal Articles

Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer

M. A. Neidigk, Y.-L. Shen

J. Electron. Packag. March 2009, 131(1): 011003.

DOI: https://doi.org/10.1115/1.3068298

Published Online: February 11, 2009

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Topics: Ceramics, Coating processes, Coatings, Computer simulation, Cooling, Epoxy resins, Failure, Ferrites (Magnetic materials), Finite element analysis, Manufacturing

Journal Articles

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung

J. Electron. Packag. December 2008, 130(4): 041004.

DOI: https://doi.org/10.1115/1.2993146

Published Online: November 17, 2008

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Topics: Ball-Grid-Array packages, Ceramics, Computational fluid dynamics, Deformation, Finite element analysis, Flip-chip devices, Interferometry, Manufacturing, Reliability, Solder joints

Journal Articles

Direct Silver to Copper Bonding Process

Pin J. Wang, Jong S. Kim, Chin C. Lee

J. Electron. Packag. December 2008, 130(4): 045001.

DOI: https://doi.org/10.1115/1.2993144

Published Online: November 14, 2008

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Topics: Bonding, Copper, Silver, Electronic packaging, Thermal expansion, Stress, Scanning electron microscopy

Journal Articles

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Samson Yoon, Changsoo Jang, Bongtae Han

J. Electron. Packag. June 2008, 130(2): 024502.

DOI: https://doi.org/10.1115/1.2912181

Published Online: May 14, 2008

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Topics: Diffusion (Physics), Finite element analysis, Heat transfer, Modeling, Semiconductors (Materials), Stress, Stress analysis (Engineering), Temperature, Deformation, Thermal expansion

Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue

J. Electron. Packag. June 2008, 130(2): 021008.

DOI: https://doi.org/10.1115/1.2912188

Published Online: May 9, 2008

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Topics: Damage, Failure, Failure mechanisms, Flip-chip devices, High cycle fatigue, Power density, Solders, Stress, Thermal expansion, Wave motion

Journal Articles

Shorter Field Life in Power Cycling for Organic Packages

S. B. Park, Izhar Z. Ahmed

J. Electron. Packag. March 2007, 129(1): 28–34.

DOI: https://doi.org/10.1115/1.2429706

Published Online: May 1, 2006

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Topics: Computational fluid dynamics, Finite element analysis, Flip-chip devices, Manufacturing, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Structural analysis, Cycles

Journal Articles

Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability

John G. Bai, Jesus N. Calata, Guo-Quan Lu

J. Electron. Packag. September 2006, 128(3): 208–214.

DOI: https://doi.org/10.1115/1.2229218

Published Online: August 26, 2005

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Topics: Cooling, Finite element analysis, Reliability, Solders, Temperature, Stress, Thermomechanics, Thermal expansion

Journal Articles

Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials

Slawomir Rubinsztajn, Donald Buckley, John Campbell, David Esler, Eric Fiveland, Ananth Prabhakumar, Donna Sherman, Sandeep Tonapi

J. Electron. Packag. June 2005, 127(2): 77–85.

DOI: https://doi.org/10.1115/1.1846067

Published Online: June 3, 2005

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Topics: Fillers (Materials), Flip-chip devices, Flow (Dynamics), Reliability, Resins, Semiconductor wafers, Flip-chip, Thermal expansion, Epoxy resins, Solder joints

Journal Articles

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Tong Hong Wang, Yi-Shao Lai, Jenq-Dah Wu

J. Electron. Packag. December 2004, 126(4): 560–564.

DOI: https://doi.org/10.1115/1.1827271

Published Online: January 24, 2005

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Topics: Ball-Grid-Array packaging, Creep, Fatigue, Flip-chip, Materials properties, Reliability, Solders, Thermomechanics, Shear (Mechanics), Finite element analysis

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Journal citation

NARROW

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Mechanical Characterization of Thermal Interface Materials and Its Challenges

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics

40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

Interactions Between Flip Chip Underfill and Solder Alloy

Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices

Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis

Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

Direct Silver to Copper Bonding Process

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

Shorter Field Life in Power Cycling for Organic Packages

Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability

Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

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