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Journal Articles

Coupled Electrical-Thermal-Fluidic Multi-Physics Analysis Of TSV Pin Fin Microchannel In The 3D-Ic

Accepted Manuscript
Ping Sun, Bing-Huan Huang, Kui Li, Liang Gong, Chuan-Yong Zhu, Ying Zheng
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1080
DOI: https://doi.org/10.1115/1.4062531
Published Online: May 15, 2023
View Article titled, Coupled Electrical-Thermal-Fluidic Multi-Physics Analysis Of TSV Pin Fin Microchannel In The 3D-Ic
Click here to open pdf in another window PDF for Coupled Electrical-Thermal-Fluidic Multi-Physics Analysis Of TSV Pin Fin Microchannel In The 3D-Ic
Topics: Microchannels, Physics, Flow (Dynamics), Fins, Heat transfer, Circuits, Diamonds, Heat, Integrated circuits, Shapes
Journal Articles

Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module

Accepted Manuscript
Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, Kenneth Goodson
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1093
DOI: https://doi.org/10.1115/1.4062384
Published Online: April 21, 2023
View Article titled, Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module
Click here to open pdf in another window PDF for Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module
Topics: Copper, Heat sinks, Manifolds, Microchannels, Bonding, Computer simulation, Heat, Lasers, Power density, Pressure drop
Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
DOI: https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
View Article titled, Special Section on InterPACK2021
Click here to open pdf in another window PDF for Special Section on InterPACK2021
Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Journal Articles

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Paul Paret, Donal Finegan, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034501.
Paper No: EP-22-1053
DOI: https://doi.org/10.1115/1.4056306
Published Online: December 9, 2022
View Article titled, Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
Click here to open pdf in another window PDF for Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
Topics: Artificial intelligence, Design, Electric vehicles, Electronics, Thermal management, Semiconductor devices, Reliability, Manufacturing, Semiconductors (Materials)
Journal Articles

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Joshua Kasitz, Aniket Ajay Lad, Muhammad Jahidul Hoque, Nenad Miljkovic, David Huitink
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011101.
Paper No: EP-22-1023
DOI: https://doi.org/10.1115/1.4055464
Published Online: September 27, 2022
View Article titled, Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft
Click here to open pdf in another window PDF for Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft
Topics: Aircraft, Cooling, Cooling systems, Flight, Heat exchangers, Stress, Temperature, Thermal management, Transients (Dynamics), Motors
Journal Articles

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Shuv Dey, Luis Diego Monge Jimenez, J. Michael Brown, Yogendra Joshi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021004.
Paper No: EP-22-1038
DOI: https://doi.org/10.1115/1.4055094
Published Online: August 18, 2022
View Article titled, Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
Click here to open pdf in another window PDF for Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
Topics: Climate, Design, Solar energy, Temperature, Thermal management, Transients (Dynamics), Solar radiation, Smart cities, Computer simulation, Cycles
Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. June 2022, 144(2): 020301.
Paper No: EP-21-1158
DOI: https://doi.org/10.1115/1.4053122
Published Online: January 4, 2022
View Article titled, Special Issue on InterPACK2020
Click here to open pdf in another window PDF for Special Issue on InterPACK2020
Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
DOI: https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Article titled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
Click here to open pdf in another window PDF for Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Justin Hollis, Darin J. Sharar, Todd Bandhauer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041111.
Paper No: EP-21-1103
DOI: https://doi.org/10.1115/1.4052669
Published Online: November 5, 2021
View Article titled, Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages
Click here to open pdf in another window PDF for Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages
Topics: Copper, Cycles, Junctions, Phase change materials, Temperature, Heat, Composite materials, Transients (Dynamics), Thermal management, Cities
Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
DOI: https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
View Article titled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
Click here to open pdf in another window PDF for A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Gilberto Moreno, Sreekant Narumanchi, Xuhui Feng, Paul Anschel, Steve Myers, Phil Keller
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011004.
Paper No: EP-20-1093
DOI: https://doi.org/10.1115/1.4049815
Published Online: August 6, 2021
View Article titled, Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
Click here to open pdf in another window PDF for Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
Topics: Cooling, Electronics, Fluids, Heat exchangers, Heat transfer, Thermal management, Thermal resistance, Vehicles, Heat, Temperature
Journal Articles

A Review on Transient Thermal Management of Electronic Devices

John Mathew, Shankar Krishnan
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010801.
Paper No: EP-20-1113
DOI: https://doi.org/10.1115/1.4050002
Published Online: August 6, 2021
View Article titled, A Review on Transient Thermal Management of Electronic Devices
Click here to open pdf in another window PDF for A Review on Transient Thermal Management of Electronic Devices
Topics: Cooling, Heat, Heat pipes, Phase change materials, Temperature, Thermal management, Transients (Dynamics), Vapors, Boiling, Steady state
Journal Articles

Modular Heat Sinks for Enhanced Thermal Management of Electronics

Muhammad Jahidul Hoque, Alperen Günay, Andrew Stillwell, Yashraj Gurumukhi, Robert C. N. Pilawa-Podgurski, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020903.
Paper No: EP-20-1081
DOI: https://doi.org/10.1115/1.4049294
Published Online: February 22, 2021
View Article titled, Modular Heat Sinks for Enhanced Thermal Management of Electronics
Click here to open pdf in another window PDF for Modular Heat Sinks for Enhanced Thermal Management of Electronics
Topics: Electronics, Gallium nitride, Heat sinks, Thermal management, Power density, Design, Temperature, Power converters, Manufacturing
Journal Articles

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Reece Whitt, Skyler Hudson, David Huitink, Zhao Yuan, Asif Emon, Fang Luo
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041004.
Paper No: EP-20-1034
DOI: https://doi.org/10.1115/1.4048493
Published Online: October 12, 2020
View Article titled, Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization
Click here to open pdf in another window PDF for Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization
Topics: Additive manufacturing, Coolants, Cooling, Design, Electromagnetic interference, Flat heat pipes, Flow (Dynamics), Fluids, Heat, Heat transfer
Journal Articles

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. March 2021, 143(1): 010801.
Paper No: EP-20-1051
DOI: https://doi.org/10.1115/1.4047414
Published Online: June 29, 2020
View Article titled, Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
Click here to open pdf in another window PDF for Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
Topics: Heat, Metamaterials, Thermal management, Cooling, Temperature, Thermal conductivity, Electronic packaging, Design, Packaging, Anisotropy
Journal Articles

A System to Package Perspective on Transient Thermal Management of Electronics

H. Peter de Bock, David Huitink, Patrick Shamberger, James Spencer Lundh, Sukwon Choi, Nicholas Niedbalski, Lauren Boteler
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041111.
Paper No: EP-20-1028
DOI: https://doi.org/10.1115/1.4047474
Published Online: June 29, 2020
View Article titled, A System to Package Perspective on Transient Thermal Management of Electronics
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Topics: Transients (Dynamics), Thermal management, Design, Phase change materials, Temperature, Heat
Journal Articles

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, David Huitink
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041108.
Paper No: EP-20-1019
DOI: https://doi.org/10.1115/1.4047497
Published Online: June 26, 2020
View Article titled, System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
Click here to open pdf in another window PDF for System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
Topics: Cooling, Electronics, Heat, Phase change materials, Reliability, Temperature, Thermal management, Heat sinks, Design, Convection
Journal Articles

Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

A. Bar-Cohen, J. J. Maurer, D. H. Altman
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040803.
Paper No: EP-18-1067
DOI: https://doi.org/10.1115/1.4043404
Published Online: July 30, 2019
View Article titled, Embedded Cooling for Wide Bandgap Power Amplifiers: A Review
Click here to open pdf in another window PDF for Embedded Cooling for Wide Bandgap Power Amplifiers: A Review
Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Transistors, Thermal conductivity, Temperature, Junctions, Heat, Thermal management
Journal Articles

Special Issue on InterPACK 2018

Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. September 2019, 141(3): 030301.
Paper No: EP-19-1036
DOI: https://doi.org/10.1115/1.4043484
Published Online: May 8, 2019
View Article titled, Special Issue on InterPACK 2018
Click here to open pdf in another window PDF for Special Issue on InterPACK 2018
Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers
Journal Articles

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. June 2019, 141(2): 020801.
Paper No: EP-18-1026
DOI: https://doi.org/10.1115/1.4041813
Published Online: February 25, 2019
View Article titled, Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications
Click here to open pdf in another window PDF for Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications
Topics: Energy gap, Gallium nitride, Light-emitting diodes, Photonic equipment, Semiconductors (Materials), Temperature, Temperature measurement, Thermal management, Thermography, Automotive industry