1-19 of 19
Additional Technical Papers
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry

Suk-Jin Ham, Soon-Bok Lee, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 282–288.
https://doi.org/10.1115/1.1571571
Published Online: June 10, 2003
View Article titled, Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry
Open the PDF for Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry in another window
Topics: Creep, Deformation, Finite element analysis, Interferometry, Manufacturing, Relaxation (Physics), Semiconductor wafers, Shear (Mechanics), Solders, Temperature
Journal Articles

Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications

Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 294–301.
https://doi.org/10.1115/1.1571076
Published Online: June 10, 2003
View Article titled, Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications
Open the PDF for Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications in another window
Topics: Failure, Failure analysis, Microwaves, Proton exchange membranes, Radiation (Physics), Stress, Delamination, Heating, Leakage, Electronic packaging
Journal Articles

Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance

Hung-Lung Lee, Shyang-Jye Chang, Sheng-Jye Hwang, Associate Professor,, Francis Su, S. K. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 268–275.
https://doi.org/10.1115/1.1569957
Published Online: June 10, 2003
View Article titled, Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance
Open the PDF for Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance in another window
Topics: Computer-aided design, Design, Design methodology, Flow (Dynamics), Taguchi methods, Noise factors, Molding, Packaging, Simulation, Manufacturing
Journal Articles

Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications

Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal, Z. Fathi, I. Ahmad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 302–307.
https://doi.org/10.1115/1.1571077
Published Online: June 10, 2003
View Article titled, Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications
Open the PDF for Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications in another window
Topics: Convection, Delamination, Fillers (Materials), Flip-chip, Microwaves, Ovens, Particulate matter
Journal Articles

Calibrate Piezoresistive Stress Sensors Through the Assembled Structure

Ben-Je Lwo, Mem. ASME, Shen-Yu Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 289–293.
https://doi.org/10.1115/1.1572904
Published Online: June 10, 2003
View Article titled, Calibrate Piezoresistive Stress Sensors Through the Assembled Structure
Open the PDF for Calibrate Piezoresistive Stress Sensors Through the Assembled Structure in another window
Topics: Calibration, Sensors, Stress, Temperature
Journal Articles

Choosing Working Fluid for Two-Phase Thermosyphon Systems for Cooling of Electronics

Bjo¨rn Palm, Mem. ASME, Rahmatollah Khodabandeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 276–281.
https://doi.org/10.1115/1.1571570
Published Online: June 10, 2003
View Article titled, Choosing Working Fluid for Two-Phase Thermosyphon Systems for Cooling of Electronics
Open the PDF for Choosing Working Fluid for Two-Phase Thermosyphon Systems for Cooling of Electronics in another window
Topics: Boiling, Cooling, Fluids, Pressure drop, Heat transfer, Temperature, Heat, Condensation
Journal Articles

Corrosion Analysis of a Fiber-Optic Transceiver Housing

J. H. Lau, Fellow ASME, C. L. Jiaa, S. J. Erasmus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 379–384.
https://doi.org/10.1115/1.1510862
Published Online: December 12, 2002
View Article titled, Corrosion Analysis of a Fiber-Optic Transceiver Housing
Open the PDF for Corrosion Analysis of a Fiber-Optic Transceiver Housing in another window
Topics: Corrosion, Fibers, Weight (Mass)
Journal Articles

Transient Thermal Management of a Handset Using Phase Change Material (PCM)

Marc Hodes, Randy D. Weinstein, Stephen J. Pence, Jason M. Piccini, Lou Manzione, Calvin Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 419–426.
https://doi.org/10.1115/1.1523061
Published Online: December 12, 2002
View Article titled, Transient Thermal Management of a Handset Using Phase Change Material (PCM)
Open the PDF for Transient Thermal Management of a Handset Using Phase Change Material (PCM) in another window
Topics: Heat transfer, Natural convection, Phase change materials, Steady state, Temperature, Thermal management, Transients (Dynamics), Radiation (Physics), Thermocouples, Heat
Journal Articles

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

J. Lau, Fellow ASME, Z. Mei, S. Pang, C. Amsden, J. Rayner, S. Pan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 403–410.
https://doi.org/10.1115/1.1512294
Published Online: December 12, 2002
View Article titled, Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch
Open the PDF for Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch in another window
Topics: Creep, Fatigue, Fatigue testing, Sealing (Process), Solders, Stress, Switches, Density, Cycles, Finite element analysis
Journal Articles

Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints

Ki-Ju Kang, Seon-Ho Choi, Tae-Sung Bae
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 385–390.
https://doi.org/10.1115/1.1510863
Published Online: December 12, 2002
View Article titled, Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints
Open the PDF for Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints in another window
Topics: Fatigue cracks, Fracture (Materials), Solder joints, Solders, Stress, Fatigue testing, Intermetallic compounds
Journal Articles

Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

C. W. Tang, Y. C. Chan, K. C. Hung, P. L. Tu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 397–402.
https://doi.org/10.1115/1.1510865
Published Online: December 12, 2002
View Article titled, Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies
Open the PDF for Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies in another window
Topics: Flip-chip devices, Flow (Dynamics), Shear strength, Tin, Heating, Flip-chip assemblies, Hardening (Curing), Solders, Manufacturing, Strength (Materials)
Journal Articles

Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications

Mudasir Ahmad, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 411–418.
https://doi.org/10.1115/1.1512296
Published Online: December 12, 2002
View Article titled, Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications
Open the PDF for Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications in another window
Topics: Springs, Stress
Journal Articles

An Analytical Cure Model for Underfill Epoxies

R. L. Mahajan, Fellow ASME, C. P. Malhotra, R. K. Sharma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 391–396.
https://doi.org/10.1115/1.1510864
Published Online: December 12, 2002
View Article titled, An Analytical Cure Model for Underfill Epoxies
Open the PDF for An Analytical Cure Model for Underfill Epoxies in another window
Topics: Epoxy adhesives, Epoxy resins, Hardening (Curing), Heating, Heat transfer coefficients, Temperature
Journal Articles

Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept

Dagmar Beyerlein, Lee E. Hornberger
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 366–371.
https://doi.org/10.1115/1.1388562
Published Online: February 6, 2001
View Article titled, Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept
Open the PDF for Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept in another window
Topics: Cavities, Design, Flow (Dynamics), Molding, Resins, Simulation, Wire, Deformation, Computer software, Gates (Closures)
Journal Articles

Displacement Theory for Fixturing Design of Thin Flexible Circuit Board Assembly

Ruijun Chen, Assoc. Mem. ASME, Daniel F. Baldwin, Assoc. Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 388–393.
https://doi.org/10.1115/1.1371926
Published Online: November 1, 2000
View Article titled, Displacement Theory for Fixturing Design of Thin Flexible Circuit Board Assembly
Open the PDF for Displacement Theory for Fixturing Design of Thin Flexible Circuit Board Assembly in another window
Topics: Displacement, Fixturing, Manufacturing, Deflection, Stress, Plate theory
Journal Articles

Thermal Math Modeling and Analysis of an Electronic Assembly

K. N. Shukla
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 372–378.
https://doi.org/10.1115/1.1388561
Published Online: May 5, 2000
View Article titled, Thermal Math Modeling and Analysis of an Electronic Assembly
Open the PDF for Thermal Math Modeling and Analysis of an Electronic Assembly in another window
Topics: Finite element methods, Heat, Heat transfer coefficients, Manufacturing, Mathematics, Modeling, Temperature, Temperature distribution, Thermal analysis, Printed circuit boards
Journal Articles

Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder

V. Stolkarts, L. M. Keer, ASME Fellow, M. E. Fine
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 351–355.
https://doi.org/10.1115/1.1407825
Published Online: February 23, 2000
View Article titled, Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder
Open the PDF for Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder in another window
Topics: Cycles, Damage, Solders, Temperature, Fatigue, Simulation, Constitutive equations
Journal Articles

Experimental Evaluation of Air-Cooling Electronics at High Altitudes

Henry Wong, Robert E. Peck
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 356–365.
https://doi.org/10.1115/1.1392319
Published Online: December 20, 1999
View Article titled, Experimental Evaluation of Air-Cooling Electronics at High Altitudes
Open the PDF for Experimental Evaluation of Air-Cooling Electronics at High Altitudes in another window
Topics: Convection, Cooling, Flow (Dynamics), Heat transfer coefficients, Seas, Temperature, Wakes, Heating, Design, Wind tunnels
Journal Articles

Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling

Katsuhiko Sasaki, Associate Professor,, Ken-ichi Ohguchi, Research Associate,, Hiromasa Ishikawa, Mem. ASME, Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 379–387.
https://doi.org/10.1115/1.1371927
Published Online: August 24, 1999
View Article titled, Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling
Open the PDF for Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling in another window
Topics: Alloys, Compression, Constitutive equations, Creep, Deformation, Simulation, Solders, Stress, Temperature, Tension